Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/2012
03/29/2012DE102011053107A1 Halbleiterstruktur und Verfahren zu deren Herstellung Semiconductor structure and process for their preparation
03/29/2012DE102010046966A1 Baustein, Verfahren zur Herstellung eines Bausteins und Vorrichtung zur Laser-Ablation Module, process for manufacturing a device and apparatus for laser ablating
03/29/2012DE102010046963A1 Multi-Chip Package Multi-Chip Package
03/29/2012DE102010042567B3 Verfahren zum Herstellen eines Chip-Package und Chip-Package A method of manufacturing a chip package and chip package
03/29/2012DE102010041261A1 Flip-Chip Anordnung mit einem Kühlelement und Verfahren zur Herstellung einer Flip-Chip Anordnung Flip-chip assembly with a cooling element and method for manufacturing a flip-chip arrangement
03/29/2012DE102009055368A1 Siliziumbasiertes Halbleiterbauelement mit E-Sicherungen, die durch eine eingebettete Halbleiterlegierung hergestellt sind Silicon-based semiconductor device with E-fuses that are made by an embedded semiconductor alloy
03/29/2012DE102009015718B4 Testsystem und Verfahren zum Verringern der Schäden in Saatschichten in Metallisierungssystemen von Halbleiterbauelementen Test system and method for reducing the damage to seed layers in metallization of semiconductor components
03/29/2012DE102007041926B4 Verfahren zur elektrischen Isolierung beziehungsweise elektrischen Kontaktierung von ungehäusten elektronischen Bauelementen bei strukturierter Verkapselung Method for electrical insulation or electrical contact of bare electronic components in a structured encapsulation
03/29/2012DE102005045767B4 Verfahren zur Herstellung eines Halbleiterbauteils mit Kunststoffgehäusemasse A method for manufacturing a semiconductor device with plastic housing composition
03/28/2012EP2434857A1 Display with heat spreader
03/28/2012EP2434544A1 Integrated circuit
03/28/2012EP2434543A1 Heat exchanger and method of manufacturing the same
03/28/2012EP2434542A2 Heat dissipation device with multiple heat conducting pipes
03/28/2012EP2434541A1 Method for bonding high heat conductive insulating resin
03/28/2012EP2434539A2 System and method of chip package build-up
03/28/2012EP2434246A1 Heat-exchange device, in particular for a car
03/28/2012EP2433480A1 Heat spreading device and method therefore
03/28/2012EP2433303A1 Structure and method of forming electrically blown metal fuses for integrated circuits
03/28/2012EP2291858B1 Packaged semiconductor product and method for manufacture thereof
03/28/2012EP1941541B1 Redistribution layer for wafer-level chip scale package and method therefor
03/28/2012EP1605559B1 Socket for electric component
03/28/2012CN202178257U 一种oled显示器件及其封装结构 One kind oled display device and package structure
03/28/2012CN202178252U Multi-loop arranged carrier-free double-IC chip packaging part
03/28/2012CN202178251U 一种铜线芯片封装结构 One kind of the chip package structure of copper
03/28/2012CN202178250U 一种大功率芯片的封装结构 Package structure for a high-power chips
03/28/2012CN202178249U 用于水循环冷却的辅助供气装置 Secondary air supply apparatus for cooling water circulation
03/28/2012CN202178248U Cpu散热器安装架 Cpu radiator mount
03/28/2012CN202178247U Radiating structure for insulated gate bipolar transistor (IGBT) and bridge rectifier of induction cooker
03/28/2012CN202178246U 一种用于功率器件的散热器 A power device for radiators
03/28/2012CN202178245U 提高散热速度的散热器 Improve the cooling rate of the radiator
03/28/2012CN1956171B Methods of forming non-volatile memory devices and devices formed thereby
03/28/2012CN1747099B Semiconductor device
03/28/2012CN102396302A Graphite sheet and heat transfer structure using same
03/28/2012CN102396156A Termination circuit for on-die termination
03/28/2012CN102395712A A process for electroplating of copper
03/28/2012CN102395540A Sintered ceramic and substrate comprising same for semiconductor device
03/28/2012CN102394234A Alignment mark manufacturing method used for exposure technology
03/28/2012CN102394233A Wiring device and display
03/28/2012CN102394232A Lead frame and chip flipping packaging device applying lead frame
03/28/2012CN102394231A Chip connecting structure used for liquid crystal display
03/28/2012CN102394230A Multi-start spiral flow channel liquid cooler used for heat radiation of electronic component
03/28/2012CN102394229A Plate radiator
03/28/2012CN102393607A Positive photosensitive resin composition, and semiconductor device and display using same
03/28/2012CN102392280A Full-automatic electroplating production line for semi-conductor lead frames
03/28/2012CN102391822A Adhesive, adhesive for connecting circuit, connecting body and semiconductor device
03/28/2012CN102044457B Method for manufacturing metal bonding pad and corresponding metal bonding pad structure
03/28/2012CN102034783B Seven-pin lead frame
03/28/2012CN102005432B Packaging structure with four pin-less sides and packaging method thereof
03/28/2012CN101930947B CMOS (Complementary Metal-Oxide-Semiconductor) transistor and making method thereof
03/28/2012CN101924108B Semiconductor memory device and production method therefor
03/28/2012CN101882587B Structure for achieving wire bonding and packaging and production method thereof
03/28/2012CN101877332B Novel plate pressure welding type multichip packaging ceramic package
03/28/2012CN101872054B Lens module and camera module applying same
03/28/2012CN101807511B method for horizontal chip-level package of laser marking wafer
03/28/2012CN101794741B 散热装置及功率模块 Cooling devices and power modules
03/28/2012CN101770962B Structures and methods for improving solder bump connections in semiconductor devices
03/28/2012CN101728469B Light-emitting diode and grain thereof
03/28/2012CN101667550B Method for monitoring metal layer on gate structure
03/28/2012CN101662892B Ultra-thin copper foil with carrier, method for producing ultra-thin copper foil with carrier and printed circuit board
03/28/2012CN101599478B Contact hole arrangement structure
03/28/2012CN101553910B Sealing material and mounting method using the sealing material
03/28/2012CN101521196B Light-emitting diode (LED) and method for preparing LED and base of LED
03/28/2012CN101449362B Method of increasing the quality factor of an inductor in a semiconductor device
03/28/2012CN101436569B Method of manufacturing thin film transistor array substrate and display device
03/28/2012CN101436092B Display card heat radiation combination and blade point type server using the same
03/28/2012CN101378040B 半导体装置 Semiconductor device
03/28/2012CN101378015B Group III nitride semiconductor and a manufacturing method thereof
03/28/2012CN101350332B Ultra thin wafers having an edge support ring and manufacture method thereof
03/28/2012CN101346815B Microelectronic machine and method for manufacturing same
03/28/2012CN101276812B Capacitor structure
03/28/2012CN101272673B Component package with heat converter
03/28/2012CN101252099B Temperature circulating test device and heating chip upside-down mounting encapsulation structure using the temperature circulating test device
03/28/2012CN101231994B Circuit component
03/28/2012CN101202254B Semiconductor device and method for manufacturing the same
03/28/2012CN101170099B Multicrystalline silicon compounds electric fuse silk part
03/28/2012CN101107709B Electronic component protected against the attacks and its manufacture method
03/27/2012US8144459 Heat dissipating system with fan module
03/27/2012US8144227 Image pickup device and image pickup result outputting method
03/27/2012US8143782 Organic light emitting display
03/27/2012US8143731 Integrated alignment and overlay mark
03/27/2012US8143730 Semiconductor device and method of manufacturing the same
03/27/2012US8143729 Autoclave capable chip-scale package
03/27/2012US8143728 Electronic board and manufacturing method thereof, electro-optical device, and electronic apparatus
03/27/2012US8143727 Adhesive on wire stacked semiconductor package
03/27/2012US8143726 Semiconductor device and method of making semiconductor device
03/27/2012US8143724 Standard cell and semiconductor device including the same
03/27/2012US8143723 Highly integrated and reliable DRAM and its manufacture
03/27/2012US8143722 Wafer-level interconnect for high mechanical reliability applications
03/27/2012US8143721 Package substrate dynamic pressure structure
03/27/2012US8143720 Semiconductor module with micro-buffers
03/27/2012US8143719 Vented die and package
03/27/2012US8143718 Semiconductor device having stress relaxation sections
03/27/2012US8143717 Surface mount package with ceramic sidewalls
03/27/2012US8143716 Semiconductor device with plate-shaped component
03/27/2012US8143715 Semiconductor package transformer
03/27/2012US8143714 Integrated circuit and method for producing the same
03/27/2012US8143713 Chip-on-board package
03/27/2012US8143712 Die package structure
03/27/2012US8143711 Integrated circuit package system with offset stacking and anti-flash structure
03/27/2012US8143710 Wafer-level chip-on-chip package, package on package, and methods of manufacturing the same
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