Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
04/2012
04/04/2012CN102403275A Package on package structure and fabricating method for same
04/04/2012CN102403268A Methods for filling a contact hole in a chip package arrangement and chip package arrangements
04/04/2012CN102403267A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
04/04/2012CN102403261A 半导体器件及其制作方法 Semiconductor device and manufacturing method thereof
04/04/2012CN102403256A Buried layer and manufacturing method, long hole contact and triode
04/04/2012CN102403246A 检测掩模板污染的方法 Detecting contamination of mask
04/04/2012CN102403243A Method for reducing UBM undercut in metal bump structures
04/04/2012CN102403239A Semiconductor device and method of forming bond-on-lead interconnection for mounting semiconductor die in fo-wlcsp
04/04/2012CN102403236A 芯片外露的半导体器件及其生产方法 Chip semiconductor device and a method of producing the exposed
04/04/2012CN102403232A Process for total dose radiation hardening of factory region
04/04/2012CN102402709A Memory card package structure and method for fabricating the same
04/04/2012CN102399526A Adhesive composition, circuit connection structure, semiconductor device, and solar cell module
04/04/2012CN102399446A 加成固化型硅组合物、光学元件密封材料及半导体装置 Addition curing type silicone composition, a sealing material for a semiconductor optical element means
04/04/2012CN101882612B 静电保护装置 Electrostatic protection device
04/04/2012CN101874299B Ceramic substrate having thermal via
04/04/2012CN101848602B Multi-layer printed board
04/04/2012CN101840894B Semiconductor device
04/04/2012CN101826547B 有源矩阵有机发光二极管像素结构及其制造方法 The active matrix organic light emitting diode pixel structure and its manufacturing method
04/04/2012CN101819964B Integrated circuit mounted board, printed wiring board, and method of manufacturing integrated circuit mounted board
04/04/2012CN101807585B Tft-lcd阵列基板及其制造方法 Tft-lcd array substrate and a method of manufacturing
04/04/2012CN101794758B Semiconductor device
04/04/2012CN101740553B Cooling channels in 3dic stacks
04/04/2012CN101667549B Device and method for encapsulating with encapsulating material and electronic component fixed on a carrier
04/04/2012CN101660696B 一种大功率led广场照明灯 One kind of power led square lights
04/04/2012CN101656254B 动态随机存取内存结构及其制造方法 Dynamic random access memory structure and its manufacturing method
04/04/2012CN101593737B Seal ring structure for integrated circuits
04/04/2012CN101582403B Semiconductor package featuring flip-chip die sandwiched between metal layers
04/04/2012CN101577269B Bonding pad sharing method applied to multi-chip module and apparatus thereof
04/04/2012CN101540302B Sheet structure and method of manufacturing sheet structure
04/04/2012CN101534069B Electric power conversion apparatus
04/04/2012CN101533798B 静电吸盘 Electrostatic chuck
04/04/2012CN101520580B TFT-LCD array substrate structure and manufacturing method thereof
04/04/2012CN101436585B Power semiconductor module having a substrate and a pressure device
04/04/2012CN101378047B Interconnection structure
04/04/2012CN101373736B Interconnect, interconnect forming method, thin film transistor, and display device
04/04/2012CN101339924B 半导体器件 Semiconductor devices
04/04/2012CN101315963B 半导体发光装置 The semiconductor light emitting device
04/04/2012CN101192637B 发光二极管元件 Light-emitting diode element
04/04/2012CN101145426B 电感元件和集成电子组件 Inductance element and an integrated electronic component
04/04/2012CN101034681B 半导体器件的制造方法 The method of manufacturing a semiconductor device
04/03/2012US8151238 Semiconductor integrated circuit and design method thereof
04/03/2012US8149574 Cooling fan housing assembly
04/03/2012US8149498 Package structure of a flexible display device
04/03/2012US8148831 Latent catalyst for epoxy resin, epoxy resin composition, and semiconductor device
04/03/2012US8148830 Environmental protection coating system and method
04/03/2012US8148829 Self repairing IC package design
04/03/2012US8148828 Semiconductor packaging device
04/03/2012US8148827 Quad flat no lead (QFN) package
04/03/2012US8148826 Three-dimensional integrated circuits with protection layers
04/03/2012US8148825 Integrated circuit package system with leadfinger
04/03/2012US8148824 Semiconductor device with through substrate via
04/03/2012US8148823 Low loss package for electronic device
04/03/2012US8148822 Bonding pad on IC substrate and method for making the same
04/03/2012US8148820 Formed product of line-structured substance composed of carbon element, and method of forming the same
04/03/2012US8148819 Semiconductor device, method for mounting semiconductor device, and mounting structure of semiconductor device
04/03/2012US8148818 Semiconductor device and method for manufacturing the same
04/03/2012US8148817 Multi-die DC-DC buck power converter with efficient packaging
04/03/2012US8148816 Semiconductor device
04/03/2012US8148815 Stacked field effect transistor configurations
04/03/2012US8148814 Semiconductor integrated circuit device comprising a plurality of semiconductor chips mounted to stack for transmitting a signal between the semiconductor chips
04/03/2012US8148813 Integrated circuit package architecture
04/03/2012US8148812 Thermal resistor, semiconductor device using the same, and electric device
04/03/2012US8148811 Semiconductor device and manufacturing method thereof
04/03/2012US8148810 Semiconductor device, and inspection method thereof
04/03/2012US8148809 Semiconductor device, method for manufacturing the same, and multilayer substrate having the same
04/03/2012US8148808 Partitioning of electronic packages
04/03/2012US8148807 Packaged microelectronic devices and associated systems
04/03/2012US8148806 Multiple chips bonded to packaging structure with low noise and multiple selectable functions
04/03/2012US8148805 Forming compliant contact pads for semiconductor packages
04/03/2012US8148804 Wiring device for semiconductor device, composite wiring device for semiconductor device, and resin-sealed semiconductor device
04/03/2012US8148803 Molded stiffener for thin substrates
04/03/2012US8148802 Passivation of aluminum nitride substrates
04/03/2012US8148798 Semiconductor device and method for manufacturing the same
04/03/2012US8148797 Chip pad resistant to antenna effect and method
04/03/2012US8148782 Semiconductor device with ESD protection function and ESD protection circuit
04/03/2012US8148770 Memory device with buried bit line structure
04/03/2012US8148756 Separative extended gate field effect transistor based uric acid sensing device, system and method for forming thereof
04/03/2012US8148747 Semiconductor chip assembly with post/base/cap heat spreader
04/03/2012US8148648 Combination extruded and cast metal outdoor electronics enclosure
04/03/2012US8148263 Methods for forming conductive vias in semiconductor device components
04/03/2012US8148239 Offset field grid for efficient wafer layout
04/03/2012US8148208 Integrated circuit package system with leaded package and method for manufacturing thereof
04/03/2012US8148205 Method of electrically connecting a microelectronic component
04/03/2012US8148202 Integrated circuit chip with smart pixels that supports through-chip electromagnetic communication
04/03/2012US8148199 Method of electrically connecting a microelectronic component
04/03/2012US8148187 Method for manufacturing a micromechanical component having a volume-elastic medium and micromechanical component
04/03/2012US8147908 Increased throughput for large-scale production of low melt organoamine stabilized silver nano-particles
04/03/2012US8147621 Oxidation of copper or chromium-nickel-iron alloy metal article; reduction in hydrogen; producing macroscopically smooth surface portions and a plurality of multiply curved nanopores; coating; semiconductors
04/03/2012US8146381 Dry ice box or infuser box with retainer system for integration with standard drinking glasses
04/03/2012US8146243 Method of manufacturing a device incorporated substrate and method of manufacturing a printed circuit board
03/2012
03/30/2012DE202012100694U1 Substrat mit vergrößerter Chipinsel Substrate with increased chip island
03/29/2012WO2012040735A2 Methods of forming fully embedded bumpless build-up layer packages and structures formed thereby
03/29/2012WO2012040724A1 Electrolytic depositon and via filling in coreless substrate processing
03/29/2012WO2012040711A2 Self referencing pin
03/29/2012WO2012040682A2 Die-stacking using through-silicon vias on bumpless build-up layer substrates including embedded-dice, and processes of forming same
03/29/2012WO2012040373A2 Diamond particle mololayer heat spreaders and associated methods
03/29/2012WO2012040367A1 Organosiloxane block copolymer
03/29/2012WO2012040302A1 Process for preparing resin-linear organosiloxane block copolymers
03/29/2012WO2012040274A1 Semiconductor chip with reinforcing through-silicon-vias
03/29/2012WO2012040271A1 Stacked semiconductor chip device with thermal management
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