Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/2012
03/29/2012WO2012040215A2 Stacked die assemblies including tsv die
03/29/2012WO2012040148A1 Composite heat spreader
03/29/2012WO2012039442A1 Light-emitting device package and method of manufacturing thereof
03/29/2012WO2012039437A1 Powdered sealant and sealing method
03/29/2012WO2012039436A1 Film sealant and sealing method
03/29/2012WO2012039158A1 Electronic part, method for producing same, and electronic device provided with electronic part
03/29/2012WO2012039120A2 Printed circuit board
03/29/2012WO2012039116A1 Circuit device
03/29/2012WO2012039114A1 Circuit device
03/29/2012WO2012038843A1 Electrochemically powered integrated circuit package
03/29/2012WO2012038127A1 Multifunction sensor as pop microwave pcb
03/29/2012WO2012038121A1 Flip-chip assembly having a cooling element and method for producing a flip-chip assembly
03/29/2012WO2012037816A1 Method for making circuit structure using non-conducting carrier
03/29/2012WO2012037728A1 Electric device and method of bonding chip to external electric circuit
03/29/2012WO2012009174A3 Air jet active heat sink apparatus
03/29/2012US20120075807 Stacked semiconductor chip device with thermal management
03/29/2012US20120074980 SCRIBE LINE TEST MODULES FOR IN-LINE MONITORING OF CONTEXT DEPENDENT EFFECTS FOR ICs INCLUDING MOS DEVICES
03/29/2012US20120074598 Chip, method for producing a chip and device for laser ablation
03/29/2012US20120074597 Flexible underfill compositions for enhanced reliability
03/29/2012US20120074596 Set of resin compositions for preparing system-in-package type semiconductor device
03/29/2012US20120074595 Semiconductor package
03/29/2012US20120074594 Semiconductor device and manufacturing method thereof
03/29/2012US20120074593 Chip stacked structure and method of fabricating the same
03/29/2012US20120074592 Wafer-level packaging method using composite material as a base
03/29/2012US20120074591 Thin wafer support assembly
03/29/2012US20120074590 Multiple bonding in wafer level packaging
03/29/2012US20120074589 Corner structure for ic die
03/29/2012US20120074588 Integrated circuit packaging system with warpage control and method of manufacture thereof
03/29/2012US20120074586 Methods of fabricating package stack structure and method of mounting package stack structure on system board
03/29/2012US20120074585 Semiconductor Device and Method of Forming TSV Interposer With Semiconductor Die and Build-Up Interconnect Structure on Opposing Surfaces of the Interposer
03/29/2012US20120074584 Multi-layer tsv insulation and methods of fabricating the same
03/29/2012US20120074583 Semiconductor structure having a through substrate via (tsv) and method for forming
03/29/2012US20120074582 Device with through-silicon via (tsv) and method of forming the same
03/29/2012US20120074581 Die-stacking using through-silicon vias on bumpless build-up layer substrates including embedded-dice, and processes of forming same
03/29/2012US20120074580 Methods of forming fully embedded bumpless build-up layer packages and structures formed thereby
03/29/2012US20120074579 Semiconductor chip with reinforcing through-silicon-vias
03/29/2012US20120074578 Semiconductor element, semiconductor element mounted board, and method of manufacturing semiconductor element
03/29/2012US20120074577 Semiconductor device, method for manufacturing of semiconductor device, and switching circuit
03/29/2012US20120074576 Interconnect for an optoelectronic device
03/29/2012US20120074575 Copper line having self-assembled monolayer for ulsi semiconductor devices, and a method of forming same
03/29/2012US20120074574 Semiconductor structure and method for making same
03/29/2012US20120074573 Semiconductor structure and method for making same
03/29/2012US20120074572 Semiconductor structure and method for making same
03/29/2012US20120074571 Methods and architectures for bottomless interconnect vias
03/29/2012US20120074570 Method for Forming a Through Via in a Semiconductor Element and Semiconductor Element Comprising the Same
03/29/2012US20120074569 Semiconductor device
03/29/2012US20120074568 Method and system for minimizing carrier stress of a semiconductor device
03/29/2012US20120074567 Semiconductor Device and Method of Forming Vertical Interconnect Structure Between Non-Linear Portions of Conductive Layers
03/29/2012US20120074566 Package For Semiconductor Device Including Guide Rings And Manufacturing Method Of The Same
03/29/2012US20120074565 Semiconductor device provided with rear protective film on other side of semiconductor substrate and manufacturing method of the same
03/29/2012US20120074564 Semiconductor device and manufacturing method of the same
03/29/2012US20120074563 Semiconductor apparatus and the method of manufacturing the same
03/29/2012US20120074562 Three-Dimensional Integrated Circuit Structure with Low-K Materials
03/29/2012US20120074561 Backmetal replacement for use in the packaging of integrated circuits
03/29/2012US20120074560 Integrated circuit packaging system with warpage control and method of manufacture thereof
03/29/2012US20120074559 Integrated circuit package using through substrate vias to ground lid
03/29/2012US20120074558 Circuit Board Packaged with Die through Surface Mount Technology
03/29/2012US20120074557 Integrated Circuit Package Lid Configured For Package Coplanarity
03/29/2012US20120074556 Semiconductor power module and method of manufacturing the same
03/29/2012US20120074555 Semiconductor package including cap
03/29/2012US20120074554 Bond ring for a first and second substrate
03/29/2012US20120074553 Method and system for improving reliability of a semiconductor device
03/29/2012US20120074552 Circuit device and method for manufacturing the same
03/29/2012US20120074551 Semiconductor device
03/29/2012US20120074550 Lead frame, semiconductor device, and method of manufacturing semiconductor device
03/29/2012US20120074549 Semiconductor device with exposed pad
03/29/2012US20120074548 Integrated circuit packaging system with interlock and method of manufacture thereof
03/29/2012US20120074547 Integrated circuit packaging system with lead encapsulation and method of manufacture thereof
03/29/2012US20120074546 Multi-chip Semiconductor Packages and Assembly Thereof
03/29/2012US20120074545 Thin flip chip package structure
03/29/2012US20120074544 Semiconductor device and manufacturing method therefor
03/29/2012US20120074543 Package apparatus of power semiconductor device
03/29/2012US20120074542 Semiconductor device
03/29/2012US20120074541 Semiconductor device and a method of manufacturing the same
03/29/2012US20120074540 Semiconductor chip package
03/29/2012US20120074539 Device and methods for electrostatic discharge protection
03/29/2012US20120074538 Package structure with esd and emi preventing functions
03/29/2012US20120074534 Semiconductor Device and Method of Forming Protective Structure Around Semiconductor Die for Localized Planarization of Insulating Layer
03/29/2012US20120074532 Semiconductor package with integrated metal pillars and manufacturing methods thereof
03/29/2012US20120074530 Interposer including air gap structure, methods of forming the same, semiconductor device including the interposer, and multi-chip package including the interposer
03/29/2012US20120074520 Electrical fuse structure and method of fabricating same
03/29/2012US20120074516 Semiconductor device
03/29/2012US20120074512 Communication device
03/29/2012US20120074496 Diode Having A Pocket Implant Blocked And Circuits And Methods Employing Same
03/29/2012US20120074481 Securities, chip mounting product, and manufacturing method thereof
03/29/2012US20120074467 Switch array
03/29/2012US20120074451 Lead frame structure, a packaging structure and a lighting unit thereof
03/29/2012US20120074402 Packaging structure
03/29/2012US20120074401 Test pattern for detecting piping in a memory array
03/29/2012US20120074400 Multiple edge enabled patterning
03/29/2012DE19733455B4 Wärmetauscheranordnung sowie Kühlsystem mit wenigstens einer derartigen Wärmetauscheranordnung Heat exchanger assembly and cooling system having at least one such heat exchanger assembly
03/29/2012DE112005001952B4 Flüssigmetall-Wärmeschnittstelle für eine integrierte Schaltvorrichtung Liquid metal thermal interface for an integrated circuit device
03/29/2012DE10228290B4 Halbleitervorrichtungssockel Semiconductor device socket
03/29/2012DE10218155B4 Halbleitervorrichtung und Verfahren zum Herstellen derselben A semiconductor device and method of manufacturing the same
03/29/2012DE102011082781A1 Halbleitervorrichtung Semiconductor device
03/29/2012DE102011081460A1 Verfahren zum bilden einer durchkontaktierung in einem halbleiterelement und halbleiterelement, das dieselbe aufweist A method of forming a via in a semiconductor element and semiconductor element, the same has
03/29/2012DE102011053955A1 Verfahren und System zum Verbessern der Zuverlässigkeit einer Halbleitervorrichtung A method and system for improving the reliability of a semiconductor device
03/29/2012DE102011053871A1 Multichip-Halbleitergehäuse und deren Zusammenbau Multi-chip semiconductor package and assembly thereof
03/29/2012DE102011053856A1 Verfahren und System zum Minimieren der Trägerbelastung einer Halbleitervorrichtung A method and system for minimizing the load carrier of a semiconductor device
03/29/2012DE102011053161A1 Verfahren und system zum führen von elektrischen verbindungen von halbleiterchips Method and system to perform electrical connections of semiconductor chips
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