Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
04/2012
04/05/2012US20120080801 Semiconductor device and electronic component module using the same
04/05/2012US20120080800 Power module and method for manufacturing the same
04/05/2012US20120080799 Semiconductor Module Comprising an Insert and Method for Producing a Semiconductor Module Comprising an Insert
04/05/2012US20120080797 Metal wiring structures for uniform current density in c4 balls
04/05/2012US20120080796 Device
04/05/2012US20120080795 Semiconductor structure and method for making same
04/05/2012US20120080794 Method for producing a metallization having two multiple alternating metallization layers for at least one contact pad and semiconductor wafer having said metallization for at least one contact pad
04/05/2012US20120080793 Subtractive patterning to define circuit components
04/05/2012US20120080792 Metal Interconnection Structure and Method For Forming Metal Interlayer Via and Metal Interconnection Line
04/05/2012US20120080791 Semiconductor structure and method for making same
04/05/2012US20120080790 Apparatus and method for uniform metal plating
04/05/2012US20120080789 SEMICONDUCTOR CHIP AND MOUNTING STRUCTURE OF THE SAME (as amended)
04/05/2012US20120080788 Semiconductor device having multilayer wiring structure and manufacturing method of the same
04/05/2012US20120080787 Electronic Package and Method of Making an Electronic Package
04/05/2012US20120080786 Electronic component and method for manufacturing the same
04/05/2012US20120080785 Semiconductor cooling apparatus
04/05/2012US20120080784 Multichip electronic packages and methods of manufacture
04/05/2012US20120080783 Thin flip chip package structure
04/05/2012US20120080781 Delamination resistant device package having raised bond surface and mold locking aperture
04/05/2012US20120080780 Sem iconductor device having pads and which minimizes defects due to bonding and probing processes
04/05/2012US20120080778 Electronic device
04/05/2012US20120080768 Sheet-molded chip-scale package
04/05/2012US20120080761 Semiconductor having a high aspect ratio via
04/05/2012US20120080705 Epoxy resin composition for optical semiconductor device, lead frame obtained using the same for optical semiconductor device, and optical semiconductor device
04/05/2012US20120080673 Crack Stop Barrier and Method of Manufacturing Thereof
04/05/2012US20120080672 Two-photon-absorption-based silicon waveguide photo-power monitor
04/05/2012DE102011083879A1 Transformatoranordnung Transformer assembly
04/05/2012DE102011083218A1 Halbleitermodul mit einem Einsatz und Verfahren zur Herstellung eines Halbleitermoduls mit einem Einsatz A semiconductor module with an insert, and method for manufacturing a semiconductor module with an insert
04/05/2012DE102011054153A1 Rissstoppbarriere und Verfahren zu deren Herstellung Crack arrest barrier and methods for their preparation
04/05/2012DE102011054120A1 Halbleiter-struktur und verfahren zu deren herstellung Semiconductor structure and process for their preparation
04/05/2012DE102011053356A1 Halbleiterstruktur und Verfahren zu deren Herstellung Semiconductor structure and process for their preparation
04/05/2012DE102010047944A1 LED lamp has transparent liquid that is filled in housing such that component carrier mounted with LED element is surrounded by transparent liquid
04/05/2012DE102010047002A1 Verfahren zur Herstellung belinster SMD-Leuchtdioden Process for the preparation belinster SMD LEDs
04/05/2012DE102010041917A1 Method for manufacturing circuit device, involves making contact portion of semiconductor chip to project into contacting tub of strip guard
04/05/2012DE102010041892A1 Leistungshalbleitermodul mit einem Grundmodul und einem Verbindungsmodul Power semiconductor module with a base module and a connection module
04/05/2012DE102010041849A1 Leistungshalbleitermodul mit einem Grundmodul und einem Verbindungsmodul Power semiconductor module with a base module and a connection module
04/05/2012DE102009001722B4 Verfahren zum Aufbringen eines Wärmeleitmediums auf eine Wärmeableitfläche Method for applying a heat conducting medium to a heat dissipation surface
04/05/2012DE102008058003B4 Verfahren zur Herstellung eines Halbleitermoduls und Halbleitermodul A process for producing a semiconductor module and the semiconductor module
04/04/2012EP2437293A2 Semiconductor cooling apparatus
04/04/2012EP2436475A1 Solder material, heat dissipation base using same, and electronic device
04/04/2012EP2436032A1 Cooled electric unit
04/04/2012EP2436031A1 Through substrate vias
04/04/2012EP2435516A1 Silicone composition for producing transparent silicone materials and optical devices
04/04/2012EP2208801B1 Bonding wire
04/04/2012EP1498946B1 Circuit board, process for producing the same and power module
04/04/2012CN202183375U 一种oled显示器件及其封装结构 One kind oled display device and package structure
04/04/2012CN202183370U 非互联型多芯片封装二极管 Non-interconnected multi-chip package diode
04/04/2012CN202183369U 封装结构 Package structure
04/04/2012CN202183368U 大功率晶体管风冷散热装置 Power transistor air-cooling device
04/04/2012CN202183367U 封装支架 Package bracket
04/04/2012CN202182665U 具有受热凸部的均温板结构 Average temperature of the heat plate structure having a convex portion
04/04/2012CN102405693A 栅格散热器 Raster radiator
04/04/2012CN102405692A Manufacturing method for circuit board, and circuit board
04/04/2012CN102405525A Multilevel interconnection system
04/04/2012CN102405524A Integrated circuit micro-module
04/04/2012CN102405523A Encapsulated circuit device for substrates with absorption layer and method for producing the same
04/04/2012CN102405509A Semiconductor device and method for manufacturing same
04/04/2012CN102404973A 热交换器结构 Heat exchanger structure
04/04/2012CN102404972A 散热装置 Cooling devices
04/04/2012CN102404971A 一种新型散热器用铝型材 A new radiator with aluminum
04/04/2012CN102404965A 发热电子元件散热片 Fin heat generating electronic components
04/04/2012CN102404964A 一种散热片 A heat sink sheet
04/04/2012CN102404935A Multilayered through hole laminating structure
04/04/2012CN102404002A 半导体集成电路装置 The semiconductor integrated circuit device
04/04/2012CN102403878A Electricity Transforming Device And Elevator
04/04/2012CN102403443A Heat sink
04/04/2012CN102403366A Integrated circuit device and method of forming the same
04/04/2012CN102403344A Parasitic PNP bipolar transistor in silicon germanium BiCMOS (bipolar complementary metal oxide semiconductor) process
04/04/2012CN102403325A Semiconductor package and manufacturing method for a semiconductor package as well as optical module
04/04/2012CN102403318A System with logic and embedded MIM capacitor
04/04/2012CN102403308A 一种不对称多芯片系统级集成封装器件及其封装方法 A multi-chip system-level integration package device and packaging method asymmetry
04/04/2012CN102403305A 一种usb装置结构 One kind of usb device structure
04/04/2012CN102403304A Interconnection structure and manufacturing method thereof
04/04/2012CN102403303A 在片上系统中使用动态随机存取存储器部件的方法及系统 Using a dynamic random access memory means in the on-chip system, a method and system for
04/04/2012CN102403302A Mechanism of forming SiC crystalline on Si substrates to allow integration of GAN and si electronics
04/04/2012CN102403301A 双镶嵌结构及其制造方法 Dual damascene structure and manufacturing method
04/04/2012CN102403300A Semiconductor module and semiconductor device including the same
04/04/2012CN102403299A 电路板结构及其制法 Circuit board structure Jiqizhifa
04/04/2012CN102403298A Lead frame for semiconductor devices
04/04/2012CN102403297A Shock resistant lead frame and packaging body
04/04/2012CN102403296A Semiconductor module and method for production thereof
04/04/2012CN102403295A Semiconductor packaging through metallic bonding and method for same
04/04/2012CN102403294A 半导体器件 Semiconductor devices
04/04/2012CN102403293A Die structure, die arrangement and method of processing a die
04/04/2012CN102403292A Layer stacks and integrated circuit arrangements
04/04/2012CN102403291A Semiconductor Part And Method For Making The Same
04/04/2012CN102403290A Semiconductor device and method for fabricating semiconductor device
04/04/2012CN102403289A 一种晶闸管阀内冷却系统 Thyristor valve cooling system
04/04/2012CN102403288A Cooling structure for semiconductor element
04/04/2012CN102403287A 散热板 Radiating plate
04/04/2012CN102403286A Semiconductor component and device provided with heat dissipation means
04/04/2012CN102403285A 半导体单元 Semiconductor unit
04/04/2012CN102403284A Electronic package, radiating structure for electronic devices and manufacturing method for radiating structure
04/04/2012CN102403283A Ball grid array packaging structure with basic islands and manufacturing method thereof
04/04/2012CN102403282A Packaging structure with basic islands and without pins at four sides and manufacturing method thereof
04/04/2012CN102403281A High-performance packaging structure of chip
04/04/2012CN102403280A Heat-radiating substrate and method for manufacturing same
04/04/2012CN102403279A Power semiconductor chip package
04/04/2012CN102403278A Connector assembly and manufacture method
04/04/2012CN102403277A Method for constructing an electrical circuit, and electrical circuit
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