Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
04/2012
04/11/2012CN102412165A 集成电路钝化层的制造方法及结构 The method of manufacturing an integrated circuit and a passivation layer structure of
04/11/2012CN102410658A 冰箱半导体制冷芯片散热组件 Refrigerator semiconductor chip cooling refrigeration components
04/11/2012CN102409198A 一种钇合金超导热材料及超导热装置 An alloy superconducting materials and superconducting heat means heat yttrium
04/11/2012CN102408840A Adhesive film, and connection structure and connecting method for circuit member
04/11/2012CN102134650B 一种轻质电子封装材料的制备工艺 Preparation of a lightweight material for electronic packaging
04/11/2012CN101958302B Double-side graph chip inverse single package structure and package method thereof
04/11/2012CN101958301B Double-side graph chip direct-put single package structure and package method thereof
04/11/2012CN101900254B 散热led灯 Cooling led lights
04/11/2012CN101785102B 具有发热部的装置 Means having a heat generating portion
04/11/2012CN101783335B Semiconductor device
04/11/2012CN101752363B 电容器结构 Capacitor structure
04/11/2012CN101692441B Packaging structure of printed circuit board
04/11/2012CN101665571B 一种聚苯基甲基硅氧烷改性环氧树脂及其高性能电子封装材料的制法 One poly phenyl methyl siloxane-modified epoxy resins and high-performance electronic packaging materials prepared by
04/11/2012CN101610636B 电磁带隙结构及印刷电路板 EBG structure and printed circuit board
04/11/2012CN101587849B Semiconductor device package having features formed by stamping
04/11/2012CN101558488B 密封封装体用的盖或容器及其制造方法 Lid or container sealed package and a manufacturing method used
04/11/2012CN101343367B 包含聚硼硅氧烷的光学半导体元件封装用树脂 The optical semiconductor element encapsulation containing a polyborosiloxane resin
04/11/2012CN101317335B Transmitter/receiver
04/11/2012CN101236967B 一种反相器内嵌的可控硅 One kind of inverters embedded SCR
04/11/2012CN101208790B 无铅半导体封装件 Lead-free semiconductor package
04/11/2012CN101118899B 将预定元件置于目标平台的装置和方法 The book element placed an apparatus and method of the target platform
04/10/2012US8154881 Radiation-shielded semiconductor assembly
04/10/2012US8154873 Heat dissipation device for memory module
04/10/2012US8154136 Method of fabricating semiconductor device
04/10/2012US8154135 Stacked semiconductor package
04/10/2012US8154134 Packaged electronic devices with face-up die having TSV connection to leads and die pad
04/10/2012US8154133 Semiconductor device having low dielectric constant film and manufacturing method thereof
04/10/2012US8154132 Semiconductor device comprising internal and external wiring
04/10/2012US8154131 Profiled contact
04/10/2012US8154129 Electrode structure and semiconductor device
04/10/2012US8154128 3D integrated circuit layer interconnect
04/10/2012US8154127 Optical device and method of making the same
04/10/2012US8154126 Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods
04/10/2012US8154125 Chip package structure
04/10/2012US8154124 Semiconductor device having a chip-size package
04/10/2012US8154123 Solder bump, semiconductor chip, method of manufacturing the semiconductor chip, conductive connection structure, and method of manufacturing the conductive connection structure
04/10/2012US8154122 Semiconductor package and methods of manufacturing the semiconductor package
04/10/2012US8154121 Polymer interlayer dielectric and passivation materials for a microelectronic device
04/10/2012US8154120 Chip-mounted film package
04/10/2012US8154119 Compliant spring interposer for wafer level three dimensional (3D) integration and method of manufacturing
04/10/2012US8154118 Semiconductor device
04/10/2012US8154117 High power integrated circuit device having bump pads
04/10/2012US8154116 Layered chip package with heat sink
04/10/2012US8154115 Package structure having MEMS element and fabrication method thereof
04/10/2012US8154114 Power semiconductor module
04/10/2012US8154113 Interconnect and test assembly including an interconnect
04/10/2012US8154112 Semiconductor memory apparatus
04/10/2012US8154111 Near chip size semiconductor package
04/10/2012US8154110 Double-faced electrode package and its manufacturing method
04/10/2012US8154109 Leadframe having delamination resistant die pad
04/10/2012US8154108 Dual-leadframe multi-chip package and method of manufacture
04/10/2012US8154107 Semiconductor device and a method of fabricating the device
04/10/2012US8154106 Coating and developing system and coating and developing method
04/10/2012US8154077 Semiconductor device
04/10/2012US8154058 Bio-sensor and method of manufacturing the same
04/10/2012US8154019 Semiconductor apparatus and calibration method thereof
04/10/2012US8153516 Method of ball grid array package construction with raised solder ball pads
04/10/2012US8153480 Air cavity package for flip-chip
04/10/2012US8153477 Method of making a semiconductor chip assembly with a post/dielectric/post heat spreader
04/10/2012US8153470 Doped elongated semiconductors, growing such semiconductors, devices including such semiconductors, and fabricating such devices
04/10/2012DE202012003142U1 Kühlvorrichtung Cooler
04/05/2012WO2012044733A2 Non-contact determination of joint integrity between a tsv die and a package substrate
04/05/2012WO2012044398A1 Corner structure for ic die
04/05/2012WO2012044287A1 Phase change energy storage in ceramic nanotube composites
04/05/2012WO2012043795A1 Circuit board, power supply structure, method for manufacturing circuit board, and method for manufacturing power supply structure
04/05/2012WO2012043767A1 Cleaning solution and cleaning method for semiconductor-device substrate
04/05/2012WO2012043764A1 Adhesive composition, method for manufacturing semiconductor device, and semiconductor device
04/05/2012WO2012043751A1 Resin composition
04/05/2012WO2012043742A1 Method for manufacturing package substrate for semiconductor element mounting
04/05/2012WO2012043623A1 Element containing package, module, and semiconductor device
04/05/2012WO2012043490A1 Al alloy film, wiring structure having al alloy film, and sputtering target used in producing al alloy film
04/05/2012WO2012043313A1 Element housing package, and electronic device using the same
04/05/2012WO2012043149A1 Power semiconductor module and method for manufacturing same
04/05/2012WO2012043117A1 Vapor phase cooling apparatus, and electronic equipment using same
04/05/2012WO2012042849A1 Cooler and refrigeration device provided with same
04/05/2012WO2012042337A1 Led unit
04/05/2012WO2012042333A1 Led module
04/05/2012WO2012042100A1 Method for manufacturing of an electric actuator
04/05/2012WO2012041889A1 Power routing with integrated decoupling capacitance
04/05/2012WO2012041034A1 Three dimensional (3d) integrated circuit structure and manufacturing method thereof
04/05/2012WO2012041033A1 Method for forming metal interconnection structure, through hole between metallization layers and interconnect metallization lines
04/05/2012WO2012040925A1 Led street lamp using thermoelectric cooling device
04/05/2012WO2012007722A3 Apparatus and method for thermal interfacing
04/05/2012WO2012006063A3 Microelectronic package and method of manufacturing same
04/05/2012WO2011163344A3 Low voltage pnpn protection device
04/05/2012WO2011156221A3 Wafer backside coating process with pulsed uv light source
04/05/2012WO2011137756A3 Composite material and electron device
04/05/2012WO2011137733A3 Power supply module and packaging and integrating method thereof
04/05/2012WO2011130693A3 Method for fabricating through-substrate microchannels
04/05/2012WO2003079374A3 Methods for forming articles having very small channels therethrough, and such articles, and methods of using such articles
04/05/2012US20120082538 Device and Method for Stacking and/or Conveying a Plurality of Flat Substrates
04/05/2012US20120082537 Module for stacking thin panels and method of stacking thin panels
04/05/2012US20120080809 Resin composition for encapsulating semiconductor and semiconductor device
04/05/2012US20120080808 Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device
04/05/2012US20120080807 Off-chip vias in stacked chips
04/05/2012US20120080806 Semiconductor package
04/05/2012US20120080805 Semiconductor device and method of manufacturing the same
04/05/2012US20120080804 Electronic device including interconnects with a cavity therebetween and a process of forming the same
04/05/2012US20120080803 Method of manufacturing a semiconductor component and structure
04/05/2012US20120080802 Through silicon via in n+ epitaxy wafers with reduced parasitic capacitance
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