Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
04/2012
04/12/2012US20120086080 Low-voltage structure for high-voltage electrostatic discharge protection
04/12/2012US20120086050 Massively Parallel Interconnect Fabric for Complex Semiconductor Devices
04/12/2012US20120086014 Semiconductor Device Having Glue Layer And Supporter
04/12/2012US20120086004 Elastic encapsulated carbon nanotube based electrical contacts
04/12/2012US20120086003 Semiconductor device and test system for the semiconductor device
04/12/2012DE10321692B9 Verbesserung einer Drahtkontaktierbarkeit in einer gehäusten Sensoranordnung Improvement of a wire bondability housed in a sensor array
04/12/2012DE102011084014A1 Integrierte Schaltungen mit Magnetkerninduktoren und Verfahren zum Herstellen derselben Integrated circuits and methods for manufacturing the same Magnetkerninduktoren
04/12/2012DE102011079105A1 Halbleitervorrichtung und Verfahren zum Herstellen derselben A semiconductor device and method of manufacturing the same
04/12/2012DE102011076845A1 Niedrigtemperaturbindeverfahren Low temperature bonding method
04/12/2012DE102011054377A1 Herstellung einer Vorrichtung mit einem Halbleiterchip Preparing a device having a semiconductor chip
04/12/2012DE102011053093A1 Leuchtvorrichtung Lighting device
04/12/2012DE102010047912A1 Überspannungsschutz für elektrisch leitfähige Strukturen Surge protection for electrically conductive structures
04/12/2012DE102010042211A1 Cooling device for cooling angular transistor outline housings, has clamping lever held as double-armed lever at cooling body by holding element, where bending moment of tensioning arm is deflected on clamping arm by holding element
04/12/2012DE102010042168A1 Elektronische Baugruppe sowie Verfahren zu deren Herstellung An electronic assembly as well as processes for their preparation
04/12/2012DE102009056868B4 Halbleitervorrichtung Semiconductor device
04/12/2012DE102007013410B4 Verfahren zum Ausbilden von Diamant-Mikrokanal-Strukturen und daraus resultierende Vorrichtungen A method for forming diamond micro-channel structures and resultant devices
04/12/2012DE102007004284B4 Halbleiterleistungsmodul The semiconductor power module
04/12/2012CA2813749A1 Interposers, electronic modules, and methods for forming the same
04/11/2012EP2440025A1 Covering device for an organic substrate, substrate with a covering device, and method for producing a covering device
04/11/2012EP2439797A1 Metal substrate and light source device
04/11/2012EP2439776A2 Antenna on an integrated circuit
04/11/2012EP2439775A2 Heat distributor with mechanically secured heat coupling element
04/11/2012EP2439774A2 Heat distributor with flexible heat tube
04/11/2012EP2439583A1 Transmissive liquid crystal display using CMOS technology with auxiliary storage capacity
04/11/2012EP2439477A2 Monolithic cold plate configuration
04/11/2012EP2439295A2 Method for producing a Cr-Cu-alloy
04/11/2012EP2439225A1 Organic silicon compound, thermosetting composition containing said organic silicon compound, and sealing material for optical semiconductor
04/11/2012EP2438983A1 Dispensable polymeric precursor composition for transparent composite sorber materials
04/11/2012EP2438612A2 Apparatus and method for frequency generation
04/11/2012EP2437939A1 Multilayer barrier film
04/11/2012EP2047509B1 A method of fabricating a nanostructure on a pre-etched substrate.
04/11/2012EP1990432B1 Semiconductor device, its manufacturing method, and sputtering target material for use in the method
04/11/2012EP1782464B1 Manufacturing method for semiconductor devices
04/11/2012EP1723836B1 A radio frequency circuit board topology
04/11/2012EP1546028B1 Method for selectively covering a micro machined surface
04/11/2012EP1345264B1 Integral-type ceramic circuit board and method of producing same
04/11/2012CN202190490U 一种复合型散热器 A composite radiator
04/11/2012CN202189795U Rectifier diode for automobile
04/11/2012CN202189794U 稳压二极管 Zener diode
04/11/2012CN202189787U 图像传感器的陶瓷封装 The image sensor of the ceramic package
04/11/2012CN202189784U 一种3-d霍尔传感器 One kind of 3-d Hall sensors
04/11/2012CN202189781U V型槽引线框架 V-groove leadframe
04/11/2012CN202189780U 一种半导体封装用引线框架 A semiconductor package lead frame
04/11/2012CN202189779U 半导体引线框架 Semiconductor leadframe
04/11/2012CN202189778U 一种ccd-dr探测器 One kind ccd-dr probe
04/11/2012CN202189777U 一种散热结构及其制备装置 A heat sink structure and preparation device
04/11/2012CN202189776U 散热模组 Cooling modules
04/11/2012CN202189775U 太阳能晶体管散热固定结构 Solar heat fixing transistor structure
04/11/2012CN202189774U 特大功率晶闸管封装结构 King Power Transistor package structure
04/11/2012CN202189769U 一种硅片与硅片的加工模具 One kind of silicon and silicon wafer processing mold
04/11/2012CN202189209U 引线结构、液晶显示屏引线区结构和液晶显示屏 Lead structure, the structure of the LCD screen and the LCD screen lead district
04/11/2012CN102415229A 电子设备的冷却构造 The cooling structure of electronic equipment
04/11/2012CN102414825A Power semiconductor device
04/11/2012CN102414816A Power module and power conversion device
04/11/2012CN102414815A Multi-die semiconductor package with heat spreader
04/11/2012CN102414814A Low thermal resistance and robust chip-scale-package (CSP), structure and method
04/11/2012CN102414813A Printed circuit board cooling assembly
04/11/2012CN102414812A Hermetic seal for an electronic device comprising an active organic material
04/11/2012CN102414806A Die connection monitoring system and method
04/11/2012CN102414804A Method for forming cu wiring
04/11/2012CN102414802A Discontinuous thin semiconductor wafer surface features
04/11/2012CN102414275A 用于产生透明硅氧烷材料和光学器件的硅氧烷组合物 And a transparent silicone material used to produce the silicone composition optics
04/11/2012CN102413641A Multilayer wiring board and manufacturing method thereof
04/11/2012CN102412826A Identification circuit and method for generating an identification bit using physical unclonable functions
04/11/2012CN102412247A Semiconductor device and multilayer semiconductor device
04/11/2012CN102412241A Semiconductor chip encapsulating piece and manufacturing method thereof
04/11/2012CN102412239A Semiconductor device and method of manufacturing same
04/11/2012CN102412238A Integrated circuit package with reduced parasitic loop inductance
04/11/2012CN102412237A 用于高电压静电放电防护的低电压结构的防护装置 A high voltage protective device for a low voltage electrostatic discharge protection structure
04/11/2012CN102412236A Layout structure for laterally diffused metal oxide semiconductor (LDMOS) array
04/11/2012CN102412235A 半导体集成电路设备 The semiconductor integrated circuit device
04/11/2012CN102412234A 一种互补型金属氧化物半导体的对准装置 Aligning a complementary metal-oxide semiconductor device
04/11/2012CN102412233A 一种有效的测试浅沟槽隔离填充能力的测试结构 An effective test shallow trench isolation filling capacity test structure
04/11/2012CN102412232A 一种短路缺陷测试装置和方法 One kind of short-circuit defect test device and method
04/11/2012CN102412231A Interconnect regions
04/11/2012CN102412230A 用于射频工艺中的电感地屏蔽结构 Process for the RF shield structures inductively
04/11/2012CN102412229A 半导体器件中的金属塞结构 The semiconductor device structure of metal plugs
04/11/2012CN102412228A 同轴硅通孔互连结构及其制造方法 Coaxial silicon through-hole interconnection structure and manufacturing method
04/11/2012CN102412227A 螺旋状电感的地屏蔽结构 Spiral inductors shielded structure
04/11/2012CN102412226A 半导体装置 Semiconductor device
04/11/2012CN102412225A Ball grid array semiconductor package and method of manufacturing the same
04/11/2012CN102412224A Lead frame routed chip pads for semiconductor packages
04/11/2012CN102412223A 防水密封引线框架结构 Waterproof seal leadframe structure
04/11/2012CN102412222A Tape package
04/11/2012CN102412221A High bond line thickness for semiconductor devices
04/11/2012CN102412220A Semiconductor device and manufacturing method thereof
04/11/2012CN102412219A Integrated circuit packaging system with active surface heat removal and method of manufacture thereof
04/11/2012CN102412218A 半导体装置及功率半导体装置 A power semiconductor device and a semiconductor device
04/11/2012CN102412217A Heat dissipation assembly and apparatus installed with the same
04/11/2012CN102412216A Intelligent refrigerator control chip radiating assembly
04/11/2012CN102412215A Thermal module and electronic device adopting same
04/11/2012CN102412214A 电子元件和散热装置的组合结构及其绝缘元件 Combination of structural and insulating elements of electronic components and heat sinks
04/11/2012CN102412213A 一种改进的汽车功放ic固定弹片 An improved car amplifier ic fixed shrapnel
04/11/2012CN102412212A 电子/光电组件的散热装置 Cooling apparatus for electronic / optoelectronic components
04/11/2012CN102412211A 电子器件 Electronic devices
04/11/2012CN102412210A 流固耦合散热器及散热方法 Fluid-structure coupling radiator and cooling methods
04/11/2012CN102412209A Package substrate, module and electric/electronic devices using the same
04/11/2012CN102412208A Chip-scale package and fabrication method thereof
04/11/2012CN102412197A Semiconductor device and method of forming conductive tsv with insulating annular ring
04/11/2012CN102412167A Fixation for line joint
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