Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
04/2012
04/18/2012CN101214918B 用于微机电封盖制程的封装结构 MEMS package structure for the process of closure
04/18/2012CN101194359B Sub-mount and its manufacturing method
04/18/2012CN101185146B 磁性差动感应器及相关方法 Differential magnetic sensors and related methods
04/18/2012CN101067068B Light resistant primer composition, light emitting semiconductor device and method of producing the same
04/17/2012US8161442 Integrated circuit devices and methods and apparatuses for designing integrated circuit devices
04/17/2012US8159830 Surface mounting chip carrier module
04/17/2012US8159575 Solid-state image pickup apparatus and method for manufacturing the same
04/17/2012US8159311 High frequency package and manufacturing method thereof
04/17/2012US8159075 Semiconductor chip stack and manufacturing method thereof
04/17/2012US8159074 Chip structure
04/17/2012US8159073 Interposer chip and manufacturing method thereof
04/17/2012US8159072 Rectification chip terminal structure
04/17/2012US8159071 Semiconductor package with a metal post
04/17/2012US8159070 Chip packages
04/17/2012US8159069 Metal line of semiconductor device without production of high resistance compound due to metal diffusion and method for forming the same
04/17/2012US8159068 Semiconductor device
04/17/2012US8159067 Underfill flow guide structures
04/17/2012US8159066 Semiconductor package having a heat dissipation member
04/17/2012US8159065 Semiconductor package having an internal cooling system
04/17/2012US8159064 Lead pin for package substrate, and method for manufacturing package substrate with the same
04/17/2012US8159063 Substrate and package with micro BGA configuration
04/17/2012US8159062 Semiconductor and a method of manufacturing the same
04/17/2012US8159061 Stacked semiconductor module
04/17/2012US8159060 Hybrid bonding interface for 3-dimensional chip integration
04/17/2012US8159059 Microelectromechanical device and method for manufacturing the same
04/17/2012US8159058 Semiconductor device having wiring substrate stacked on another wiring substrate
04/17/2012US8159057 Semiconductor device and manufacturing method therefor
04/17/2012US8159056 Package for an electronic device
04/17/2012US8159055 Semiconductor device, lead-frame product used for the same and method for manufacturing the same
04/17/2012US8159054 Semiconductor device
04/17/2012US8159053 Flat leadless packages and stacked leadless package assemblies
04/17/2012US8159052 Apparatus and method for a chip assembly including a frequency extending device
04/17/2012US8159049 Semiconductor structure for imaging detectors
04/17/2012US8159047 Semiconductor device and method of forming three-dimensional vertically oriented integrated capacitors
04/17/2012US8159042 Adopting feature of buried electrically conductive layer in dielectrics for electrical anti-fuse application
04/17/2012US8159041 Semiconductor device and manufacturing method thereof
04/17/2012US8159033 ESD protection device and manufacturing method thereof
04/17/2012US8159032 Electronic device comprising an ESD device
04/17/2012US8159000 LED package having an array of light emitting cells coupled in series
04/17/2012US8158504 Conductive compositions and processes for use in the manufacture of semiconductor devices—organic medium components
04/17/2012US8158474 Semiconductor device with localized stressor
04/17/2012US8158460 Method of forming metallic leadframes having laser-treated surfaces for improved adhesion to polymeric compounds
04/17/2012US8157415 Light emitting diode lighting module and method for making the same
04/17/2012US8156644 Method for manufacturing a printed circuit board having conformal EMI shield
04/12/2012WO2012048137A2 Flexible circuits and methods for making the same
04/12/2012WO2012048031A1 Electronic package and method of making an electronic package
04/12/2012WO2012047464A1 Bi-directional back-to-back stacked scr for high-voltage pin esd protection, methods of manufacture and design structures
04/12/2012WO2012047011A1 Transmission line transition having vertical structure and single chip package using land grid array joining
04/12/2012WO2012047002A2 Radiant heat circuit board, heat generating device package having the same, and backlight unit
04/12/2012WO2012046817A1 Electronic device and method of manufacturing thereof
04/12/2012WO2012046814A1 Multilayer resin sheet and process for production thereof, resin sheet laminate and process for production thereof, cured multilayer resin sheet, metal-foil-cladded multilayer resin sheet, and semiconductor device
04/12/2012WO2012046675A1 Method for manufacturing semiconductor device and semiconductor device
04/12/2012WO2012046636A1 Liquid sealing resin composition and semiconductor package
04/12/2012WO2012046578A1 Semiconductor device and method of producing semiconductor device
04/12/2012WO2012046553A1 Curing agent composition for epoxy resin, curable resin composition, and cured product thereof
04/12/2012WO2012046552A1 Method for producing cured product and cured product
04/12/2012WO2012046338A1 Semiconductor package, cooling mechanism, and a method for manufacturing semiconductor package
04/12/2012WO2012046161A1 Heat-sink device intended for at least one electronic component and corresponding method
04/12/2012WO2012045981A1 Method for manufacturing a circuit
04/12/2012WO2012045600A1 Electronic module and method for producing same
04/12/2012WO2012045557A1 Dispensable polymeric precursor composition for transparent composite sorber materials
04/12/2012WO2012045509A1 3d via capacitor with a floating conductive plate for improved reliability
04/12/2012WO2012045214A1 Ceramic packaging base having convex platforms
04/12/2012WO2012024578A3 Portable electronic device
04/12/2012WO2012023710A3 Air-conditioning device having a thermoelectric module
04/12/2012WO2012023618A4 Phenyl group-containing organic/inorganic hybrid prepolymer, heat resisitant organic/inorganic hybrid material, and element encapsulation structure
04/12/2012WO2012002764A3 Metal-semiconductor convergence electric circuit devices and electric circuit systems using the same
04/12/2012WO2011162504A3 Stacked semiconductor package
04/12/2012WO2011162488A3 Layered semiconductor package
04/12/2012WO2011119944A3 Method of attaching a thin die using sacrificial material to inhibit die warpage and corresponding device
04/12/2012US20120089180 Adhesive bonding composition and method of use
04/12/2012US20120086135 Interposers, electronic modules, and methods for forming the same
04/12/2012US20120086134 Method of Forming Patterns of Semiconductor Device
04/12/2012US20120086133 Semiconductor Device And Semiconductor Device Manufacturing Method
04/12/2012US20120086132 Method of manufacturing via electrode
04/12/2012US20120086131 Semiconductor element having conductive vias and semiconductor package having a semiconductor element with conductive vias and method for making the same
04/12/2012US20120086130 Layered chip package and method of manufacturing same
04/12/2012US20120086129 Manufacturing of a Device Including a Semiconductor Chip
04/12/2012US20120086128 Borderless interconnect line structure self-aligned to upper and lower level contact vias
04/12/2012US20120086127 Package systems and manufacturing methods thereof
04/12/2012US20120086126 Package systems and manufacturing methods thereof
04/12/2012US20120086125 Semiconductor Having Chip Stack, Semiconductor System, and Method of Fabricating the Semiconductor Apparatus
04/12/2012US20120086124 Semiconductor device and method of manufacturing the same
04/12/2012US20120086123 Semiconductor assembly and semiconductor package including a solder channel
04/12/2012US20120086122 Semiconductor Device And Semiconductor Package Having The Same
04/12/2012US20120086121 Method for manufacturing semiconductor device, and semiconductor device
04/12/2012US20120086120 Stacked semiconductor package having conductive vias and method for making the same
04/12/2012US20120086119 Chip stacked structure
04/12/2012US20120086118 Semiconductor package and method of fabricating the same
04/12/2012US20120086117 Package with embedded chip and method of fabricating the same
04/12/2012US20120086116 Electronic component device, method of manufacturing the same and wiring substrate
04/12/2012US20120086115 Integrated circuit packaging system with interposer interconnections and method of manufacture thereof
04/12/2012US20120086114 Millimeter devices on an integrated circuit
04/12/2012US20120086113 Flexible circuits and methods for making the same
04/12/2012US20120086112 Multi-Component Electronic System Having Leadframe with Support-Free Cantilever Leads
04/12/2012US20120086111 Semiconductor device
04/12/2012US20120086110 Ic package
04/12/2012US20120086109 Semiconductor Device Including Shielding Layer And Fabrication Method Thereof
04/12/2012US20120086108 Chip level emi shielding structure and manufacture method thereof
04/12/2012US20120086101 Integrated circuit and interconnect, and method of fabricating same
1 ... 383 384 385 386 387 388 389 390 391 392 393 394 395 396 397 398 399 400 401 402 403 ... 2262