Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
04/2012
04/19/2012DE102005001151B4 Bauelementanordnung zur Serienschaltung bei Hochspannungsanwendungen Component arrangement with the series circuit in high voltage applications
04/18/2012EP2442358A1 Semiconductor device
04/18/2012EP2442354A1 Method of producing electronic module, and electronic module
04/18/2012EP2441639A1 Electric power conversion device for vehicle
04/18/2012EP2441090A1 Microelectronic device provided with an array of elements made from a conductive polymer with a positive temperature coefficient
04/18/2012EP2441089A1 Cooling arrangement and method for assembling the cooling arrangement
04/18/2012EP2441088A1 Method for positioning chips during the production of a reconstituted wafer
04/18/2012EP2441087A2 Method for manufacturing tight pitch, flip chip integrated circuit packages
04/18/2012EP2440987A2 Heat-dissipating device and electronic apparatus having the same
04/18/2012CN202196780U 半导体整流器件的二极管模块 Semiconductor rectifier diode module
04/18/2012CN202196778U 一种包括多芯片的芯片块和基底构件的电子设备和组件 An electronic device and a multi-chip module and the base of the die member
04/18/2012CN202196777U Packaging structure of module integrated circuit
04/18/2012CN202196776U Flat carrier-free leadless pin exposed packaging part
04/18/2012CN202196775U 半导体封装 The semiconductor package
04/18/2012CN202196774U Plastic packaged power diode with welded metal pad
04/18/2012CN202196773U Ceramic plate for producing refrigerator part
04/18/2012CN202196772U 印刷线路板芯片封装散热结构 Printed circuit board chip package thermal structure
04/18/2012CN202196771U 用于电动汽车半导体的新型双面冷却器 The new double-sided cooler semiconductors for electric vehicles
04/18/2012CN202196770U 一种散热器 Radiator
04/18/2012CN202196769U 气密性封装外壳的陶瓷引线结构 Ceramic hermetic package lead structure of the housing
04/18/2012CN202196768U 金属封装外壳的引线外壳板 Metal packaging lead shell casing plate
04/18/2012CN202196767U 气密性封装外壳的陶瓷与引线的钎焊结构 Brazed structural ceramic hermetic package housing and lead
04/18/2012CN202196766U Semi-conductor device
04/18/2012CN202196246U 一种tft阵列基板及液晶显示器 One kind tft array substrate and liquid crystal display
04/18/2012CN1930892B 视频处理器对准箝位弹簧 Video processor alignment clamp spring
04/18/2012CN1568543B Semiconductor component
04/18/2012CN102422729A 电路基板及其制造方法 The circuit board and its manufacturing method
04/18/2012CN102422418A 固体摄像元件封装体用覆盖玻璃 The solid image pickup element package with a cover glass
04/18/2012CN102422415A Panelized backside processing for thin semiconductors
04/18/2012CN102422414A Device mounting structure and device mounting method
04/18/2012CN102422413A 热交换器、半导体装置及它们的制造方法 A heat exchanger, a semiconductor device and manufacturing method thereof
04/18/2012CN102422412A Stacked microelectronic assemblies having vias extending through bond pads
04/18/2012CN102422114A Heat exchange device with an increased heat exchange coefficient and method for manufacturing such a device
04/18/2012CN102421725A 金属-陶瓷-基板 Metals - Ceramics - board
04/18/2012CN102421273A Cooling device and electronic device using same
04/18/2012CN102420223A Circuit device and method for manufacturing the same
04/18/2012CN102420220A Circuit device and method of manufacturing the same
04/18/2012CN102420219A 分立半导体贴片超薄整流器 Slim Rectifier Discrete Semiconductor Chip
04/18/2012CN102420217A Multi-chip semiconductor packages and assembly thereof
04/18/2012CN102420216A Noise decoupling structure with through-substrate vias
04/18/2012CN102420215A Multiple edge enabled patterning
04/18/2012CN102420214A 形成强化对准标记的方法以及半导体器件 The method of strengthening the alignment mark is formed and a semiconductor device
04/18/2012CN102420213A Three-dimensional integrated circuit structure with low-k materials
04/18/2012CN102420212A 超低介电常数薄膜铜互连结构及其制作方法 Ultra-low dielectric constant film of copper interconnect structure and fabrication method thereof
04/18/2012CN102420211A 微凸点互联结构的图像传感器封装结构及实现方法 The image sensor package structure and implementation point of interconnection structure microbumps
04/18/2012CN102420210A Device with through-silicon via (tsv) and method of forming the same
04/18/2012CN102420209A 一种提高电容密度的结构及方法 A method for increasing the capacitance density of the structures and methods
04/18/2012CN102420208A 半导体封装件 The semiconductor package
04/18/2012CN102420207A 有机发光显示设备及其制造方法 The organic light emitting display device and its manufacturing method
04/18/2012CN102420206A Four-side pin-free packaging structure subjected to plating and etching sequentially and manufacturing method thereof
04/18/2012CN102420205A Advanced four-side flat pin-free package and manufacturing method thereof
04/18/2012CN102420204A Polymer core wire
04/18/2012CN102420203A Solder bump/metallization layer connecting structure body in microelectronic package and application of solder bump/metallization layer connecting structure body
04/18/2012CN102420202A Semiconductor device and manufacturing method thereof
04/18/2012CN102420201A 硅通孔结构及其制造方法 TSV structure and manufacturing method
04/18/2012CN102420200A 具有金属垂直互连结构的转接板及其制作方法 Adapter plate and a method of preparing metal vertical interconnect structure
04/18/2012CN102420199A 半导体模块 Semiconductor Modules
04/18/2012CN102420198A Semiconductor device and manufacturing method therefor
04/18/2012CN102420197A Semiconductor device and manufacturing method of the same
04/18/2012CN102420196A Semiconductor module design method and semiconductor module
04/18/2012CN102420195A Semiconductor device provided with rear protective film on other side of semiconductor substrate and manufacturing method of the same
04/18/2012CN102420194A 集成电路钝化层及其制造方法 The passivation layer and its method of manufacturing an integrated circuit
04/18/2012CN102420180A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
04/18/2012CN102420149A 树脂密封型半导体装置的制造方法、树脂密封型半导体装置及该半导体装置用的引线框架 The method of manufacturing a resin sealing type semiconductor device, lead frame and the resin sealing type semiconductor device of the semiconductor device in accordance with
04/18/2012CN102420147A Semiconductor device and method of forming protective structure around semiconductor die for localized planarization of insulating layer
04/18/2012CN102420107A 铜大马士革工艺金属-绝缘层-金属电容制造工艺及结构 Copper damascene metal - insulator - metal capacitor manufacturing processes and structures
04/18/2012CN102419825A 一种新型智能卡 A new smart card
04/18/2012CN102416725A 电子部件材料 An electronic component material
04/18/2012CN102054865B 用于静电保护结构的mos晶体管及其制造方法 Electrostatic protection structures mos transistor and manufacturing method for
04/18/2012CN101930933B Method for manufacturing semiconductor device
04/18/2012CN101900916B 显示装置的像素结构 Display pixel structure of the apparatus
04/18/2012CN101859751B 一种陶瓷复合基板 A ceramic composite substrate
04/18/2012CN101859748B 焊垫及应用其的封装结构 Pad and apply its package structure
04/18/2012CN101819960B Base plate, semiconductor packaging piece applying same and manufacture method of base plate
04/18/2012CN101814462B Semiconductor package element and a fabricating method thereof together with a sealing method
04/18/2012CN101807554B Electronic board and manufacturing method thereof, electro-optical device, and electronic apparatus
04/18/2012CN101793472B Heat-transporting device and electronic apparatus
04/18/2012CN101783333B 改善倒装芯片基板变形的结构 Deformation of the substrate to improve the structure of the flip-chip
04/18/2012CN101752340B 半导体装置 Semiconductor device
04/18/2012CN101750828B 用于平面切换模式液晶显示设备的阵列基板 For in-plane switching mode liquid crystal display device array substrate
04/18/2012CN101740533B Integrated circuit
04/18/2012CN101740475B 具有双镶嵌结构的半导体器件及其形成方法 A semiconductor device having a dual damascene structure and method of forming
04/18/2012CN101737755B 振动产生器的发光装置封装的冷却装置及前照灯 Vibration generator emitting device package, and a cooling device headlamp
04/18/2012CN101714534B 树脂片以及使用了该树脂片的电路装置的制造方法 And a method of manufacturing a resin sheet of the resin sheet using a circuit arrangement
04/18/2012CN101683006B Circuit board having built-in electronic parts and its manufacturing method
04/18/2012CN101675519B Multi-layer circuit substrate and method having improved transmission line integrity and increased routing density
04/18/2012CN101668382B 柔性印刷电路板和终端 A flexible printed circuit board and the terminal
04/18/2012CN101661921B 一种微波单片集成电路中的金属布线层结构及其制备方法 Metal wiring layer structure of a microwave monolithic integrated circuit and its preparation method
04/18/2012CN101634014B 通过cvd方法在半导体晶片上沉积层的方法以及用于实施该方法的室 By cvd deposited layer on a semiconductor wafer in a chamber and the method for implementing the
04/18/2012CN101569012B A method of producing solid-state imaging device
04/18/2012CN101567346B Semiconductor package having chip selection through electrodes and stacked semiconductor package having same
04/18/2012CN101548372B IC chip-mounted package and image display device using the same
04/18/2012CN101542628B 3D chip arrangement including memory manager
04/18/2012CN101515572B 用于led及大功率散热器件的散热器 Radiator and high-power radiator for led pieces
04/18/2012CN101451255B Electrochemically deposited indium composites
04/18/2012CN101429322B Encapsulating epoxy resin composition, and electronic parts device using the same
04/18/2012CN101414603B Stacked semiconductor package and method for manufacturing the same
04/18/2012CN101393898B Encapsulation structure and manufacturing method thereof
04/18/2012CN101359645B Semiconductor device, premolding packaging structure and manufacture method
04/18/2012CN101331681B 压电谐振片和压电谐振器件 The piezoelectric resonator plate and a piezoelectric resonator device
1 ... 382 383 384 385 386 387 388 389 390 391 392 393 394 395 396 397 398 399 400 401 402 ... 2262