Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
04/2012
04/24/2012US8164164 Semiconductor wafer, and semiconductor device formed therefrom
04/24/2012US8164163 Semiconductor device having sealing ring
04/24/2012US8164156 Fuse structure for high integrated semiconductor device
04/24/2012US8164155 Semiconductor device and method of manufacturing the same
04/24/2012US8164120 Semiconductor device with capacitor and fuse and its manufacture
04/24/2012US8164113 Electrostatic discharge structure for 3-dimensional integrated circuit through-silicon via device
04/24/2012US8164112 Electostatic discharge protection circuit coupled on I/O pad
04/24/2012US8164091 Multi-purpose poly edge test structure
04/24/2012US8163658 Multiple patterning using improved patternable low-k dielectric materials
04/24/2012US8163645 Method for providing a redistribution metal layer in an integrated circuit
04/24/2012US8163641 System for modifying small structures
04/24/2012US8163603 Method of making a semiconductor chip assembly with a post/base heat spreader and a substrate using grinding
04/24/2012US8163601 Chip-exposed semiconductor device and its packaging method
04/24/2012US8163574 System and method for sensing voltage in medium-to-high voltage applications
04/24/2012US8163572 Method for evaluating impurity distribution under gate electrode without damaging silicon substrate
04/24/2012US8163397 Method and apparatus for providing hermetic electrical feedthrough
04/24/2012US8163220 Method of packaging integrated circuits
04/24/2012US8162829 Analyte monitoring device and methods of use
04/19/2012WO2012051435A2 Shield-modulated tunable inductor device
04/19/2012WO2012051375A1 Method and apparatus for improving substrate warpage
04/19/2012WO2012051330A1 Multi-component electronic system having leadframe with support-free cantilever leads
04/19/2012WO2012051133A2 Vertical semiconductor device with thinned substrate
04/19/2012WO2012051077A1 Heat sink and led cooling system
04/19/2012WO2012051003A2 Self-aligning adhesive using solvent and solventless organic resin system in electronic packaging
04/19/2012WO2012050461A1 Small form factor oscillator
04/19/2012WO2012050333A2 Radiant heat circuit board, method of manufacturing the same, heat generating device package having the same, and backlight
04/19/2012WO2012050134A1 Tape for processing wafer, method for manufacturing tape for processing wafer, and method for manufacturing semiconductor device
04/19/2012WO2012050132A1 Semiconductor laser device
04/19/2012WO2012050105A1 Curable polyorganosiloxane composition
04/19/2012WO2012050057A1 Template and substrate treatment method
04/19/2012WO2012050016A1 Elastic surface wave device
04/19/2012WO2012049992A1 Heat radiation sheet and electronic device using same
04/19/2012WO2012049823A1 Semiconductor device production method and semiconductor device
04/19/2012WO2012049602A1 Light emitting device with reduced epi stress
04/19/2012WO2012049087A2 Semiconductor module and method of manufacturing a semiconductor module
04/19/2012WO2012048997A1 Electronic component
04/19/2012WO2012048516A1 Three-dimensional vertical interconnecting structure and manufacturing method thereof
04/19/2012WO2012048509A1 Low-dielectric constant dielectric and copper interconnect structure and integration method thereof
04/19/2012WO2012027081A3 Optical communication in a ramp-stack chip package
04/19/2012WO2012016999A3 Illuminating device for streets
04/19/2012WO2012012220A3 Metal-contamination-free through-substrate via structure
04/19/2012WO2012006002A3 Enhanced thermal management of 3-d stacked die packaging
04/19/2012WO2012003280A3 Bumpless build-up layer package design with an interposer
04/19/2012WO2011162953A3 Planar cavity mems and related structures, methods of manufacture and design structures
04/19/2012US20120094482 Microelectronic devices and methods for filing vias in microelectronic devices
04/19/2012US20120094438 Apparatus for and methods of attaching heat slugs to package tops
04/19/2012US20120091598 Handling layer for transparent substrate
04/19/2012US20120091596 Chip-to-chip multi-signaling communication system with common conductive layer
04/19/2012US20120091595 Layered Integrated Circuit Apparatus
04/19/2012US20120091594 Method of Producing a Chip Package, and Chip Package
04/19/2012US20120091593 Structure and method for simultaneously forming a through silicon via and a deep trench structure
04/19/2012US20120091591 Display device and sputtering target for producing the same
04/19/2012US20120091590 Electroless Deposition of Platinum on Copper
04/19/2012US20120091589 Method to electrodeposit nickel on silicon for forming controllable nickel silicide
04/19/2012US20120091588 Barrier layer, film forming method, and processing system
04/19/2012US20120091587 Method for fabrication of a semiconductor device and structure
04/19/2012US20120091586 Conformal coating of highly structured surfaces
04/19/2012US20120091585 Laser release process for very thin si-carrier build
04/19/2012US20120091584 Bump for semiconductor package, semiconductor package having bump, and stacked semiconductor package
04/19/2012US20120091583 Semiconductor device and method of manufacturing the same
04/19/2012US20120091582 Microelectronic assemblies having compliancy and methods therefor
04/19/2012US20120091581 Package unit and stacking structure thereof
04/19/2012US20120091580 Semiconductor Devices And Methods Of Fabricating The Same
04/19/2012US20120091579 Semiconductor Packages And Methods Of Fabricating The Same
04/19/2012US20120091578 Semiconductor chip having different pad width to ubm width ratios and method of manufacturing the same
04/19/2012US20120091577 Copper pillar bump with cobalt-containing sidewall protection
04/19/2012US20120091576 Under-bump metallization (ubm) structure and method of forming the same
04/19/2012US20120091575 Semiconductor Package And Method For Making The Same
04/19/2012US20120091574 Conductive pillar structure
04/19/2012US20120091573 Semiconductor device
04/19/2012US20120091572 Semiconductor package and implementation structure of semiconductor package
04/19/2012US20120091571 Semiconductor device
04/19/2012US20120091570 Chip package structure and chip packaging method
04/19/2012US20120091569 Leadframe package structure and manufacturing method thereof
04/19/2012US20120091568 Mixed wire semiconductor lead frame package
04/19/2012US20120091567 Semiconductor Die and Method of Forming Noise Absorbing Regions Between THVs in Peripheral Region of the Die
04/19/2012US20120091566 Semiconductor apparatus and method of fabrication for a semiconductor apparatus
04/19/2012US20120091565 Semiconductor integrated circuit device and process for manufacturing the same
04/19/2012US20120091557 Anti-fuse of semiconductor device and method for manufacturing the same
04/19/2012US20120091556 Vertical silicide e-fuse
04/19/2012US20120091554 Semiconductor device and method for manufacturing the same
04/19/2012US20120091532 Semiconductor Devices Including Buried-Channel-Arrray Transistors
04/19/2012US20120091517 Scratch protection for direct contact sensors
04/19/2012US20120091515 Semiconductor Devices Having Backside Illuminated Image Sensors
04/19/2012US20120091510 Semiconductor device and manufacturing method thereof, mask for semiconductor manufacture, and optical proximity correction method
04/19/2012US20120091468 Semiconductor device with interposer and method manufacturing same
04/19/2012US20120091455 Pad structure having contact bars extending into substrate and wafer having the pad structure
04/19/2012US20120091454 Inline process control structures
04/19/2012US20120090665 Solar array support structure with a telescopic wind brace
04/19/2012DE10240405B4 Verfahren zum Ausbilden einer selbstjustierten Antifuse-Verbindung A method of forming a self-aligned connection antifuse
04/19/2012DE102011081514A1 Halbleitervorrichtung Semiconductor device
04/19/2012DE102011053586A1 Wärmeableiter Heat sink
04/19/2012DE102011002534A9 Chippaket umfassend eine Vielzahl von Chips und Leiterausrichtung Chip package comprising a plurality of chips and circuit alignment
04/19/2012DE102010048632A1 Method for manufacturing set of electronic units in high-frequency circuit of mobile telephone, involves applying electromagnetic protective layer on electronic unit to cover side surfaces of substrate uncovered by isolation process
04/19/2012DE102010048529A1 Cooling structure for electronic component e.g. transistor, has heat distributor whose side surfaces are rounded or tapered so that side surfaces of heat distributor are partially arranged on base portion
04/19/2012DE102010042382A1 Kontaktelement und Verwendung eines Kontaktelements in einem elektronischen Bauteil Use of a contact element and the contact member in an electronic component
04/19/2012DE102010042379A1 Elektronisches Bauteil Electronic component
04/19/2012DE102009037259B4 Anordnung mit einer Kühleinrichtung und einem Leistungshalbleitermodul Arrangement with a cooling device and a power semiconductor module
04/19/2012DE102007022959B4 Verfahren zur Herstellung von Halbleitervorrichtungen A process for the manufacture of semiconductor devices
04/19/2012DE102005054872B4 Vertikales Leistungshalbleiterbauelement, Halbleiterbauteil und Verfahren zu deren Herstellung Vertical power semiconductor device, the semiconductor device and process for their preparation
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