| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 04/25/2012 | CN202206347U 一种新型的大功率放大器 A new high-power amplifier |
| 04/25/2012 | CN202206339U 一种新型mosfmt驱动模块 A new mosfmt drive module |
| 04/25/2012 | CN202206338U 新型mosfmt驱动模块 The new mosfmt drive module |
| 04/25/2012 | CN202205759U 贴片二极管的改良结构 Improved patch diode structure |
| 04/25/2012 | CN202205748U Semiconductor storage device |
| 04/25/2012 | CN202205738U 高压硅堆 High voltage silicon stack |
| 04/25/2012 | CN202205737U Multi-chip packaging structure and inductive chip |
| 04/25/2012 | CN202205736U W型铜合金带 W-shaped copper alloy strip |
| 04/25/2012 | CN202205735U 双金线芯片封装结构 Double gold wire chip package |
| 04/25/2012 | CN202205734U 一种薄型大功率半导体模块 A thin high-power semiconductor module |
| 04/25/2012 | CN202205733U High-power semiconductor device |
| 04/25/2012 | CN202205732U 热管散热器 Heat pipe radiator |
| 04/25/2012 | CN202205731U 一种igbt模块超导热管散热模组 One kind igbt module superconducting heat pipe cooling module |
| 04/25/2012 | CN202205730U 设有辅助固定件的散热片 An auxiliary fixing member heatsink |
| 04/25/2012 | CN202205729U 散热片 Fins |
| 04/25/2012 | CN202205728U 电子组件之抗硫化构造 Anti-sulfide structure of electronic components |
| 04/25/2012 | CN202204339U 多片结合式散热器 Multi-chip combined with radiators |
| 04/25/2012 | CN1997682B Resin composition for semiconductor sealing and semiconductor device |
| 04/25/2012 | CN1917321B 热保护电路、功率传输集成电路及功率传输方法 Thermal protection circuits, power transmission circuits and power transmission method |
| 04/25/2012 | CN1783427B Temperature-compensated resistor and fabrication method therefor |
| 04/25/2012 | CN1659810B Direct-connect signaling system |
| 04/25/2012 | CN102428765A 用于机载电子卡的壳体 For airborne electronic card case |
| 04/25/2012 | CN102428558A 半导体装置 Semiconductor device |
| 04/25/2012 | CN102428557A Microelectronic assembly wherein a wirebond is impedance controlled by using an additional wirebond connected to a reference potential |
| 04/25/2012 | CN102428554A Method For Providing Electrical Connections To Spaced Conductive Lines |
| 04/25/2012 | CN102428551A A metallization system of a semiconductor device including metal pillars having a reduced diameter at the bottom |
| 04/25/2012 | CN102427073A Semiconductor chip and lead frame |
| 04/25/2012 | CN102427072A 用于将功率组件与端子平面元件电连接的装置 Means the power module and the plane element is electrically connected to a terminal for |
| 04/25/2012 | CN102427071A Novel heat dissipation component of intelligent refrigerator control chip |
| 04/25/2012 | CN102427070A 功率模块 Power Modules |
| 04/25/2012 | CN102427069A 一种电路封装结构及封装方法 A circuit package and packaging method |
| 04/25/2012 | CN102427068A Monolithical integration lattice mismatched crystal template and manufacturing method thereof |
| 04/25/2012 | CN102427021A 半导体器件中的射频信号的传输结构及其形成方法 Transmission structure and method of forming a semiconductor device of the radio-frequency signal |
| 04/25/2012 | CN102426657A 一种新型双界面智能卡 A new dual-interface smart card |
| 04/25/2012 | CN102425968A Compact type loop heat pipe device |
| 04/25/2012 | CN101855723B Power semiconductor module |
| 04/25/2012 | CN101826498B 显示装置、框架模块及框架模块制作方法 Device, the frame module and method of manufacturing the display frame module |
| 04/25/2012 | CN101814482B Base island lead frame structure and production method thereof |
| 04/25/2012 | CN101803016B Methods for attachment and devices produced using the methods |
| 04/25/2012 | CN101798054B 微机电器件的晶圆级真空封装方法 Wafer-level vacuum packaging method MEMS devices |
| 04/25/2012 | CN101771049B Real chip level package power metal oxide semiconductor field effect tube based on a bottom source electrode metal oxide semiconductor field effect tube |
| 04/25/2012 | CN101647115B Semiconductor device, its manufacturing method and optical pickup module |
| 04/25/2012 | CN101609828B Semiconductor device and method of manufacturing the same |
| 04/25/2012 | CN101601132B Chip cooling channels formed in wafer bonding gap |
| 04/25/2012 | CN101540303B 抗磨损和晶须的涂覆系统和方法 Abrasion resistant coating systems and methods and whiskers |
| 04/25/2012 | CN101529586B Method of packaging a semiconductor device and a prefabricated connector |
| 04/25/2012 | CN101517735B Shape memory based mechanical enabling mechanism |
| 04/25/2012 | CN101482244B 汽车大灯 Car headlights |
| 04/25/2012 | CN101431132B Luminous diode |
| 04/25/2012 | CN101419965B Circuit device |
| 04/25/2012 | CN101356643B 半导体器件 Semiconductor devices |
| 04/25/2012 | CN101310383B Enhancing shock resistance in semiconductor packages |
| 04/25/2012 | CN101241886B Contact structure and semiconductor device |
| 04/25/2012 | CN101207050B Light emitting device package and method for manufacturing the same |
| 04/25/2012 | CN101159254B 半导体装置 Semiconductor device |
| 04/25/2012 | CN101070429B 可热固化的硅氧烷组合物 Heat-curable silicone composition |
| 04/25/2012 | CN101068846B 环氧树脂组合物及半导体器件 Epoxy resin composition and semiconductor device |
| 04/24/2012 | USRE43326 Tap connections for circuits with leakage suppression capability |
| 04/24/2012 | USRE43320 Semiconductor device and manufacturing method thereof |
| 04/24/2012 | US8166434 Integrated circuit devices and methods and apparatuses for designing integrated circuit devices |
| 04/24/2012 | US8165727 Information processing apparatus and cooling control method |
| 04/24/2012 | US8164909 Al/AlN joint material, base plate for power module, power module, and manufacturing method of Al/AlN joint material |
| 04/24/2012 | US8164905 Heat sink assembly |
| 04/24/2012 | US8164903 Clamping part for pressing power components against a cooling surface |
| 04/24/2012 | US8164872 Power supply clamp circuit |
| 04/24/2012 | US8164203 Leadframe, semiconductor device, and method of manufacturing the same |
| 04/24/2012 | US8164202 Optical semiconductor device encapsulated with silicone resin |
| 04/24/2012 | US8164201 Semiconductor device with front and back side resin layers having different thermal expansion coefficient and elasticity modulus |
| 04/24/2012 | US8164200 Stack semiconductor package and method for manufacturing the same |
| 04/24/2012 | US8164199 Multi-die package |
| 04/24/2012 | US8164197 Semiconductor device having multilayer interconnection structure |
| 04/24/2012 | US8164196 Semiconductor device and method for manufacturing the same |
| 04/24/2012 | US8164195 Pad structure of semiconductor integrated circuit apparatus |
| 04/24/2012 | US8164194 Data line structure in lead region |
| 04/24/2012 | US8164193 Metal wiring of semiconductor device and forming method thereof |
| 04/24/2012 | US8164191 Semiconductor device |
| 04/24/2012 | US8164190 Structure of power grid for semiconductor devices and method of making the same |
| 04/24/2012 | US8164189 Multi-chip semiconductor device |
| 04/24/2012 | US8164188 Methods of forming solder connections and structure thereof |
| 04/24/2012 | US8164187 Flip chip device and manufacturing method thereof |
| 04/24/2012 | US8164186 BGA semiconductor device having a dummy bump |
| 04/24/2012 | US8164185 Semiconductor device, reticle used in fabricating method for the same and fabrication method thereof |
| 04/24/2012 | US8164184 Semiconductor device and method of forming conductive pillars in recessed region of peripheral area around the device for electrical interconnection to other devices |
| 04/24/2012 | US8164183 Integrated circuit cooling device |
| 04/24/2012 | US8164182 Hyper thermally enhanced semiconductor package system comprising heat slugs on opposite surfaces of a semiconductor chip |
| 04/24/2012 | US8164181 Semiconductor device packaging structure |
| 04/24/2012 | US8164179 Chip scale package structure with can attachment |
| 04/24/2012 | US8164178 Chip-type semiconductor ceramic electronic component |
| 04/24/2012 | US8164177 Electronic component module and method for production thereof |
| 04/24/2012 | US8164176 Semiconductor module arrangement |
| 04/24/2012 | US8164175 Stackable semiconductor device assemblies |
| 04/24/2012 | US8164174 Microstructure component |
| 04/24/2012 | US8164173 Panel, semiconductor device and method for the production thereof |
| 04/24/2012 | US8164172 Integrated circuit package in package system |
| 04/24/2012 | US8164171 System-in packages |
| 04/24/2012 | US8164170 Devices with faraday cages and internal flexibility sipes |
| 04/24/2012 | US8164169 Cooling devices in semiconductor packages |
| 04/24/2012 | US8164168 Semiconductor package |
| 04/24/2012 | US8164167 Integrated circuit structure and a method of forming the same |
| 04/24/2012 | US8164166 Interfacial roughness reducing film, wiring layer, semiconductor device, and method of manufacturing semiconductor device |