Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2014
12/24/2014CN102054789B 半导体器件和制造半导体器件的方法 The method of manufacturing a semiconductor device and a semiconductor device
12/24/2014CN101997004B 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
12/24/2014CN101908525B 半导体器件以及制造所述半导体器件的方法 Semiconductor device and method of manufacturing the semiconductor device
12/24/2014CN101599470B 传感器组件和用于制造传感器组件的方法 The method of producing a sensor assembly and sensor assembly for
12/23/2014US8918138 Receive band selection and electrostatic discharge protection in a transceiver
12/23/2014US8917532 Stub minimization with terminal grids offset from center of package
12/23/2014US8917522 Semiconductor device
12/23/2014US8917521 Etch-back type semiconductor package, substrate and manufacturing method thereof
12/23/2014US8917510 Reversibly adhesive thermal interface material
12/23/2014US8917509 Electric power conversion apparatus
12/23/2014US8917508 Arrangement of a power semiconductor circuit
12/23/2014US8917507 Cooling device, electronic substrate and electronic device
12/23/2014US8917503 Heat dissipation device
12/23/2014US8917340 Circuit board assembly and camera module using same
12/23/2014US8917218 Circuit board and circuit module
12/23/2014US8917107 Circuit board having bypass pad
12/23/2014US8917017 Organic el panel, panel-combined light emitting device, and method of manufacturing organic el panel
12/23/2014US8917012 Porous heat sink LED lamps
12/23/2014US8916981 Epoxy-amine underfill materials for semiconductor packages
12/23/2014US8916980 Pad and circuit layout for semiconductor devices
12/23/2014US8916979 Through-vias and methods of forming the same
12/23/2014US8916978 Interconnect structure and method of fabricating
12/23/2014US8916977 Semiconductor device and method for fabricating the same
12/23/2014US8916976 Semiconductor device and method of manufacturing the same
12/23/2014US8916975 Semiconductor memory device having pads
12/23/2014US8916974 Metal density aware signal routing
12/23/2014US8916973 Semiconductor device with electrode structure including graphene pattern formed over metal pattern
12/23/2014US8916972 Adhesion between post-passivation interconnect structure and polymer
12/23/2014US8916971 Multi-direction design for bump pad structures
12/23/2014US8916970 Method for welding gold-silicon eutectic chip, and transistor
12/23/2014US8916969 Semiconductor devices, packaging methods and structures
12/23/2014US8916968 Multichip power semiconductor device
12/23/2014US8916967 Semiconductor device
12/23/2014US8916966 Integrated circuit including a heat dissipation structure
12/23/2014US8916965 Semiconductor package containing silicon-on-insulator die mounted in bump-on-leadframe manner to provide low thermal resistance
12/23/2014US8916964 Semiconductor device and method of producing same
12/23/2014US8916963 Power module for an automobile
12/23/2014US8916962 III-nitride transistor with source-connected heat spreading plate
12/23/2014US8916961 Insulation sheet made from silicon nitride, and semiconductor module structure using the same
12/23/2014US8916960 Semiconductor unit
12/23/2014US8916959 Packaging structure
12/23/2014US8916958 Semiconductor package with multiple chips and substrate in metal cap
12/23/2014US8916957 Package structure and package process
12/23/2014US8916956 Multiple die packaging interposer structure and method
12/23/2014US8916938 Three-dimensional writable printed memory
12/23/2014US8916934 Bi-directional electrostatic discharge (ESD) protection circuit
12/23/2014US8916919 Interdigitated vertical native capacitor
12/23/2014US8916910 Reconfigurable RF/digital hybrid 3D interconnect
12/23/2014US8916894 Light-reflective anisotropic conductive adhesive agent, and light emitting device
12/23/2014US8916875 Semiconductor packages
12/23/2014US8916874 Sacrificial waveguide test structures
12/23/2014US8916873 Photodetector with controllable spectral response
12/23/2014US8916871 Bondable top metal contacts for gallium nitride power devices
12/23/2014US8916781 Cavities containing multi-wiring structures and devices
12/23/2014US8916779 Tape substrate with chip on film structure for liquid crystal display panel
12/23/2014US8916671 Silicone resin
12/23/2014US8916654 Curable composition
12/23/2014US8916653 Curable composition
12/23/2014US8916633 TAB leader tape made of polyphenylene ether-based resin
12/23/2014US8916481 Embedded wafer level package for 3D and package-on-package applications, and method of manufacture
12/23/2014US8916474 Semiconductor modules and methods of formation thereof
12/23/2014US8916473 Method for forming through-base wafer vias for fabrication of stacked devices
12/23/2014US8916471 Method for forming semiconductor structure having through silicon via for signal and shielding structure
12/23/2014US8916468 Semiconductor device fabrication method
12/23/2014US8916466 Method for manufacturing dual damascene wiring in semiconductor device
12/23/2014US8916465 UBM structures for wafer level chip scale packaging
12/23/2014US8916464 Structures and methods for improving solder bump connections in semiconductor devices
12/23/2014US8916463 Wire bond splash containment
12/23/2014US8916453 Method for manufacturing an electronic component
12/23/2014US8916452 Semiconductor device and method of forming WLCSP using wafer sections containing multiple die
12/23/2014US8916449 Package structure and substrate bonding method
12/23/2014US8916448 Metal to metal bonding for stacked (3D) integrated circuits
12/23/2014US8916423 Semiconductor device and method of manufacturing the same
12/23/2014US8916422 Semiconductor packages and methods of packaging semiconductor devices
12/23/2014US8916421 Semiconductor device packaging having pre-encapsulation through via formation using lead frames with attached signal conduits
12/23/2014US8916420 Chip package and manufacturing method thereof
12/23/2014US8916417 Method of manufacturing semiconductor device having chip stacks combined in relation to the number of chips having defects
12/23/2014US8916416 Semiconductor device and method of laser-marking laminate layer formed over eWLB with tape applied to opposite surface
12/23/2014US8916397 Method for producing an electronic component and electronic component
12/23/2014US8916396 Method of manufacturing semiconductor element
12/23/2014US8916269 Dimensionally stable, leak-free graphite substrate
12/23/2014US8916079 Method for producing an electronic component
12/23/2014US8915857 Method for manufacturing optical device, optical device, and biological information detector
12/23/2014US8914974 Method for integrating an electronic component into a printed circuit board
12/18/2014US20140370685 Method for forming a groove on a surface of flat plate formed of a nitride semiconductor crystal
12/18/2014US20140370671 Reliable electrical fuse with localized programming and method of making the same
12/18/2014US20140370663 Method for Producing a Semiconductor Module
12/18/2014US20140370662 Copper Post Solder Bumps on Substrates
12/18/2014US20140370661 Dual Lead Frame Semiconductor Package and Method of Manufacture
12/18/2014US20140370660 Semiconductor device and method of manufacturing the same
12/18/2014US20140370658 Room temperature metal direct bonding
12/18/2014US20140370639 Micro electro mechanical system, semiconductor device, and manufacturing method thereof
12/18/2014US20140370228 Substrate structure
12/18/2014US20140369148 Memory module and memory system
12/18/2014US20140368998 Package for housing electronic component and electronic device
12/18/2014US20140368992 Methods For Establishing Thermal Joints Between Heat Spreaders and Heat Generating Components Using Thermoplastic and/or Self-Healing Thermal Interface Materials
12/18/2014US20140368319 Semiconductor device and chip identifier setting method
12/18/2014US20140367869 Enhanced FinFET Process Overlay Mark
12/18/2014US20140367868 Sealing composition for semiconductor, semiconductor device and method of producing the same, and polymer and method of producing the same
12/18/2014US20140367867 Packaging Methods and Packaged Semiconductor Devices
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