Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
04/2012
04/26/2012WO2012053522A1 Sealing resin composition and electronic component device
04/26/2012WO2012053463A1 Method for manufacturing electronic device, electronic device manufactured using same, method for manufacturing electric/electronic component, and electric/electronic component manufactured using same
04/26/2012WO2012053321A1 High-frequency module and method for producing same
04/26/2012WO2012053301A1 Encapsulating agent for optical semiconductor devices, and optical semiconductor device using same
04/26/2012WO2012053205A1 Semiconductor device and production method for same
04/26/2012WO2012053130A1 Semiconductor device
04/26/2012WO2012053129A1 Semiconductor device, and manufacturing method for same
04/26/2012WO2012053125A1 Semiconductor device
04/26/2012WO2012052611A1 Device with mold cap and method thereof
04/26/2012WO2012052278A1 Micro-cooling device
04/26/2012WO2012030420A3 Package for system level electronic products
04/26/2012WO2012027423A3 Wide input output memory with low density, low latency and high density, high latency blocks
04/26/2012WO2012020317A3 Gain enhanced ltcc system-on-package for umrr applications
04/26/2012WO2012010395A3 Alignment of graphite nanofibers in thermal interface material
04/26/2012WO2012009588A3 Integrated shielding for a package-on-package system
04/26/2012WO2012007241A3 Semifinished product and method for producing a light-emitting diode
04/26/2012WO2011139862A3 Hermetic wafer-to-wafer bonding with electrical interconnection
04/26/2012WO2011096800A3 Semiconductor device with a variable integrated circuit chip bump pitch
04/26/2012US20120101540 Wafer-scale package including power source
04/26/2012US20120099366 Multi-resistive integrated circuit memory
04/26/2012US20120099274 Devices and methods providing for intra-die cooling structure reservoirs
04/26/2012US20120099270 Heat dissipating apparatus and electronic device with heat dissipating apparatus
04/26/2012US20120098147 Plasma treatment method
04/26/2012US20120098145 Semiconductor device and method of forming the same
04/26/2012US20120098144 Vertical electrode structure using trench and method for fabricating the vertical electrode structure
04/26/2012US20120098143 Method for packaging a semiconductor chip, and semiconductor package
04/26/2012US20120098142 Electrical contact for a deep buried layer in a semi-conductor device
04/26/2012US20120098141 Semiconductor device and method for forming the same
04/26/2012US20120098140 Hybrid bonding techniques for multi-layer semiconductor stacks
04/26/2012US20120098139 Vertical Memory Devices And Methods Of Manufacturing The Same
04/26/2012US20120098138 Power semiconductor device
04/26/2012US20120098137 Element mounting substrate and semiconductor module
04/26/2012US20120098135 Integrated circuits with backside metalization and production method thereof
04/26/2012US20120098134 Connecting material, semiconductor device and method for manufacturing semiconductor device
04/26/2012US20120098133 Structure and metallization process for advanced technology nodes
04/26/2012US20120098131 Nickel Silicide Film
04/26/2012US20120098130 Lead-free structures in a semiconductor device
04/26/2012US20120098129 Method of making a multi-chip module having a reduced thickness and related devices
04/26/2012US20120098128 Chip structure and process for forming the same
04/26/2012US20120098127 Power/ground layout for chips
04/26/2012US20120098126 Semiconductor device and manufacturing method therefor
04/26/2012US20120098125 Integrated circuit package and physical layer interface arrangement
04/26/2012US20120098124 Semiconductor device having under-bump metallization (ubm) structure and method of forming the same
04/26/2012US20120098123 Molded Chip Interposer Structure and Methods
04/26/2012US20120098122 Wafer level packaging of micro-electro-mechanical systems (mems) and complementary metal-oxide-semiconductor (cmos) substrates
04/26/2012US20120098121 Conductive feature for semiconductor substrate and method of manufacture
04/26/2012US20120098120 Centripetal layout for low stress chip package
04/26/2012US20120098119 Semiconductor chip device with liquid thermal interface material
04/26/2012US20120098118 Compliant heat spreader for flip chip packaging
04/26/2012US20120098117 Power and thermal design using a common heat sink on top of high thermal conductive resin package
04/26/2012US20120098116 Multi-chip module system with removable socketed modules
04/26/2012US20120098115 Semiconductor device and method of manufacturing the same
04/26/2012US20120098114 Device with mold cap and method thereof
04/26/2012US20120098113 Device with semiconductor die attached to a leadframe
04/26/2012US20120098112 Lead frame manufactured from low-priced material and not requiring strict process control, semiconductor package including the same, and method of manufacturing the lead frame and the semiconductor package
04/26/2012US20120098111 High current capacity inner leads for semiconductor devices, interposer and leadframe
04/26/2012US20120098110 Supporting Body for a Semiconductor Component, Semiconductor Element and Method for Production of a Supporting Body
04/26/2012US20120098109 Chip package and manufacturing method thereof
04/26/2012US20120098107 Systems and methods for thin-film deposition of metal oxides using excited nitrogen-oxygen species
04/26/2012US20120098106 Semiconductor device and method of manufacturing the same
04/26/2012US20120098105 Bond pad for wafer and package for cmos imager
04/26/2012US20120098104 Shielding techniques for an integrated circuit
04/26/2012US20120098092 Semiconductor device capacitors including multilayered lower electrodes
04/26/2012US20120098091 Semiconductor device substrate and semiconductor device
04/26/2012US20120098074 Mems device with release aperture
04/26/2012US20120097979 Structurally robust power switching assembly
04/26/2012US20120097970 Atomic layer deposition encapsulation for power amplifiers in rf circuits
04/26/2012US20120097944 TEST STRUCTURES FOR THROUGH SILICON VIAS (TSVs) OF THREE DIMENSIONAL INTEGRATED CIRCUIT (3DIC)
04/26/2012DE202012003442U1 Kühlstruktur einer Kühlvorrichtung The cooling structure of a cooling device
04/26/2012DE112006002839B4 Anordnung aus einer elektrischen Vorrichtung und einer Kühlstruktur für die elektrische Vorrichtung Arrangement of an electrical device and a cooling structure for the electrical device
04/26/2012DE112006000840B4 Verfahren zur Herstellung einer Halbleiteranordnung sowie Verfahren zum Entwerfen einer Halbleiteranordnung A method of manufacturing a semiconductor arrangement and method for designing a semiconductor device
04/26/2012DE112005001365B4 Wärmeableitungseinrichtung mit verbesserter Siede/Kondensationsstruktur Heat dissipation device with improved boiling / condensation structure
04/26/2012DE102011113269A1 Halbleitermodul und Verfahren zu seiner Herstellung Semiconductor module and method for its preparation
04/26/2012DE102011084803A1 Leistungshalbleitervorrichtung Power semiconductor device
04/26/2012DE102011054700A1 Halbleiter-ESD-Bauelement und Verfahren Semiconductor device and method ESD
04/26/2012DE102011053302A1 Schichtstapel und Integrierter-Schaltkreis-Anordnungen Layer stack and Integrated-circuit arrangements
04/26/2012DE102011053099A1 Verfahren zum Füllen eines Kontaktlochs in einer Chip-Gehäuse-Anordnung und Chip-Gehäuse-Anordnungen A method of filling a contact hole in a chip package assembly and chip package assemblies
04/26/2012DE102010042721A1 Ausgangswerkstoff einer Sinterverbindung und Verfahren zur Herstellung der Sinterverbindung Starting material compound and a sintering process for producing the sintered compound
04/26/2012DE102010042702A1 Ausgangswerkstoff einer Sinterverbindung und Verfahren zur Herstellung der Sinterverbindung Starting material compound and a sintering process for producing the sintered compound
04/26/2012DE102008011943B4 Sensoranordnung zur Differenzdruckmessung Sensor arrangement for measuring the differential pressure
04/26/2012DE102005057075B4 Halbleiterbauelement mit einer Kupferlegierung als Barrierenschicht in einer Kupfermetallisierungsschicht und Verfahren zu dessen Herstellung A semiconductor device having a copper alloy as a barrier layer in a copper metallization and process for its preparation
04/26/2012DE102005054268B4 Verfahren zur Herstellung eines Halbleiterbauteils mit mindestens einem Halbleiterchip A process for producing a semiconductor device having at least one semiconductor chip
04/26/2012DE102005002763B4 Kupferlegierung mit hoher Festigkeit und hoher Leitfähigkeit Copper alloy having high strength and high conductivity
04/26/2012DE10154495B4 Konzept zur Kompensation der Einflüsse externer Störgrößen auf physikalische Funktionsparameter von integrierten Schaltungen Concept for compensating the influence of external noises, physical function parameters of integrated circuits
04/26/2012DE10023834B4 Verfahren zur Schichtbildung und -strukturierung A method for layer formation and structuring
04/26/2012CA2755589A1 Thermal management system and method
04/25/2012EP2445107A2 Pole-zero elements and related systems and methods
04/25/2012EP2445024A1 Led array module and fabrication method thereof
04/25/2012EP2445005A1 Cooling device with flat spring
04/25/2012EP2445004A1 Laminated wiring board
04/25/2012EP2445000A2 Process for realising a connecting structure
04/25/2012EP2444999A1 Semiconductor device
04/25/2012EP2444769A1 Micro-cooling device
04/25/2012EP2444164A1 Method for applying liquid material, and apparatus and program for same
04/25/2012EP2443654A1 Cooling of electrical components
04/25/2012EP2443653A1 Crack reduction at metal/organic dielectric interface
04/25/2012EP2443652A2 Use of ionomeric silicone thermoplastic elastomers in electronic devices
04/25/2012EP1925192B1 Laminated substrate for mounting electronic parts
04/25/2012CN202206717U 陶瓷基材散热构造 Ceramic substrate cooling structure
04/25/2012CN202206701U 具有高散热面积的散热器 Radiator with high heat area
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