Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
05/2012
05/02/2012CN102437136A Bonding alloy wire and production technology thereof
05/02/2012CN102437135A Wafer-level columnar bump packaging structure
05/02/2012CN102437134A Ultra-small packing body and production method thereof
05/02/2012CN102437133A Semiconductor device
05/02/2012CN102437132A Heat radiating device and manufacturing method thereof
05/02/2012CN102437131A Polyimide passivation protection rectifying chip
05/02/2012CN102437130A Semiconductor device and producing method thereof
05/02/2012CN102437109A Semiconductor structure and manufacturing method thereof
05/02/2012CN102437107A Method for manufacturing integrated circuit with super-thick top-layer metal and integrated circuit
05/02/2012CN102437105A Method for producing integrated circuit having partial redundant through holes and integrated circuit
05/02/2012CN102437103A Method for manufacturing integrated circuit with partially-redundant through holes and integrated circuit
05/02/2012CN102437088A Semiconductor structure and manufacture method thereof
05/02/2012CN102437061A Electronic component and packaging method thereof
05/02/2012CN102437015A Method for increasing metal-insulating layer-metal (MIM) capacitor density in semiconductor device and structure thereof
05/02/2012CN102433481A AlN-particle-reinforced copper composite heat sink material and preparation method thereof
05/02/2012CN102433105A Heat conducting sheet, process for producing the same, and radiator utilizing the sheet
05/02/2012CN102432980A Epoxy resin composition for semiconductor packaging and preparation method thereof
05/02/2012CN102130067B Surface palladium-plated bonding brass wire
05/02/2012CN102128552B Single-sided corrugated plate type pulsating heat pipe
05/02/2012CN101978480B Multilayer wiring, semiconductor device, substrate for display and display
05/02/2012CN101908563B Capacitor and metal-oxide-metal capacitor
05/02/2012CN101877333B Multilayer packaging substrate, manufacture method thereof, and packaging structure of light-emitting semiconductor
05/02/2012CN101872778B Integrated circuit 3d phase change memory array and manufacturing method
05/02/2012CN101866913B Chip encapsulation structure with shielding cover body
05/02/2012CN101859740B Advanced quad flat non-leaded package and manufacturing method thereof
05/02/2012CN101859713B Advanced quad flat non-leaded package and manufacturing method thereof
05/02/2012CN101853821B Cooling method of power-type diode and special cooling fin
05/02/2012CN101840899B Grounding structure
05/02/2012CN101834150B High-heat-dispersion spherical array encapsulation method
05/02/2012CN101730397B Structure and production method of multilayer stereo circuit
05/02/2012CN101685810B Clip for semiconductor components package, semiconductor packaging structure and method
05/02/2012CN101630664B Silver based bonding wire and preparation method thereof
05/02/2012CN101615604B Semiconductor device and semiconductor integrated circuit
05/02/2012CN101578026B Electronic device and radiating unit thereof
05/02/2012CN101569008B Semiconductor device and its fabrication method
05/02/2012CN101548378B 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
05/02/2012CN101546718B Semiconductor device package and method of making a semiconductor device package
05/02/2012CN101485004B Lighting device package
05/02/2012CN101472841B Ceramic powder and method of using the same
05/02/2012CN101472840B Ceramic powder and method of using the same
05/02/2012CN101399260B Circuit module
05/02/2012CN101286485B Semi-conductor module
05/02/2012CN101278387B Amine-free deposition of metal-nitride films
05/02/2012CN101261966B Semiconductor device and method of manufacturing same
05/02/2012CN101207143B 图像检测器以及放射线检测系统 An image detector and a radiation detection system
05/01/2012US8171441 Integrated circuit devices and methods and apparatuses for designing integrated circuit devices
05/01/2012US8169792 Multilayer printed wiring board
05/01/2012US8169767 Boron nitride agglomerated powder and devices comprising the powder
05/01/2012US8169230 Semiconductor device and method of testing the same
05/01/2012US8169090 Encapsulating resin composition for preapplication, semiconductor device made with the same, and process for producing the same
05/01/2012US8169089 Semiconductor device including semiconductor chip and sealing material
05/01/2012US8169088 Power converter integrated circuit floor plan and package
05/01/2012US8169086 Semiconductor chip pad structure and method for manufacturing the same
05/01/2012US8169085 Semiconductor device and method of fabricating the same
05/01/2012US8169083 Semiconductor device
05/01/2012US8169082 Semiconductor device and method for manufacturing the same
05/01/2012US8169081 Conductive routings in integrated circuits using under bump metallization
05/01/2012US8169080 Semiconductor device and method of manufacture thereof
05/01/2012US8169079 Copper interconnection structures and semiconductor devices
05/01/2012US8169078 Electrode structure, semiconductor element, and methods of manufacturing the same
05/01/2012US8169077 Dielectric interconnect structures and methods for forming the same
05/01/2012US8169076 Interconnect structures having lead-free solder bumps
05/01/2012US8169074 Semiconductor devices including first and second silicon interconnection regions
05/01/2012US8169073 Semiconductor device and electronic apparatus of multi-chip packaging
05/01/2012US8169072 Semiconductor device, manufacturing method thereof, and electronic device
05/01/2012US8169071 Semiconductor device having vertically offset bond on trace interconnects on recessed and raised bond fingers
05/01/2012US8169070 Semiconductor device
05/01/2012US8169068 IO cell with multiple IO ports and related techniques for layout area saving
05/01/2012US8169067 Low profile ball grid array (BGA) package with exposed die and method of making same
05/01/2012US8169066 Semiconductor package
05/01/2012US8169065 Stackable circuit structures and methods of fabrication thereof
05/01/2012US8169064 Nested integrated circuit package on package system
05/01/2012US8169062 Integrated circuit package for semiconductior devices with improved electric resistance and inductance
05/01/2012US8169061 Stacked chip package structure with leadframe having bus bar
05/01/2012US8169060 Integrated circuit package assembly including wave guide
05/01/2012US8169059 On-chip RF shields with through substrate conductors
05/01/2012US8169058 Semiconductor device and method of stacking die on leadframe electrically connected by conductive pillars
05/01/2012US8169055 Chip guard ring including a through-substrate via
05/01/2012US8169049 Semiconductor device with fuse portion
05/01/2012US8169028 Semiconductor device
05/01/2012US8169000 Lateral transient voltage suppressor with ultra low capacitance
05/01/2012US8168970 Die having embedded circuitry with test and test enable circuitry
05/01/2012US8168969 Semiconductor-on-diamond devices and methods of forming
05/01/2012US8168896 Electronic housing
05/01/2012US8168533 Through-silicon via structure and method for making the same
05/01/2012US8168532 Method of manufacturing a multilayer interconnection structure in a semiconductor device
05/01/2012US8167626 Probes with wipe
05/01/2012US8167463 Power surface mount light emitting die package
04/2012
04/27/2012DE202012003495U1 Kühlvorrichtung Cooler
04/27/2012DE202012002239U1 Kunststoffbefestigung-klammer zur Halbleiterbefestigung Plastic mounting clip-on mounting semiconductor
04/26/2012WO2012054711A2 Power/ground layout for chips
04/26/2012WO2012054687A1 Incident radiation detector packaging
04/26/2012WO2012054335A1 Enhanced stacked microelectronic assemblies with central contacts and improved thermal characteristic
04/26/2012WO2012054158A1 Maintaining thermal uniformity in micro-channel cold plates with two-phase flows
04/26/2012WO2012053981A1 Miniature passive structures for esd protection and input and output matching
04/26/2012WO2012053750A1 Semiconductor chip package, semiconductor module, and method for manufacturing same
04/26/2012WO2012053697A1 Porous heat sink and method for bonding same
04/26/2012WO2012053624A1 Cooling device and method for producing same
04/26/2012WO2012053589A1 Adhesive composition, method for producing semiconductor device, and semiconductor device
04/26/2012WO2012053526A1 Oxide nanoparticle reaction product, and silicone composition
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