Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
05/2012
05/03/2012US20120104594 Grounded seal ring structure in semiconductor devices
05/03/2012US20120104593 Electronic device and method for manufacturing electronic device
05/03/2012US20120104592 Semiconductor module having a semiconductor chip stack and method
05/03/2012US20120104591 Systems and methods for improved heat dissipation in semiconductor packages
05/03/2012US20120104590 Semiconductor Device and Method of Forming Penetrable Film Encapsulant Around Semiconductor Die and Interconnect Structure
05/03/2012US20120104589 Deposition-free sealing for Micro- and Nano-fabrication
05/03/2012US20120104588 Method for manufacturing leadframe, packaging method for using the leadframe and semiconductor package product
05/03/2012US20120104587 Direct Contact Semiconductor Package with Power Transistor
05/03/2012US20120104586 Direct Contact Flip Chip Package with Power Transistors
05/03/2012US20120104585 Integrated circuit packaging system with lead frame and method of manufacture thereof
05/03/2012US20120104584 Semiconductor device packages with protective layer and related methods
05/03/2012US20120104583 Semiconductor device and method of packaging same
05/03/2012US20120104582 High Power Ceramic on Copper Package
05/03/2012US20120104581 Semiconductor package device with a heat dissipation structure and the packaging method thereof
05/03/2012US20120104580 Substrateless power device packages
05/03/2012US20120104579 Integrated circuit package system with encapsulation lock
05/03/2012US20120104578 Approach for Bonding Dies onto Interposers
05/03/2012US20120104577 Semiconductor package and electronic component package
05/03/2012US20120104576 Interconnect structure for high frequency signal transmissions
05/03/2012US20120104575 Slot-Shielded Coplanar Strip-line Compatible with CMOS Processes
05/03/2012US20120104574 Integrated antennas in wafer level package
05/03/2012US20120104573 Semiconductor Device and Method of Shielding Semiconductor Die from Inter-Device Interference
05/03/2012US20120104572 Semiconductor package module
05/03/2012US20120104571 Semiconductor package and manufacturing method thereof
05/03/2012US20120104570 Semiconductor package module
05/03/2012US20120104569 Integrated circuits and fabrication methods thereof
05/03/2012US20120104568 Semiconductor device and method for manufacturing the same
05/03/2012US20120104566 Passivation layer structure of semiconductor device and method for forming the same
05/03/2012US20120104562 Semiconductor Device and Method of Forming Stepped Interconnect Layer for Stacked Semiconductor Die
05/03/2012US20120104560 Semiconductor device having a through electrode
05/03/2012US20120104545 Anti-Fuse Element
05/03/2012US20120104544 Semiconductor device
05/03/2012US20120104543 High-speed memory sockets and interposers
05/03/2012US20120104542 Semiconductor Structure With Contact Structure and Manufacturing Method of the Same
05/03/2012US20120104499 Semiconductor device for preventing plasma induced damage
05/03/2012US20120104463 Devices and memory arrays including bit lines and bit line contacts
05/03/2012US20120104435 Refractive index tuning of wafer level package leds
05/03/2012US20120104389 Sacrificial waveguide test structures
05/03/2012US20120104388 Three-dimensional stacked semiconductor integrated circuit and tsv repair method thereof
05/03/2012US20120104387 Four-Terminal Metal-Over-Metal Capacitor Design Kit
05/03/2012US20120104134 Fill roll for producing semiconductor device
05/03/2012US20120103682 Lead frame having metal cup with enlarged heat-disspiation area
05/03/2012US20120103391 Solar power structure and column capital for the same
05/03/2012US20120102734 Methods for forming circuit pattern forming region in an insulating substrate
05/03/2012DE102011085348A1 Integrierte Antennen in einem Waferebenengehäuse Integrated antennas in a wafer-level housing
05/03/2012DE102011085282A1 Korrosionsgeschütztes Halbleitermodul und Verfahren zur Herstellung eines korrosionsgeschützten Halbleitermoduls Corrosion-protected semiconductor module and method of producing a corrosion-resistant semiconductor module
05/03/2012DE102011083243A1 Halbleitervorrichtung Semiconductor device
05/03/2012DE102011054012A1 Halbleitergehäuse und Verfahren, dieselben herzustellen Produce semiconductor package and method, the same
05/03/2012DE102010032936A1 Anordnung zum Kühlen von Wärme erzeugenden elektrischen Bauelementen, Kondensatorbaugruppe und Herstellverfahren für eine Anordnung Arrangement for cooling heat generating electrical components, capacitor assembly and manufacturing method of an array
05/03/2012DE102004014472B4 Anwendungsspezifischer integrierter Halbleiter-Schaltkreis Application specific integrated semiconductor circuit
05/03/2012CA2813726A1 Photonics module and method of manufacturing
05/02/2012EP2448378A1 Composite build-up materials for embedding of active components
05/02/2012EP2448377A1 Multi-pattern wiring substrate, wiring-substrate, and electronic device
05/02/2012EP2448028A2 Light emitting apparatus and production method thereof
05/02/2012EP2447995A1 Secured electronic integrated circuit
05/02/2012EP2447994A2 Electronic component and electronic device
05/02/2012EP2447993A1 Electronic module and packaging method thereof
05/02/2012EP2447992A2 Thermal management system and method
05/02/2012EP2447991A2 Contact element and use of a contact element in an electronic component
05/02/2012EP2447990A1 Base plate
05/02/2012EP2447989A1 Semiconductor package and semiconductor package mounting structure
05/02/2012EP2447988A1 Power electronic device with edge passivation
05/02/2012EP2447986A1 Resin encapsulation molding method and apparatus for electrical circuit component
05/02/2012EP2447985A1 Method for performing interconnection or redirection lines of at least an integrated circuit component
05/02/2012EP2447959A1 Esd protection device and method for manufacturing same
05/02/2012EP2447380A1 Copper alloy bonding wire for semiconductor
05/02/2012EP2447235A1 Metal-ceramic substrate and method for manufacturing such a substrate
05/02/2012EP2446722A1 Passive cooling enclosure system and method for electronics devices
05/02/2012EP2446477A1 Applying chiplets to substrates
05/02/2012EP2043809B1 Method of on-the-fly laser processing at non-constant velocities
05/02/2012EP1964174B1 Enhanced substrate using metamaterials
05/02/2012EP1927117B1 A trimmable film resistor and a method for forming and trimming a film resistor
05/02/2012EP1665379B1 Electronic package having a folded flexible substrate and method of manufacturing the same
05/02/2012EP1191587B1 Packaging structure and method for automotive components
05/02/2012CN202210534U 半导体封装结构 The semiconductor package structure
05/02/2012CN202210519U CSP integrated circuit chip for improving unit area pin quantity
05/02/2012CN202210518U Thin-type heat pipe radiator
05/02/2012CN202210517U Assembled radiating fin with triode
05/02/2012CN202210516U Copper strip used for lead frame
05/02/2012CN102439719A System-in packages
05/02/2012CN102439717A Slip chip device and method
05/02/2012CN102439716A Inks and pastes for solar cell fabrication
05/02/2012CN102439715A Heat exchanger and method of manufacturing the same
05/02/2012CN102439714A Heat sink for a protrusion-type ic package
05/02/2012CN102439713A Bumped, self-isolated gan transistor chip with electrically isolated back surface
05/02/2012CN102439704A Packaging techniques and configurations
05/02/2012CN102438432A Chip heat-radiating device and electronic device
05/02/2012CN102438430A Auxiliary heat pipe radiator and radiating fins thereof
05/02/2012CN102437162A Standard single-gate complementary metal oxide semiconductor (CMOS) process-based electrically-erasable programmable read-only memory (EEPROM)
05/02/2012CN102437147A Dense-pitch small-pad copper-line bonded intelligent card (IC) chip stacking packing piece and preparation method thereof
05/02/2012CN102437146A Optimization method of through hole key size detection territory
05/02/2012CN102437145A Self-formed gradient Zr/ZrN double layer diffusion barrier layer and preparation method thereof
05/02/2012CN102437144A Ruthenium (Ru)-ruthenium oxide(RuO)/ ruthenium(Ru)-germanium(Ge)-copper(Cu) self-formed double-layer amorphous diffusion barrier layer and preparation method thereof
05/02/2012CN102437143A Low dielectric constant material
05/02/2012CN102437142A Metal interconnecting structure for reducing resistance of through hole and forming method thereof
05/02/2012CN102437141A Dense-pitch small-pad copper-wire bonded single intelligent card (IC) chip packing piece and preparation method thereof
05/02/2012CN102437140A Power semiconductor module having sintered metal connections and production method
05/02/2012CN102437139A Semiconductor package and method for manufacturing the same
05/02/2012CN102437138A Semiconductor device
05/02/2012CN102437137A Compound metal wire
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