Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
05/2012
05/08/2012US8174106 Through board stacking of multiple LGA-connected components
05/08/2012US8174105 Stacked semiconductor package having discrete components
05/08/2012US8174104 Semiconductor arrangement having specially fashioned bond wires
05/08/2012US8174103 Enhanced architectural interconnect options enabled with flipped die on a multi-chip package
05/08/2012US8174102 Semiconductor device
05/08/2012US8174101 Microelectronic devices and microelectronic support devices, and associated assemblies and methods
05/08/2012US8174100 Light source using a light-emitting diode
05/08/2012US8174099 Leadless package with internally extended package leads
05/08/2012US8174097 Electric sub-assembly
05/08/2012US8174096 Stamped leadframe and method of manufacture thereof
05/08/2012US8174093 Multichip semiconductor device, chip therefor and method of formation thereof
05/08/2012US8174091 Fuse structure
05/08/2012US8174078 Flat-panel display semiconductor process for efficient manufacturing
05/08/2012US8174077 High-voltage variable breakdown voltage (BV) diode for electrostatic discharge (ESD) applications
05/08/2012US8174052 Standard cell libraries and integrated circuit including standard cells
05/08/2012US8174027 Semiconductor light emitting device and method for manufacturing same
05/08/2012US8174011 Positional offset measurement pattern unit featuring via-plug and interconnections, and method using such positional offset measurement pattern unit
05/08/2012US8174010 Unified test structure for stress migration tests
05/08/2012US8173552 Method of fabricating an identification mark utilizing a liquid film assisted by a laser
05/08/2012US8173542 Method of forming conductive layer and semiconductor device
05/08/2012US8173537 Methods for reducing UV and dielectric diffusion barrier interaction
05/08/2012US8173488 Electronic device and method of manufacturing same
05/08/2012US8173478 Method of manufacturing metal wiring and method of manufacturing semiconductor device
05/08/2012US8173454 Light emitting diode package and method of manufacturing the same
05/08/2012US8173245 Peelable tape carrier
05/08/2012US8171624 Method and system for preparing wireless communication chips for later processing
05/07/2012DE202012101462U1 Kapselung einer Weißlichtleuchtdiode mit Lichtmischungswirkung Encapsulation of a white light LED with light mixing effect
05/04/2012DE202012003926U1 Anordnung zum technologisch optimierten Ausführen von Lötverbindungen Arrangement for technologically optimized execution of solder joints
05/03/2012WO2012058535A1 Method for fabrication of (al, in, ga) nitride based vertical light emitting diodes with enhanced current spreading of n-type electrode
05/03/2012WO2012058189A1 An apparatus for monolithic power gating on an integrated circuit
05/03/2012WO2012058074A2 Thermal isolation in 3d chip stacks using gap structures and contactless communications
05/03/2012WO2012057953A1 Lead-free structures in a semiconductor device
05/03/2012WO2012057816A1 Systems and methods for improved heat dissipation in semiconductor packages
05/03/2012WO2012057731A1 Photonics module and method of manufacturing
05/03/2012WO2012057286A1 Wiring board
05/03/2012WO2012057234A1 Substrate for light-emitting element, and light emitting device
05/03/2012WO2012057228A1 Phenol-type oligomer and process for production thereof
05/03/2012WO2012057200A1 Process for manufacture of through-type wiring substrate, and through-type wiring substrate
05/03/2012WO2012057137A1 Electronic device
05/03/2012WO2012056880A1 Cooling structure
05/03/2012WO2012056809A1 Semiconductor device, heat radiation member, and manufacturing method for semiconductor device
05/03/2012WO2012056663A1 Circuit board, method for manufacturing same and display device
05/03/2012WO2012056615A1 Semiconductor device
05/03/2012WO2012056607A1 Capacitance array body and signal processing device comprising same
05/03/2012WO2012055785A1 Composite build-up materials for embedding of active components
05/03/2012WO2012055781A1 Thermal power plane for integrated circuits
05/03/2012WO2012055726A1 Process for producing interconnect or redirect lines for at least one integrated-circuit component
05/03/2012WO2012055661A1 Optoelectronic semiconductor component comprising a semiconductor chip, a carrier substrate and a film and a method for producing said component
05/03/2012WO2012055206A1 Alumina/graphite composite ceramic material and led light source utilizing the material as substrate
05/03/2012WO2012055199A1 Semiconductor structure and manufacturing method thereof
05/03/2012WO2012055085A1 Method for bonding wire between chips or between chip and metal frame
05/03/2012WO2012054960A1 Electronic device in plastic
05/03/2012WO2011157171A3 Insulating ring for packaging, insulating ring assembly, and package
05/03/2012WO2011140402A3 Potting for electronic components
05/03/2012WO2011032120A3 Underfill for high density interconnect flip chips
05/03/2012US20120108060 Semiconductor device having silicon-diffused metal wiring layer and its manufacturing method
05/03/2012US20120108045 Method for radiation hardening a semiconductor device
05/03/2012US20120106282 Pattern layout in semiconductor device
05/03/2012US20120106117 Ultra-thin interposer assemblies with through vias
05/03/2012US20120106110 Hybrid integrated circuit device, and method for fabricating the same, and electronic device
05/03/2012US20120105696 Solid-state imaging device, semiconductor device, manufacturing methods thereof, and electronic apparatus
05/03/2012US20120105093 Semiconductor apparatus and method of testing and manufacturing the same
05/03/2012US20120104634 Chip package structure and manufacturing methods thereof
05/03/2012US20120104633 Electronic device and electronic apparatus
05/03/2012US20120104632 Process for fabricating an integrated circuit comprising an analog block and a digital block, and corresponding integrated circuit
05/03/2012US20120104631 Semiconductor module
05/03/2012US20120104630 Methods for Pitch Reduction
05/03/2012US20120104629 Reversible top/bottom mems package
05/03/2012US20120104628 Interposer for semiconductor package
05/03/2012US20120104627 Semiconductor chips having redistributed power/ground lines directly connected to power/ground lines of internal circuits and methods of fabricating the same
05/03/2012US20120104626 Process of forming an electronic device including a plurality of singulated die
05/03/2012US20120104625 Semiconductor packages and methods of fabricating the same
05/03/2012US20120104624 Semiconductor Device and Method of Stacking Semiconductor Die in Mold Laser Package Interconnected by Bumps and Conductive Vias
05/03/2012US20120104623 Semiconductor Device and Method of Forming Stepped Interposer for Stacking and Electrically Connecting Semiconductor Die
05/03/2012US20120104622 Through Level Vias and Methods of Formation Thereof
05/03/2012US20120104621 Power package module and method for fabricating the same
05/03/2012US20120104620 Contact pad array
05/03/2012US20120104619 Sublithographic patterning employing image transfer of a controllably damaged dielectric sidewall
05/03/2012US20120104618 Low temperature bonding material and bonding method
05/03/2012US20120104617 Semiconductor device and method for manufacturing the same
05/03/2012US20120104615 Microelectronic device provided with an array of elements made from a conductive polymer with a positive temperature coefficient
05/03/2012US20120104614 Semiconductor device manufacturing method and semiconductor device
05/03/2012US20120104613 Bonding wire for semiconductor device
05/03/2012US20120104612 Semiconductor device and method for manufacturing the same
05/03/2012US20120104611 Semiconductor structure with insulated through silicon via
05/03/2012US20120104610 Interconnect structure with enhanced reliability
05/03/2012US20120104609 Discrete circuit component having copper block electrodes and method of fabrication
05/03/2012US20120104607 Stacked semiconductor packages and related methods
05/03/2012US20120104606 Ball grid array semiconductor device and its manufacture
05/03/2012US20120104605 Chip Design having Integrated Fuse and Method for the Production Thereof
05/03/2012US20120104604 Crack arrest vias for ic devices
05/03/2012US20120104603 Interconnect assemblies and methods of making and using same
05/03/2012US20120104602 Semiconductor device, method for manufacturing semiconductor device, and circuit device using semiconductor device
05/03/2012US20120104601 Semiconductor Device and Method of Forming Wafer Level Ground Plane and Power Ring
05/03/2012US20120104600 Structure, semiconductor structure and method of manufacturing a semiconductor structure and packaging thereof
05/03/2012US20120104599 Semiconductor Package Having Semiconductor Die with Internal Vertical Interconnect Structure and Method Therefor
05/03/2012US20120104598 Package structure having embedded semiconductor component and fabrication method thereof
05/03/2012US20120104597 Chip-on-chip structure and manufacturing method therof
05/03/2012US20120104596 Flip chip bump array with superior signal performance
05/03/2012US20120104595 No flow underfill
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