Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
05/2012
05/09/2012CN102446890A Semiconductor device, method of manufacturing same and adsorption site blocking atomic layer deposition method
05/09/2012CN102446889A Transformer arrangement
05/09/2012CN102446888A Semiconductor device having multilayer wiring structure and manufacturing method of the same
05/09/2012CN102446887A Circuit structure of simulation cascaded inductance capable of being reduced at equal proportion and method
05/09/2012CN102446886A 3D (three-dimensional) integrated circuit structure and forming method thereof
05/09/2012CN102446885A Semiconductor power module and method of manufacturing same
05/09/2012CN102446884A Package unit and stacking structure thereof and method for manufacturing package unit
05/09/2012CN102446883A Universal package substrate, package structure and package method
05/09/2012CN102446882A Semiconductor PiP (package in package) system structure and manufacturing method thereof
05/09/2012CN102446881A Universal packaging substrate and packaging method thereof
05/09/2012CN102446880A Semiconductor module comprising insert and method for producing semiconductor module comprising insert
05/09/2012CN102446879A Monolithic cold plate configuration
05/09/2012CN102446878A Semiconductor refrigerating device
05/09/2012CN102446877A Semiconductor cooling device
05/09/2012CN102446876A Heat radiating device
05/09/2012CN102446875A 半导体装置 Semiconductor device
05/09/2012CN102446874A Material mixing prevention structure for heat-conducting element, jig thereof and method for preventing material mixing thereof
05/09/2012CN102446873A Heat radiator
05/09/2012CN102446872A Sandwich-type planar radiator with printed circuit
05/09/2012CN102446871A Heat radiating device
05/09/2012CN102446870A Packaging component with electrostatic discharge and anti-interference of electromagnetic wave functions
05/09/2012CN102446869A Diode
05/09/2012CN102446868A Novel dual-interface smart card module and implementation method thereof
05/09/2012CN102446867A Power semiconductor module with a base module and a connection module
05/09/2012CN102446866A Power semiconductor module with a base module and a connection module
05/09/2012CN102446865A Crack stop barrier and method of manufacturing thereof
05/09/2012CN102446864A Power module and method for manufacturing same
05/09/2012CN102446863A Semiconductor package member and method of manufacturing same
05/09/2012CN102446837A Manufacturing of a device including a semiconductor chip
05/09/2012CN102446836A Damascus process with metal protection layer on copper interconnection wire
05/09/2012CN102446830A Cost-Effective TSV Formation
05/09/2012CN102446811A Metal interconnecting structure and methods for forming metal interlayer through holes and interconnecting metal wire
05/09/2012CN102446776A Method of manufacturing electronic device and electronic device
05/09/2012CN102446775A Non-carrier semiconductor packaging component and manufacturing method thereof
05/09/2012CN102446774A Method of manufacturing a base plate for mounting semiconductor elements
05/09/2012CN102446773A Carrier tape for tab-package and manufacturing method thereof
05/09/2012CN102446749A Method for achieving accurate graphic positioning during observation using scanning electron microscope
05/09/2012CN102446733A Power device with high-voltage radio-frequency lateral diffusion structure and production method of power device
05/09/2012CN102446542A Three-dimensional stacked semiconductor integrated circuit
05/09/2012CN102445020A Vehicle-mounted refrigerator semiconductor refrigerating chip heat dissipation assembly
05/09/2012CN101930936B Method of manufacturing semiconductor package and method of manufacturing substrate for the semiconductor package
05/09/2012CN101908510B Semiconductor device with heat-radiating and packaging structure and manufacturing method thereof
05/09/2012CN101887885B Stacking structure of semiconductor packages
05/09/2012CN101877344B Connection hole test structure and method for preparing transmission electron microscopy
05/09/2012CN101874301B Contact structure for an electronic circuit substrate and electronic circuit comprising said contact structure
05/09/2012CN101807532B Ultra-thin chip inversely packaging method and packaged body
05/09/2012CN101771014B Wafer-level package structure and package method thereof
05/09/2012CN101730936B Heat transfer sheet and radiator structure
05/09/2012CN101675517B Microchip with active control for temperature and manufacture method thereof
05/09/2012CN101661916B Structure for re-wiring layer on soft film flip chip encapsulation
05/09/2012CN101641787B Semiconductor device and electric vehicle
05/09/2012CN101615608B Semiconductor device and method of manufacturing same
05/09/2012CN101609826B Power semiconductor module
05/09/2012CN101552259B Semiconductor device
05/09/2012CN101552249B Semiconductor package structure
05/09/2012CN101546774B Active element array substrate
05/09/2012CN101533830B Electrostatic discharge protecting device of high-voltage cushion
05/09/2012CN101506965B Semiconductor chip, semiconductor mounting module, mobile communication device, and process for producing semiconductor chip
05/09/2012CN101473435B High voltage valve set with enhanced disruptive strength
05/09/2012CN101459190B AC illuminating device and manufacturing method thereof
05/09/2012CN101388352B MOSFET and linking method thereof
05/09/2012CN101378193B Method and apparatus for providing electrostatic discharge protection for a power supply
05/09/2012CN101359600B Integrated circuit packaging system for fine pitch substrates
05/09/2012CN101351886B ASIC design using clock and power grid standard cell
05/09/2012CN101315930B Semiconductor device
05/09/2012CN101308803B Semiconductor device manufacture method
05/09/2012CN101286457B Wiring board and method of manufacturing the same
05/09/2012CN101202291B Array substrate and display panel having the same
05/09/2012CN101159226B Method of forming pad patterns using self-align double patterning method, and method of forming contact holes using self-align double patterning method
05/09/2012CN101154689B Semiconductor device
05/09/2012CN101127350B Apparatus, system and method for use in mounting electronic elements
05/09/2012CN101069279B Semiconductor device and its manufacturing method
05/09/2012CN101013685B Package substrate
05/08/2012US8175673 Analyte monitoring device and methods of use
05/08/2012US8174860 Semiconductor memory device having improved voltage transmission path and driving method thereof
05/08/2012US8174830 System and method for a substrate with internal pumped liquid metal for thermal spreading and cooling
05/08/2012US8174349 Electronic component and manufacturing method of electronic component
05/08/2012US8174132 Folded surface capacitor in-line assembly
05/08/2012US8174131 Semiconductor device having a filled trench structure and methods for fabricating the same
05/08/2012US8174130 Laser dicing sheet and manufacturing method for chip body
05/08/2012US8174129 Silicon-based thin substrate and packaging schemes
05/08/2012US8174128 Method of manufacturing semiconductor package having a first board, second boards electrically connected to both sides of the first board, and at least one component connected to the first board by a flip chip method
05/08/2012US8174127 Integrated circuit package system employing device stacking
05/08/2012US8174126 Stacked multi-chip
05/08/2012US8174125 Manufacturing method of a semiconductor device
05/08/2012US8174124 Dummy pattern in wafer backside routing
05/08/2012US8174123 Semiconductor integrated circuit
05/08/2012US8174122 Semiconductor device
05/08/2012US8174121 Semiconductor device and manufacturing method thereof
05/08/2012US8174120 Integrated circuit package system with leadframe substrate
05/08/2012US8174119 Semiconductor package with embedded die
05/08/2012US8174118 Detection device and method for manufacturing the same
05/08/2012US8174117 Semiconductor device and method of manufacturing the same
05/08/2012US8174116 Spacer, and its manufacturing method
05/08/2012US8174114 Semiconductor package structure with constraint stiffener for cleaning and underfilling efficiency
05/08/2012US8174113 Methods of fabricating robust integrated heat spreader designs and structures formed thereby
05/08/2012US8174112 Integrated circuit device with low capacitance and high thermal conductivity interface
05/08/2012US8174110 Semiconductor device having at least two terminals among the plurality of terminals electrically connected to each other while not being adjacent to one other and not being connected to internal circuit
05/08/2012US8174109 Electronic device and method of manufacturing same
05/08/2012US8174108 Method for facilitating the stacking of integrated circuits having different areas and an integrated circuit package constructed by the method
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