Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
05/2012
05/10/2012US20120112337 Optoelectronic Component, and Method for the Production of an Optoelectronic Component
05/10/2012US20120112336 Encapsulated die, microelectronic package containing same, and method of manufacturing said microelectronic package
05/10/2012US20120112335 Novel bonding process and bonded structures
05/10/2012US20120112334 Packaging structure of a micro-device including a getter material
05/10/2012US20120112333 Semiconductor device with nested rows of contacts
05/10/2012US20120112332 Resin-sealed semiconductor device and method for fabricating the same
05/10/2012US20120112331 Dual Lead Frame Semiconductor Package and Method of Manufacture
05/10/2012US20120112330 Semiconductor device
05/10/2012US20120112329 Chip package
05/10/2012US20120112328 Semiconductor Device and Method of Mounting Pre-Fabricated Shielding Frame over Semiconductor Die
05/10/2012US20120112327 Semiconductor Device and Method of Forming Prefabricated EMI Shielding Frame with Cavities Containing Penetrable Material Over Semiconductor Die
05/10/2012US20120112326 Semiconductor Device and Method of Forming Prefabricated EMI Shielding Frame with Cavities Containing Penetrable Material Over Semiconductor Die
05/10/2012US20120112324 Through-wafer interconnection
05/10/2012US20120112313 Anti-Fuse Element
05/10/2012US20120112289 Semiconductor structure with multi-layer contact etch stop layer structure
05/10/2012US20120112201 High melting point soldering layer and fabrication method for the same, and semiconductor device
05/10/2012DE112010001158T5 Heisswasserkühlvorrichtung Hot water cooler
05/10/2012DE112010000886T5 Hochfrequenzmodul RF module
05/10/2012DE102011116233A1 Verringerung der Ausbildung von Oxiden auf Lötmitteln Reducing the formation of oxides on solders
05/10/2012DE102011014673A1 Wafer-Level-Gehäuse mit Wärmeableitung Wafer-level package with heat dissipation
05/10/2012DE102011004774A1 Integrierte Schaltung mit einer strahlungsempfindlichen Thyristorstruktur An integrated circuit comprising a radiation-sensitive thyristor
05/10/2012DE102010054021A1 Closure structure for plate-shaped heat pipe, has notch attached to side or to intersection area, and conduit provided with closed end, where end of conduit is inserted into cavity that is formed in main body
05/10/2012DE102010050764A1 Electrostatic discharge-protection circuit for integrated circuit, has switch comprising inverting control input, and node connected with cathode and anode of diode with supply potential, where supply potential is formed below threshold
05/10/2012DE102010050343A1 Chipintegrierte Durchkontaktierung von Mehrlagensubstraten Integrated chip through connection of multi-layer substrates
05/10/2012DE102010050342A1 Laminat mit integriertem elektronischen Bauteil Laminate with integrated electronic component
05/10/2012DE102010043362A1 Leistungshalbleitermodul mit einem Substrat mit einer Mehrzahl gleichartig ausgebildeter Leiterbahngruppen Power semiconductor module comprising a substrate having a plurality of similarly formed conductor groups
05/10/2012DE102010023003A1 Halbleiter-Bauteil mit integrierter Kammer für ein Kühlmittel sowie Methode zum Herstellen eines Halbleiter-Bauteils mit integrierter Kammer für ein Kühlmittel und Aufnahme-Vorrichtung zur Aufnahme eines derartigen Halbleiter-Bauteils Semiconductor device with an integrated chamber for a coolant, as well as method of manufacturing a semiconductor device with an integrated chamber for a cooling medium and recording apparatus for recording of such a semiconductor device
05/10/2012CA2816468A1 High-voltage switch with cooling device
05/10/2012CA2815147A1 Power electronic device with edge passivation
05/09/2012EP2451259A1 Module and process for production thereof
05/09/2012EP2451254A1 A radio frequency circuit board topology
05/09/2012EP2450972A1 Light emitting devices having a reflective bond pad and methods of fabricating light emitting devices having reflective bond pads
05/09/2012EP2450955A2 Termination and contact structures for a high voltage GaN-based heterojunction transistor
05/09/2012EP2450952A2 Semiconductor module with a substrate with a number of identically designed conductor line groups
05/09/2012EP2450951A1 Quad flat package with exposed paddle
05/09/2012EP2450950A2 Dual-sided heat removal system
05/09/2012EP2450949A1 Structure for encapsulating a microdevice comprising a getter material
05/09/2012EP2450393A1 Silicone resin, sealing material, and optical semiconductor device
05/09/2012EP2450182A1 Metal laminate structure and process for production of metal laminate structure
05/09/2012EP2449588A2 Integrated power amplifier with load inductor located under ic die
05/09/2012EP2449587A1 Electronic device having a molding compound including a composite material
05/09/2012EP2449586A2 Electronic device
05/09/2012EP2449582A2 Methods and structures for a vertical pillar interconnect
05/09/2012EP2449581A1 Method for producing an electronic component
05/09/2012EP1762582B1 Epoxy resin composition
05/09/2012EP1734569B1 Process for producing semiconductor module
05/09/2012EP1391923B1 Manufacturing method of semiconductor device
05/09/2012CN202218308U Camera device
05/09/2012CN202218152U IGBT (Insulated Gate Bipolar Transistor) heat-radiation structure of photovoltaic inverter
05/09/2012CN202217665U Cooling triode
05/09/2012CN202217660U Sealing module of large-power thyrister
05/09/2012CN202217659U Loop type radiation device
05/09/2012CN202217658U Fixing structure of radiation device
05/09/2012CN202217657U Semi-conductor chip refrigerating device
05/09/2012CN202217656U 陶瓷基片 Ceramic substrate
05/09/2012CN1992080B Semiconductor device
05/09/2012CN1976807B Resin-impregnated flexible graphite articles
05/09/2012CN1949511B 显示器件及其制造方法 A display device and manufacturing method thereof
05/09/2012CN1921095B Semiconductor chip, display panel using the same, and methods of manufacturing semiconductor chip and display panel using the same
05/09/2012CN1890790B Method of making a microelectronic assembly
05/09/2012CN1791975B Manufacture method of electrical connections in substrates and the substrate
05/09/2012CN1790750B Thin film transistor, method of manufacturing the same, display apparatus having the same and method of manufacturing the display apparatus
05/09/2012CN1747154B Wafer supporting board, thin wafer holding method and manufacture of semiconductor device
05/09/2012CN1442901B Device and method of manufacturing integrated circuit
05/09/2012CN102449763A Nonvolatile memory element and method for manufacturing same
05/09/2012CN102449761A Silicone coated light-emitting diode
05/09/2012CN102449760A Microelectronic assembly with impedance controlled wirebond and conductive reference element
05/09/2012CN102449759A Radiator
05/09/2012CN102449758A Cooled electric unit
05/09/2012CN102449757A Systems and methods of improved heat dissipation with variable pitch grid array packaging
05/09/2012CN102449756A Heatsink-combined package and method for manufacturing same
05/09/2012CN102449750A Method for welding chip to electronic circuit
05/09/2012CN102449192A Electroless palladium plating solution
05/09/2012CN102449034A Organic silicon compound, thermosetting composition containing said organic silicon compound, and sealing material for optical semiconductor
05/09/2012CN102449020A Resin composition for semiconductor encapsulation, and semiconductor device
05/09/2012CN102448663A Solder material, heat dissipation base using same, and electronic device
05/09/2012CN102447383A Semiconductor component of integration converter and packaging structure thereof
05/09/2012CN102447168A Adhesive film, and connection structure and connecting method for circuit member
05/09/2012CN102447018A Improved combination structure and combining method of baseplate and heat dissipating structure
05/09/2012CN102446996A Flexible transparent high-barrier packaging membrane
05/09/2012CN102446977A Axial commutation diode
05/09/2012CN102446916A Integrated circuits with magnetic core inductors and methods of fabrications thereof
05/09/2012CN102446910A Novel high-power module
05/09/2012CN102446907A Three-dimensional packaging structure and making method thereof
05/09/2012CN102446906A Integrated circuit device and method for manufacturing same
05/09/2012CN102446905A Field-effect component electrostatic protector
05/09/2012CN102446904A DIP (dual in-line package) component electrostatic protector
05/09/2012CN102446903A Component structure for detecting filling ability of pre-metal dielectric
05/09/2012CN102446902A Graphic structure integrating dimensional measurement and overlay accuracy detection and method thereof
05/09/2012CN102446901A Failure analysis structure, formation method of failure analysis structure and failure analysis method
05/09/2012CN102446900A Electromigration reliability test structure and making method for multilayer of metal interconnected metal wires
05/09/2012CN102446899A 半导体器件 Semiconductor devices
05/09/2012CN102446898A Integrated circuit on-chip inductor structure with multiple substrate shielding layers
05/09/2012CN102446897A Metal-insulation layer-metal capacitor
05/09/2012CN102446896A Spiral intermetallic capacitor structure and layout thereof
05/09/2012CN102446895A High performance metal-oxide-metal capacitor and manufacturing method thereof
05/09/2012CN102446894A High-performance metal-oxide-metal capacitor and manufacturing method thereof
05/09/2012CN102446893A High-performance metal-oxide-metal capacitor and manufacturing method thereof
05/09/2012CN102446892A High-performance metal-oxide-metal capacitor and manufacturing method thereof
05/09/2012CN102446891A High-performance metal-oxide-metal capacitor and manufacturing method thereof
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