Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
05/2012
05/15/2012US8178959 Process for fabricating a semiconductor component support, support and semiconductor device
05/15/2012US8178958 Semiconductor device having antenna and method for manufacturing thereof
05/15/2012US8178956 Integrated circuit package system for shielding electromagnetic interference
05/15/2012US8178955 Semiconductor device
05/15/2012US8178954 Structure of mixed semiconductor encapsulation structure with multiple chips and capacitors
05/15/2012US8178953 On-chip RF shields with front side redistribution lines
05/15/2012US8178952 Method of forming high-k dual dielectric stack
05/15/2012US8178951 Compound semiconductor substrate and control for electrical property thereof
05/15/2012US8178950 Multilayered through a via
05/15/2012US8178945 Programmable PN anti-fuse
05/15/2012US8178943 Electrical fuse, semiconductor device and method of disconnecting electrical fuse
05/15/2012US8178942 Electrically alterable circuit for use in an integrated circuit device
05/15/2012US8178941 Semiconductor device
05/15/2012US8178935 MEMS chip and package method thereof
05/15/2012US8178928 Intermediate structures having reduced width contact holes that are formed during manufacture of memory cells having contact structures
05/15/2012US8178926 Thin film field effect transistor and display
05/15/2012US8178923 Power semiconductor device having low gate input resistance
05/15/2012US8178909 Integrated circuit cell architecture configurable for memory or logic elements
05/15/2012US8178905 Layout structure of semiconductor device
05/15/2012US8178893 Semiconductor element mounting substrate, semiconductor device using the same, and method for manufacturing semiconductor element mounting substrate
05/15/2012US8178876 Method and configuration for connecting test structures or line arrays for monitoring integrated circuit manufacturing
05/15/2012US8178828 Photo-sensing device, photosensor, and display device
05/15/2012US8178794 Sealing structure
05/15/2012US8178793 Chassis, electronic equipment and manufacturing method for chassis
05/15/2012US8178599 Composition of epoxy resin, spherical alumina, ultrafine silica polyorganosiloxane and phenolic resin
05/15/2012US8178436 Adhesion and electromigration performance at an interface between a dielectric and metal
05/15/2012US8178435 High performance system-on-chip inductor using post passivation process
05/15/2012US8178422 Method of measurement in semiconductor fabrication
05/15/2012US8178394 Quad flat pack in quad flat pack integrated circuit package system and method for manufacturing thereof
05/15/2012US8178392 Electronic system with expansion feature
05/15/2012US8178391 Method for packaging semiconductors at wafer level
05/15/2012US8178364 Testing method of surface-emitting laser device and testing device thereof
05/15/2012US8177716 Analyte monitoring device and methods of use
05/15/2012CA2383703C Method and apparatus for cooling with a phase change material and heat pipes
05/10/2012WO2012061664A1 Integrated circuit chip customization using backside access
05/10/2012WO2012061559A1 Method of making a finger sensor package and associated devices
05/10/2012WO2012061381A2 Crack arrest vias for ic devices
05/10/2012WO2012061363A1 Coating of glass wafers for semiconductor fabrication, processes and methods of making same
05/10/2012WO2012061091A2 Encapsulated die, microelectronic package containing same, and method of manufacturing said microelectronic package
05/10/2012WO2012060819A1 Semiconductor structure with insulated through silicon via
05/10/2012WO2012060461A1 Cooling device and manufacturing method thereof
05/10/2012WO2012060399A1 Method for forming isolation structure
05/10/2012WO2012060341A1 Package for storing electronic component elements
05/10/2012WO2012060337A1 Semiconductor encapsulating non-lead glass and semiconductor encapsulating coating tube
05/10/2012WO2012060336A1 Led-element mounting lead frame, resin-attached lead frame, method of manufacturing semiconductor device, and semiconductor-element mounting lead frame
05/10/2012WO2012060154A1 Radio frequency device module and method for sealing radio frequency device from outside air
05/10/2012WO2012060091A1 Method for forming wiring on surface of three-dimensional structure, intermediate structure for obtaining three-dimensional structure provided with wiring on surface thereof, and three-dimensional structure provided with wiring on surface thereof
05/10/2012WO2012060071A1 Semiconductor chip
05/10/2012WO2012060054A1 Circuit device and method for manufacturing same
05/10/2012WO2012060034A1 Electronic component module
05/10/2012WO2012060022A1 Method for forming tin or solder coat film and device therefor
05/10/2012WO2012059967A1 Sheet-like structure and process for production thereof
05/10/2012WO2012059659A1 Connecting elements for producing hybrid electronic circuits
05/10/2012WO2012059479A1 Device-specific markings
05/10/2012WO2012059193A2 Power electronic devices
05/10/2012WO2012059187A1 Laminate comprising an integrated electronic component
05/10/2012WO2012059186A1 Chip-integrated through-plating of multilayer substrates
05/10/2012WO2012059074A1 High-voltage switch with cooling device
05/10/2012WO2012058926A1 Thermal conductive pad
05/10/2012WO2012058852A1 Miniature surface mount device with large pin pads
05/10/2012WO2012058847A1 Aluminium alloy material and method for preparing aluminium alloy back board
05/10/2012US20120115324 Method for manufacturing a semiconductor device having a refractory metal containing film
05/10/2012US20120115261 Method for manufacturing light emitting device package and frame for manufacturing light emitting device package
05/10/2012US20120113704 In-package microelectronic apparatus, and methods of using same
05/10/2012US20120113609 Quad flat package with exposed paddle
05/10/2012US20120113584 Cooling system for server and cooling method for electronic apparatus
05/10/2012US20120113552 Semiconductor integrated circuit
05/10/2012US20120112784 Differential signal transmission line, ic package, and method for testing said differential signal transmission line and ic package
05/10/2012US20120112370 Template, method of forming template, and method of manufacturing semiconductor device
05/10/2012US20120112369 Silicon structure having bonding pad
05/10/2012US20120112368 Mems sensor package
05/10/2012US20120112367 Chip card, and method for the production thereof
05/10/2012US20120112365 Semiconductor Packages and Methods For Producing The Same
05/10/2012US20120112364 Wiring structure of semiconductor device
05/10/2012US20120112363 Chip structure having redistribution layer
05/10/2012US20120112362 Semiconductor device and method of manufacturing the same
05/10/2012US20120112361 Semiconductor devices and methods of manufacturing the same
05/10/2012US20120112360 Semiconductor chip, stacked semiconductor package having the same, and method for manufacturing stacked semiconductor package
05/10/2012US20120112359 Semiconductor Devices and Fabrication Methods thereof
05/10/2012US20120112358 Stack-type semiconductor device and method for manufacturing the same
05/10/2012US20120112357 System and method for relieving stress and improving heat management in a 3d chip stack having an array of inter-stack connections
05/10/2012US20120112356 System and method for relieving stress and improving heat management in a 3d chip stack
05/10/2012US20120112355 Semiconductor Device and Method of Forming Stepped Interconnect Layer for Stacked Semiconductor Die
05/10/2012US20120112354 Semiconductor device
05/10/2012US20120112353 Organic electronic circuit
05/10/2012US20120112352 Integrated circuit system with distributed power supply
05/10/2012US20120112351 Semiconductor device packaging method and semiconductor device package
05/10/2012US20120112350 Semiconductor structure and method for making same
05/10/2012US20120112349 Semiconductor device
05/10/2012US20120112348 Devices, methods, and systems for wafer bonding
05/10/2012US20120112347 Flexible electronic devices and related methods
05/10/2012US20120112346 Thin-film transistor substrate and method of manufacturing the same
05/10/2012US20120112345 High bandwidth semiconductor ball grid array package
05/10/2012US20120112344 Substrate for semiconductor package and method of manufacturing thereof
05/10/2012US20120112343 Electroplated posts with reduced topography and stress
05/10/2012US20120112342 Semiconductor device and stacked semiconductor package
05/10/2012US20120112341 Method and device for selectively adding timing margin in an integrated circuit
05/10/2012US20120112340 Semiconductor Device and Method of Forming Insulating Layer Disposed Over The Semiconductor Die For Stress Relief
05/10/2012US20120112339 Semiconductor device
05/10/2012US20120112338 Heat dissipating semiconductor device packages and related methods
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