Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
05/2012
05/16/2012CN102456665A 用于金属-氧化物-金属电容器的保护结构 For metal - oxide - metal capacitor protective structure
05/16/2012CN102456664A Centripetal layout for low stress chip package
05/16/2012CN102456663A Semiconductor devices and methods of fabricating the same
05/16/2012CN102456662A 高电压电阻器 High voltage resistors
05/16/2012CN102456661A 具有重布线路层的芯片结构及其制法 Jiqizhifa chip structure has heavy layers of cloth line
05/16/2012CN102456660A Stacked semiconductor package, semiconductor device including the stacked semiconductor package and method of manufacturing the stacked semiconductor package
05/16/2012CN102456659A Semiconductor chip having different pad width to ubm width ratios and method of manufacturing the same
05/16/2012CN102456658A Semiconductor package and method of forming the same
05/16/2012CN102456657A Semiconductor device having under-bump metallization (ubm) structure and method of forming the same
05/16/2012CN102456656A Chip package
05/16/2012CN102456655A 半导体模块 Semiconductor Modules
05/16/2012CN102456654A Substrateless power device packages
05/16/2012CN102456653A Under-bump metallization (ubm) structure and method of forming the same
05/16/2012CN102456652A Power semiconductor device
05/16/2012CN102456651A Copper pillar bump with cobalt-containing sidewall protection
05/16/2012CN102456650A Conductive feature for semiconductor substrate and method of manufacture
05/16/2012CN102456649A Package substrate and fabrication method thereof
05/16/2012CN102456648A Packaging substrate and method of fabricating the same
05/16/2012CN102456647A Conductive pillar structure
05/16/2012CN102456646A Substrate structure having buried wiring and method for manufacturing the same
05/16/2012CN102456645A Thermal management system and method
05/16/2012CN102456644A Liquid-cooled heat dissipation system
05/16/2012CN102456643A 液体冷却系统 Liquid cooling system
05/16/2012CN102456642A 功率半导体系统 Power semiconductor systems
05/16/2012CN102456641A 散热器组合 Radiator combination
05/16/2012CN102456640A Base plate
05/16/2012CN102456639A Electronic apparatus, method of making the same, and transceiving device
05/16/2012CN102456638A Compliant heat spreader for flip chip packaging
05/16/2012CN102456637A Semiconductor chip assembly with post/base heat spreader and cavity over post
05/16/2012CN102456636A Package of embedded chip and manufacturing method thereof
05/16/2012CN102456635A Semiconductor module with a substrate with a number of identically designed conductor line groups
05/16/2012CN102456634A Submount and manufacturing method thereof
05/16/2012CN102456633A 封装芯片的承载座 Packaged chip carrier seat
05/16/2012CN102456632A 半导体装置 Semiconductor device
05/16/2012CN102456631A Bump for semiconductor package, semiconductor package having pump, and stacked semiconductor package
05/16/2012CN102456630A Method for preparing multi-component brazing filler metal coatings of microelectronic device salient points
05/16/2012CN102456613A 一种半导体结构及其制造方法 A semiconductor structure and its manufacturing method
05/16/2012CN102456612A 半导体集成电感的制作方法及结构 Production methods and structure of the semiconductor integrated inductor
05/16/2012CN102456587A Process for realising a connecting structure
05/16/2012CN102456586A Bonding pad planarization process for improving packaging feasibility of bump structure
05/16/2012CN102456584A Semiconductor device and method of forming pentrable film encapsulant around semiconductor die and interconnect structure
05/16/2012CN102456582A Technology for manufacturing molded lead frame
05/16/2012CN102456541A 锗硅监控片的制备方法及采用该片进行监控的方法 Preparation SiGe monitor sheet and method for monitoring the use of the sheet
05/16/2012CN102456540A 应用于外延工艺中的光刻套刻标记的制备方法 Applied to the preparation of epitaxial process of lithography overlay mark
05/16/2012CN102456539A Preparation method for silicon germanium (SiGe) monitoring chip and monitoring method adopting chip
05/16/2012CN102455472A Optical device, method for manufacturing same and electronic packaging including said optical device
05/16/2012CN102453340A Thermosetting resin composition for sealing packing of semiconductor, and semiconductor device
05/16/2012CN102453308A Epoxy resin composition for electronic product encapsulation and manufacturing method thereof
05/16/2012CN102024797B Protective structure for electronic element
05/16/2012CN101872754B Welding wire joint structure, method for strengthening welding wire joint and manufacturing method of semiconductor encapsulation construction
05/16/2012CN101752484B Light emitting diode and production method thereof
05/16/2012CN101752299B Plug structure and making method thereof
05/16/2012CN101740538B Printed circuit board having flow preventing dam and manufacturing method thereof
05/16/2012CN101674717B Radiation device
05/16/2012CN101667563B Semiconductor device and method for manufacturing the same, and semiconductor sealing resin
05/16/2012CN101645408B Soldering-pan and forming method thereof
05/16/2012CN101621910B Heat sink assembly
05/16/2012CN101573019B Radiator fastener
05/16/2012CN101539284B LED illumination device
05/16/2012CN101527198B Capacitor devices with co-coupling electrode planes
05/16/2012CN101499453B Printed circuit board and method of manufacturing the same
05/16/2012CN101499452B Printed circuit board and method of manufacturing the same
05/16/2012CN101477956B Encapsulation structure and method for tablet reconfiguration
05/16/2012CN101448381B Heat abstractor
05/16/2012CN101378042B Semiconductor device, semiconductor element and substrate
05/16/2012CN101378039B Semiconductor device, method of manufacturing the semiconductor device, flip chip package having the semiconductor device and method of manufacturing the flip chip package
05/16/2012CN101374395B Radiating device
05/16/2012CN101361198B Pixel structure for a solid state light emitting device
05/16/2012CN101359639B Circuit board construction embedded with semi-conductor chip and preparation thereof
05/16/2012CN101351880B 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
05/16/2012CN101350585B Modular stable starter
05/16/2012CN101308846B Semiconductor device
05/16/2012CN101295687B 半导体器件 Semiconductor devices
05/16/2012CN101212892B Plug-in unit and electronic apparatus
05/15/2012USRE43380 Semiconductor device including semiconductor element surrounded by an insulating member and wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereof
05/15/2012US8179730 Semiconductor device and semiconductor memory tester
05/15/2012US8179688 Semiconductor device
05/15/2012US8178984 Flip chip with interposer
05/15/2012US8178983 Water repellant composition for substrate to be exposed, method for forming resist pattern, electronic device produced by the formation method, treatment method for imparting water repellency to substrate to be exposed, water repellant set for substrate to be exposed, and treatment method for imparting water repellency to substrate to be exposed using the same
05/15/2012US8178982 Dual molded multi-chip package system
05/15/2012US8178981 Semiconductor device
05/15/2012US8178979 Low-noise flip-chip packages and flip chips thereof
05/15/2012US8178978 Support mounted electrically interconnected die assembly
05/15/2012US8178977 Semiconductor device and method of manufacturing the same
05/15/2012US8178976 IC device having low resistance TSV comprising ground connection
05/15/2012US8178975 Semiconductor package with pad parts electrically connected to bonding pads through re-distribution layers
05/15/2012US8178974 Microstrip structure including a signal line with a plurality of slit holes
05/15/2012US8178972 Semiconductor device and manufacturing method therefor
05/15/2012US8178971 Semiconductor device and method of manufacturing the same
05/15/2012US8178970 Strong interconnection post geometry
05/15/2012US8178969 Flip chip package
05/15/2012US8178968 Electronic component
05/15/2012US8178967 Low fabrication cost, high performance, high reliability chip scale package
05/15/2012US8178966 Integrated coolant circuit arrangement, operating method and production method
05/15/2012US8178965 Semiconductor module having deflecting conductive layer over a spacer structure
05/15/2012US8178964 Semiconductor device package with die receiving through-hole and dual build-up layers over both side-surfaces for WLP and method of the same
05/15/2012US8178963 Wafer level package with die receiving through-hole and method of the same
05/15/2012US8178962 Semiconductor device package and methods of manufacturing the same
05/15/2012US8178961 Semiconductor package structure and package process
05/15/2012US8178960 Stacked semiconductor package and method of manufacturing thereof
1 ... 372 373 374 375 376 377 378 379 380 381 382 383 384 385 386 387 388 389 390 391 392 ... 2262