Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
05/2012
05/17/2012US20120119372 Semiconductor device and method of manufacturing the same
05/17/2012US20120119371 Method of fabricating semiconductor device and semiconductor device
05/17/2012US20120119370 Semiconductor package and semiconductor system including the same
05/17/2012US20120119369 Semiconductor device
05/17/2012US20120119368 Semiconductor memory device
05/17/2012US20120119367 Conductive pads defined by embedded traces
05/17/2012US20120119366 Electromigration resistant via-to-line interconnect
05/17/2012US20120119365 Integrated circuit devices having conductive structures with different cross sections
05/17/2012US20120119364 Adding cap to copper passivation flow for electroless plating
05/17/2012US20120119363 GRAIN REFINEMENT BY PRECIPITATE FORMATION IN Pb-FREE ALLOYS OF TIN
05/17/2012US20120119362 Ni plating of a blm edge for pb-free c4 undercut control
05/17/2012US20120119361 Semiconductor Device and Method of Forming Overlapping Semiconductor Die with Coplanar Vertical Interconnect Structure
05/17/2012US20120119360 Integrated circuit packaging system with connection structure and method of manufacture thereof
05/17/2012US20120119359 Bump structure and semiconductor package having the bump structure
05/17/2012US20120119358 Semicondiuctor package substrate and method for manufacturing the same
05/17/2012US20120119357 Semiconductor apparatus
05/17/2012US20120119356 Semiconductor apparatus and semiconductor device
05/17/2012US20120119355 Integrated circuit structure and method of forming the same
05/17/2012US20120119354 Protecting Flip-Chip Package using Pre-Applied Fillet
05/17/2012US20120119353 Underfill method and chip package
05/17/2012US20120119352 Electroless gold plating solution for forming fine gold structure, method of forming fine gold structure using same, and fine gold structure formed using same
05/17/2012US20120119351 System for clamping heat sink
05/17/2012US20120119350 Heat Sink Module
05/17/2012US20120119349 Insulation sheet made from silicon nitride, and semiconductor module structure using the same
05/17/2012US20120119348 Semiconductor Device and Method of Electrically Connecting a Shielding Layer to Ground Through a Conductive Via Disposed in Peripheral Region around Semiconductor Die
05/17/2012US20120119347 Semiconductor device
05/17/2012US20120119346 Semiconductor package and method of forming the same
05/17/2012US20120119345 Integrated circuit packaging system with device mount and method of manufacture thereof
05/17/2012US20120119344 Microelectronic devices and methods for manufacturing microelectronic devices
05/17/2012US20120119343 Stacked leadframe implementation for dc/dc convertor power module incorporating a stacked controller and stacked leadframe construction methodology
05/17/2012US20120119342 Advanced quad flat non-leaded package structure and manufacturing method thereof
05/17/2012US20120119341 Semiconductor packages with reduced solder voiding
05/17/2012US20120119340 Shielded semiconductor device structure
05/17/2012US20120119339 Semiconductor Device and Manufacturing Method of the Same
05/17/2012US20120119338 Semiconductor Device And Method Of Manufacturing Semiconductor Device
05/17/2012US20120119337 Substrate processing apparatus, method of manufacturing semiconductor device and semiconductor device
05/17/2012US20120119334 Laser machining method and chip
05/17/2012US20120119333 Product chips and die with a feature pattern that contains information relating to the product chip
05/17/2012US20120119315 Sensing devices
05/17/2012US20120119302 Trench Silicide Contact With Low Interface Resistance
05/17/2012US20120119300 Semiconductor device
05/17/2012US20120119284 Semiconductor structures and methods of manufacture
05/17/2012US20120119269 Method for producing electronic device, electronic device, semiconductor device, and transistor
05/17/2012US20120119263 Wafer level packaging
05/17/2012US20120119216 Semiconductor Device, Method of Manufacturing A Semiconductor Device, and Display Device
05/17/2012US20120119209 Semiconductor devices and method of manufacturing the same
05/17/2012US20120119208 Semiconductor apparatus and fabricating method thereof
05/17/2012US20120119162 Coated Fullerenes, Compositions And Dielectrics Made Therefrom
05/17/2012US20120118855 Method for edge sealing barrier films
05/16/2012EP2453725A1 Through-wiring board and method of manufacturing same
05/16/2012EP2453724A1 Through-wiring board and method of manufacturing same
05/16/2012EP2453723A2 Integrated antenna package and method
05/16/2012EP2453476A1 Semiconductor device packaging method and semiconductor device package
05/16/2012EP2453474A1 Semiconductor device packaging method and semiconductor device package
05/16/2012EP2453471A2 Method for electrodeposition of an elctrode on a dielectric substrate
05/16/2012EP2452964A1 Adhesive composition, adhesive sheet, circuit board and semiconductor device both produced using these, and processes for producing these
05/16/2012EP2452359A1 Method for producing an integrated circuit and resulting foil chip
05/16/2012DE102011086304A1 Verbundsubstrat und verfahren zur herstellung eines verbundsubstrats Composite substrate and method of manufacturing a composite substrate
05/16/2012DE102011085313A1 Halbleitervorrichtung Semiconductor device
05/16/2012DE102010043811A1 Gel passivated electrical component, has passivation layer comprising components, which are selected from groups comprising silver-and/or copper salts, and another passivation layer comprising organic connection with multiple bonds
05/16/2012DE102010043747A1 Halbleiteranordnung und mit dieser aufgebaute Funktionseinheit sowie Verfahren zur Herstellung einer Halbleiteranordnung Semiconductor device and constructed with this functional unit and method of manufacturing a semiconductor device
05/16/2012CN202222072U Circuit board
05/16/2012CN202222071U Circuit board
05/16/2012CN202221757U Novel anti-high-surge-current transient over-voltage protection device
05/16/2012CN202221756U Insulation structure by which transistor can be fixed on radiator
05/16/2012CN202221755U Clamp connecting structure of diode on photovoltaic terminal box
05/16/2012CN202221259U Groove composite fiber liquid absorption core, micro heat pipe and vapor chamber
05/16/2012CN102460750A Metal substrate and light source device
05/16/2012CN102460695A Wiring board and power conversion device
05/16/2012CN102460694A Power conversion device
05/16/2012CN102460693A Power converter
05/16/2012CN102460692A Integrated power amplifier with load inductor located under ic die
05/16/2012CN102460691A Apparatus and method for frequency generation
05/16/2012CN102460690A Multi-chip package and method of providing die-to-die interconnects in same
05/16/2012CN102460689A Cooling device, electronic substrate and electronic device
05/16/2012CN102460688A Power semiconductor heatsinking
05/16/2012CN102460687A Laminated wiring board
05/16/2012CN102460686A Semiconductor device, mounted substrate to be used in semiconductor device, and manufacturing method of mounted substrate
05/16/2012CN102460685A Semiconductor package and semiconductor package mounting structure
05/16/2012CN102460670A Semiconductor device, method for manufacturing semiconductor device, and circuit device using semiconductor device
05/16/2012CN102460666A Method of producing electronic module, and electronic module
05/16/2012CN102460653A 成膜方法、前处理装置和处理系统 Film-forming method, the pretreatment device and processing system
05/16/2012CN102459397A Resin composition for sealing semiconductors, and semiconductor device
05/16/2012CN102458852A 多层阻障膜 Multilayer barrier film
05/16/2012CN102458081A Heat radiator and electronic device using same
05/16/2012CN102458038A 散热件及具有该散热件的电子装置 The heat sink and electronic device having the heat dissipation member
05/16/2012CN102456737A 半导体结构及其制造方法 Semiconductor structure and manufacturing method
05/16/2012CN102456684A 电源转换模块 Power conversion module
05/16/2012CN102456679A High-efficiency power converters with integrated capacitors
05/16/2012CN102456677A Packaging structure for ball grid array and manufacturing method for same
05/16/2012CN102456675A 三维半导体器件 Three-dimensional semiconductor device
05/16/2012CN102456674A Chip stacking structure and method
05/16/2012CN102456673A 芯片堆叠结构 Chip stack structure
05/16/2012CN102456672A 提高dmos/ldmos器件esd性能的结构和方法 Improve dmos / structures and methods ldmos esd performance devices
05/16/2012CN102456671A 射频单芯片系统中的屏蔽环结构 RF single-chip system shielding ring structure
05/16/2012CN102456670A Chip package
05/16/2012CN102456669A Chip-grade electromagnetic interference shielding structure and manufacturing method thereof
05/16/2012CN102456668A Test structures for through silicon vias (TSVs) of three dimensional integrated circuit (3DIC)
05/16/2012CN102456667A 接合焊盘结构以及具有该接合焊盘结构的晶片 Bonding pad structure and the bonding pad structure has a wafer
05/16/2012CN102456666A 数字坐标轴及栅氧化膜可靠性测试方法 Digital axes and gate oxide film reliability test methods
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