Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
05/2012
05/23/2012CN101271855B Method for forming screen grid groove and measuring etching depth and semiconductor device wafer
05/23/2012CN101258198B Resin composition and hybrid integrated circuit board making use of the same
05/23/2012CN101241890B Chip package structure and its making method
05/23/2012CN101202289B Thin film transistor substrate and liquid crystal display apparatus and manufacture method thereof
05/23/2012CN101202260B Semiconductor device package featuring encapsulated leadframe with projecting bumps or balls
05/23/2012CN101201538B Soft template with alignment mark and its manufacture method
05/23/2012CN101132044B Methods of forming semiconductor light emitting device packages and molded semiconductor light emitting device strips
05/23/2012CN101097982B Packaging structure for luminescent device
05/23/2012CN101081909B Sealing material, application and production process
05/23/2012CN101072807B Thermosetting epoxy resin composition and use thereof
05/23/2012CN101060767B Ceramic foam electronic component cooling
05/23/2012CN101026924B Radiator fastening device
05/22/2012USRE43404 Methods for providing void-free layer for semiconductor assemblies
05/22/2012US8184465 Programmable semiconductor device
05/22/2012US8184463 Semiconductor apparatus
05/22/2012US8183701 Structure of stacking scatterometry based overlay marks for marks footprint reduction
05/22/2012US8183700 Semiconductor device having alignment mark and its manufacturing method
05/22/2012US8183698 Bond pad support structure for semiconductor device
05/22/2012US8183696 Packaged semiconductor device with encapsulant embedding semiconductor chip that includes contact pads
05/22/2012US8183693 Electronic device, method of producing the same, and semiconductor device
05/22/2012US8183691 Semiconductor device with pads overlapping wiring layers including dummy wiring
05/22/2012US8183690 Electronic device
05/22/2012US8183689 Printed circuit board and flip chip package using the same with improved bump joint reliability
05/22/2012US8183688 Semiconductor device
05/22/2012US8183687 Interposer for die stacking in semiconductor packages and the method of making the same
05/22/2012US8183686 Semiconductor device
05/22/2012US8183685 Semiconductor device
05/22/2012US8183684 Semiconductor device and method of manufacturing the same
05/22/2012US8183683 Semiconductor device and fabricating method thereof
05/22/2012US8183682 Methods of packaging a semiconductor die and package formed by the methods
05/22/2012US8183681 Semiconductor device
05/22/2012US8183680 No-lead IC packages having integrated heat spreader for electromagnetic interference (EMI) shielding and thermal enhancement
05/22/2012US8183679 Electronic part package
05/22/2012US8183678 Semiconductor device having an interposer
05/22/2012US8183677 Device including a semiconductor chip
05/22/2012US8183676 Memory circuit having memory chips parallel connected to ports and corresponding production method
05/22/2012US8183674 Power semiconductor module comprising an explosion protection system
05/22/2012US8183673 Through-silicon via structures providing reduced solder spreading and methods of fabricating the same
05/22/2012US8183669 Nitride semiconductor wafer having a chamfered edge
05/22/2012US8183665 Nonvolatile nanotube diodes and nonvolatile nanotube blocks and systems using same and methods of making same
05/22/2012US8183663 Crack resistant circuit under pad structure and method of manufacturing the same
05/22/2012US8183638 Dual triggered silicon controlled rectifier
05/22/2012US8183607 Semiconductor device
05/22/2012US8183602 Nonvolatile semiconductor memory device including via-holes continuously formed through plural cell array layers
05/22/2012US8183601 Thin film transistor array panel for a liquid crystal display
05/22/2012US8183594 Laminar structure on a semiconductor substrate
05/22/2012US8183593 Semiconductor die with integrated electro-static discharge device
05/22/2012US8183565 Programmable resistance memory array with dedicated test cell
05/22/2012US8183166 Dielectric layer structure and manufacturing method thereof
05/22/2012US8183150 Semiconductor device having silicon carbide and conductive pathway interface
05/22/2012US8183147 Method of fabricating a conductive post on an electrode
05/22/2012US8183123 Method of forming mark in IC-fabricating process
05/22/2012US8183091 Semiconductor integrated circuit device and process for manufacturing the same
05/22/2012US8183086 Diamond GaN devices and associated methods
05/22/2012CA2460394C Image sensor with recessed planarizing layers and method for making same
05/22/2012CA2418737C Method for connecting a chip to the antenna of a radio frequency identification device of a contactless chip card variety
05/18/2012WO2012065083A1 Dendritic metal structures, methods for making dendritic metal structures, and devices including them
05/18/2012WO2012064708A1 Unitary housing for electronic device
05/18/2012WO2012064636A2 Contact pad
05/18/2012WO2012064615A1 Electronic system with ventilation path through inlet-positioned ehd air mover, over ozone reducing surfaces, and out through outlet-positioned heat exchanger
05/18/2012WO2012064435A1 Through silicon via with improved reliability
05/18/2012WO2012063942A1 Electronic circuit and heat sink
05/18/2012WO2012063918A1 Multilayer wiring board
05/18/2012WO2012063822A1 Thermosetting silicone resin composition, and silicone resin-containing structure and optical semiconductor element encapsulant obtained using same
05/18/2012WO2012063726A1 Lead-free glass for encapsulating semiconductor, and overcoat tube for encapsulating semiconductor
05/18/2012WO2012063638A1 Cladding material for insulated substrates
05/18/2012WO2012063579A1 Thermosetting crosslinked cycloolefin resin film and manufacturing process therefor
05/18/2012WO2012063321A1 Package
05/18/2012WO2012062613A1 Method for the production of a substrate comprising embedded layers of getter material
05/18/2012WO2012062587A1 Adhesive compound and method for encapsulating an electronic assembly
05/18/2012WO2012062300A2 Thick-wire bond arrangement and method for producing
05/18/2012WO2012062021A1 Method for manufacturing contact holes in cmos device by gate-last process
05/18/2012WO2012039120A3 Printed circuit board
05/18/2012WO2012027075A3 Bumpless build-up layer package with a pre-stacked microelectronic devices
05/18/2012DE202012004065U1 Wärmerohr Heat pipe
05/17/2012US20120124408 Semiconductor apparatus
05/17/2012US20120122020 Single-walled carbon nanotube and aligned single-walled carbon nanotube bulk structure, and their production process, production apparatus and application use
05/17/2012US20120120610 Semiconductor device
05/17/2012US20120119778 Post silicide testing for replacement high-k metal gate technologies
05/17/2012US20120119760 Perforated contact electrode on vertical nanowire array
05/17/2012US20120119393 Integrated circuit packaging system with flexible substrate and method of manufacture thereof
05/17/2012US20120119392 Lead-free high temperature compound
05/17/2012US20120119391 Semiconductor package and manufacturing method thereof
05/17/2012US20120119390 Semiconductor structure and a method of manufacturing a semiconductor structure
05/17/2012US20120119389 Method for Fabricating a Semiconductor Chip and Semiconductor Chip
05/17/2012US20120119388 Semiconductor Device and Method of Forming Interposer Frame Electrically Connected to Embedded Semiconductor Die
05/17/2012US20120119387 Semiconductor package with bonding wires of reduced loop inductance
05/17/2012US20120119386 Semiconductor device and method of manufacturing the same
05/17/2012US20120119385 Electrical Connector Between Die Pad and Z-Interconnect for Stacked Die Assemblies
05/17/2012US20120119384 Semiconductor device and manufacturing method thereof
05/17/2012US20120119382 Semiconductor device with vertical current flow and low substrate resistance and manufacturing process thereof
05/17/2012US20120119381 Semiconductor device with vertical current flow and low substrate resistance and manufacturing process thereof
05/17/2012US20120119380 Microelectronic package with terminals on dielectric mass
05/17/2012US20120119379 Electric part package and manufacturing method thereof
05/17/2012US20120119378 Semiconductor packages and methods of packaging semiconductor devices
05/17/2012US20120119377 Wiring substrate, semiconductor device, and method of manufacturing wiring substrate
05/17/2012US20120119376 Semiconductor chips and methods of forming the same
05/17/2012US20120119375 Semiconductor structure and manufacturing method thereof
05/17/2012US20120119374 Through silicon via with improved reliability
05/17/2012US20120119373 Wafer level semiconductor package and manufacturing methods thereof
1 ... 370 371 372 373 374 375 376 377 378 379 380 381 382 383 384 385 386 387 388 389 390 ... 2262