Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
05/2012
05/23/2012CN102468220A 一种金属互连结构及其形成方法 One metal interconnect structure and method of forming
05/23/2012CN102468218A 形成双镶嵌结构的方法、半导体器件 The method of forming a dual damascene structure, a semiconductor device
05/23/2012CN102468197A Semiconductor device and method of forming flipchip interconnect structure
05/23/2012CN102468196A Discrete circuit component having copper block electrodes and method of fabrication
05/23/2012CN102468195A High-reliability semiconductor plastic packaging body and method for welding bonding wire of high-reliability semiconductor plastic packaging body
05/23/2012CN102468194A Semiconductor device packaging method and semiconductor device package
05/23/2012CN102468193A High-voltage packaged device
05/23/2012CN102468192A Method of manufacturing semiconductor device
05/23/2012CN102468187A Chip packaging structure and chip packaging method
05/23/2012CN102468185A Die bond film, dicing die bond film, method of manufacturing die bond film, and semiconductor device having die bond film
05/23/2012CN102467977A 芯片固定基座和芯片固定连接方式 Fixed base chip and chip fixed connections
05/23/2012CN102467971A 包括熔丝阵列的半导体器件和操作其的方法 A semiconductor device including a fuse and a method of operating an array thereof
05/23/2012CN102467603A Method of fabricating an integrated circuit protected against reverse engineering
05/23/2012CN102466773A 射频噪声去嵌入方法 RF noise de-embedding method
05/23/2012CN102466577A Preparation method of physical detection sample
05/23/2012CN102163604B Resistance correction circuit
05/23/2012CN102110667B Device for wafer level electrical interconnection and extraction and processing method thereof
05/23/2012CN102044414B Semiconductor structure and manufacturing method thereof
05/23/2012CN102034808B ESD (Electronic Static Discharge) protection device
05/23/2012CN101997008B Pixel structure
05/23/2012CN101976661B High-power chip liquid cooling device
05/23/2012CN101958310B Semiconductor device and formation method thereof
05/23/2012CN101958300B Double-sided graphic chip inversion module packaging structure and packaging method thereof
05/23/2012CN101958288B Semiconductor assembly
05/23/2012CN101937891B Chip provided with double layers of pins
05/23/2012CN101930918B Semiconductor structure and lateral wall partitioning method
05/23/2012CN101919052B Methods and devices for wireless chip-to-chip communications
05/23/2012CN101919051B Component arrangement and method for producing a component arrangement
05/23/2012CN101916751B Packaging structure and manufacture method thereof
05/23/2012CN101916747B IGBT (Insulated Gate Bipolar Translator) heat radiating structure for electric automobile controller and relevant components
05/23/2012CN101897019B Fixing clamp
05/23/2012CN101897013B An interconnect structure and a method of fabricating the same
05/23/2012CN101894772B Method for enhancing reliability of chip welding spot, printed circuit board and electronic device
05/23/2012CN101894766B Method for manufacturing solder lug
05/23/2012CN101887895B Power transistor chip internally provided with enhancement metal-oxide-semiconductor field effect transistor (MOSFET) and applying circuit thereof
05/23/2012CN101887894B Static discharge protective device
05/23/2012CN101882613B Integrated circuit with chip seal ring
05/23/2012CN101872757B Recess chip packaging structure and laminated packaging structure using same
05/23/2012CN101872749B Recess chip packaging structure and laminated packaging structure using same
05/23/2012CN101868116B Circuit board and manufacturing method thereof
05/23/2012CN101859736B Semiconductor packaging semi-finished product and semiconductor packaging process
05/23/2012CN101853837B Circuit substrate
05/23/2012CN101847611B Semiconductor device
05/23/2012CN101840903B Packaging substrate and chip packaging structure
05/23/2012CN101836292B Semiconductor device with improved ESD protection
05/23/2012CN101828261B Magnetic detection of back-side layer
05/23/2012CN101828249B Method and system for forming an air gap structure
05/23/2012CN101819968B Light-emitting diode (LED) packaging
05/23/2012CN101803023B Semiconductor device
05/23/2012CN101794760B High current semiconductor power soic package
05/23/2012CN101783343B Electro-static discharge protective circuit and integrated circuit
05/23/2012CN101771038B Integrated circuit structure
05/23/2012CN101771020B Through-silicon via with scalloped sidewalls
05/23/2012CN101771018B Through-silicon via with air gap
05/23/2012CN101764111B Axial type surface contact type glass packaging rectifier tube and manufacture method
05/23/2012CN101754651B Fan fixing device
05/23/2012CN101752336B 半导体装置及其制造方法 Semiconductor device and manufacturing method
05/23/2012CN101750819B Array substrate for transflective liquid crystal display device and manufacturing method thereof
05/23/2012CN101740552B Multi-chip packaging structure and manufacturing method thereof
05/23/2012CN101730439B Heat radiating module
05/23/2012CN101730436B Convection heat-radiation system for temperature control of electronic equipment close to space vehicle
05/23/2012CN101715282B Fixing member
05/23/2012CN101711104B Graphite heat radiator
05/23/2012CN101692440B Mixed crystal orientation strain silicon substrate and method for preparing same
05/23/2012CN101681896B Heat spreader for semiconductor device and method for manufacturing the heat spreader
05/23/2012CN101681882B Thin film capacitor, and display and memory cell employing the film capacitor, and mehtods for fabricating the thin film capacitor, the display and the memory cell
05/23/2012CN101667561B Silicon-based vapor-liquid phase separating heat radiation chip and preparation method thereof
05/23/2012CN101663749B Stacked-die package for battery power management
05/23/2012CN101651132B Defect test structure of semiconductor device, defect test method and defect test structure of before-metal medium layer
05/23/2012CN101632169B Interposer and manufacturing method of the interposer
05/23/2012CN101626004B Semiconductor package and semiconductor device
05/23/2012CN101617402B Sensing circuit for devices with protective coating
05/23/2012CN101599471B Cooling structure of power device and manufacturing method thereof
05/23/2012CN101599438B Circuit structure and manufacture method thereof
05/23/2012CN101588706B Radiating module and welding method thereof
05/23/2012CN101588697B Fixing device assembly
05/23/2012CN101587273B Active matrix substrate and a liquid-crystal display device
05/23/2012CN101582422B Display device
05/23/2012CN101577276B Insulated gate semiconductor device
05/23/2012CN101572240B Interconnection of lead frame to die utilizing flip chip process
05/23/2012CN101562334B Power supply control circuit for electro-static discharge (ESD) protection
05/23/2012CN101556945B Method and apparatus for providing structural support for interconnect pad while allowing signal conductance
05/23/2012CN101533809B Honeycomb radiator
05/23/2012CN101517738B Semiconductor device, lead frame product used in the semiconductor device, and method for manufacturing the semiconductor device
05/23/2012CN101516170B Radiation device
05/23/2012CN101512762B Stackable packages for three-dimensional packaging of semiconductor dice
05/23/2012CN101500396B Fastener and heat radiating device assembly using the same
05/23/2012CN101494175B Three-layer stereo power encapsulation method and structure
05/23/2012CN101490817B Semiconductor device manufacturing method, semiconductor device manufacturing apparatus, semiconductor device, computer program
05/23/2012CN101488496B Semiconductor integrated circuit
05/23/2012CN101466236B Radiating device
05/23/2012CN101459152B Stack type semi-conductor encapsulation construction having metal contact point guiding pore
05/23/2012CN101421056B Method for etching substrate, processing chamber for etching substrate and method for cleaning the processing chamber
05/23/2012CN101409996B Method for preparing radiating module
05/23/2012CN101383334B Lead frame, semiconductor device, and method of manufacturing semiconductor device
05/23/2012CN101373743B Unit in unit set and manufacturing method thereof
05/23/2012CN101361413B Electronic components mounting adhesive and electronic components mounting structure
05/23/2012CN101325196B Boost converter with integrated high power discrete fet and low voltage controller
05/23/2012CN101305308B Diffusion barrier layer for mems devices
05/23/2012CN101276788B Method for improving electrostatic discharge protection performance of silicon circuit in insulators
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