Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
05/2012
05/23/2012CN102474988A 电子元件单元和加强粘合剂 The electronic element unit and the strengthening adhesive
05/23/2012CN102474987A Electronic module and method for manufacturing same
05/23/2012CN102474983A Through-wiring board and method of manufacturing same
05/23/2012CN102474982A Through-wiring board and method of manufacturing same
05/23/2012CN102474977A Multilayer securing structure and method thereof for the protection of cryptographic keys and code
05/23/2012CN102474976A Wiring substrate and manufacturing method for wiring substrate
05/23/2012CN102474476A Differential signal transmission line, ic package, and method for testing said differential signal transmission line and ic package
05/23/2012CN102474237A 表面安装用晶体振子 Surface mount crystal oscillator
05/23/2012CN102474068A Semiconductor laser apparatus
05/23/2012CN102473829A LED chip assembly, LED package, and manufacturing method of LED package
05/23/2012CN102473700A Resin-sealed semiconductor device and method for manufacturing same
05/23/2012CN102473699A 具有降低的编程电压的鳍片反熔丝 Fin with reduced programming voltage antifuse
05/23/2012CN102473698A Method of operating a clamping system of a wire bonding machine
05/23/2012CN102473697A Electrical interconnect for die stacked in zig-zag configuration
05/23/2012CN102473696A 散热器 Heat sink
05/23/2012CN102473695A Top actuated, force limiting heatsink retention system
05/23/2012CN102473694A Semiconductor module and heat radiation member
05/23/2012CN102473693A 散热器 Heat sink
05/23/2012CN102473692A Power module
05/23/2012CN102473691A 具有芯片和载体的设置结构 And a carrier having a chip arrangement structure
05/23/2012CN102473690A Semiconductor device having shield layer and element-side power supply terminal capacitively coupled therein
05/23/2012CN102473689A Semiconductor device having power supply-side metal reinforcing member and ground-side metal reinforcing member insulated from each other
05/23/2012CN102473688A Insulation circuit board, and power semiconductor device or inverter module using the same
05/23/2012CN102473687A 电子元器件 Electronic Components
05/23/2012CN102473686A Package for containing element and mounted structure
05/23/2012CN102473685A Packagign or mounting a component
05/23/2012CN102473684A System-in packages
05/23/2012CN102473656A Light emitting device
05/23/2012CN102473651A Method for manufacturing semiconductor device
05/23/2012CN102473640A Semiconductor device and process for production thereof
05/23/2012CN102473639A Process for production of semiconductor device, and semiconductor device
05/23/2012CN102473616A 成膜方法 Film forming method
05/23/2012CN102472600A Heat sink for an electronic or electrical component
05/23/2012CN102472597A Loop heat pipe and startup method for the same
05/23/2012CN102471867A Method for producing a structured coating on a substrate, coated substrate, and semi-finished product having a coated substrate
05/23/2012CN102471831A Copper alloy and lead frame material for electronic equipment
05/23/2012CN102471651A 导电粘合剂 Conductive adhesives
05/23/2012CN102471581A Curable composition for semiconductor encapsulation
05/23/2012CN102471464A Liquid resin composition and semiconductor device formed using same
05/23/2012CN102471461A Adhesive composition, adhesive sheet, circuit board and semiconductor device both produced using these, and processes for producing these
05/23/2012CN102471455A 阻氧组合物以及相关方法 Oxygen barrier compositions and related methods
05/23/2012CN102471416A Acrylate composition
05/23/2012CN102471407A Composition for film formation, insulating film and semiconductor device
05/23/2012CN102471137A Sealing glass, sealing material and sealing material paste for semiconductor devices, and semiconductor device and process for production thereof
05/23/2012CN102470639A Metal laminate structure and process for production of metal laminate structure
05/23/2012CN102470493A Method for manufacturing solder column, apparatus for manufacturing solder column, and solder column
05/23/2012CN102470438A Cu-Al alloy powder, alloy paste utilizing same, and electronic component
05/23/2012CN102469749A 具分流的热交换结构 A shunt heat exchange structure
05/23/2012CN102469742A 电子装置 Electronic devices
05/23/2012CN102469687A 电路板 Board
05/23/2012CN102468343A 体外散热轴向型塑封功率二极管 Axial heat in vitro plastic power diode
05/23/2012CN102468295A Semiconductor module having an insert and method for producing a semiconductor module having an insert
05/23/2012CN102468293A 直接电性连接于交流电源的多晶封装结构 Directly electrically connected to the AC power polycrystalline package structure
05/23/2012CN102468292A 一种用于直流-直流转换器的封装体结构 Package structure dc converters - for DC
05/23/2012CN102468285A Power module using sintering die attach and manufacturing method thereof
05/23/2012CN102468284A Stacked semiconductor device and method for manufacturing same
05/23/2012CN102468283A Memory device and method of manufacturing the same, memory system and multilayer device
05/23/2012CN102468282A 3D semiconductor device and method for fabricating the same
05/23/2012CN102468281A Semiconductor device and method of forming the same
05/23/2012CN102468280A Three-dimensional semiconductor devices
05/23/2012CN102468279A Integrated circuit device and method for preparing the same
05/23/2012CN102468278A 多芯片堆栈封装结构 Multi-chip stack package structure
05/23/2012CN102468277A Multi-chip laminating and packaging structure and manufacturing method thereof
05/23/2012CN102468276A Termination structure of power semiconductor device and manufacturing method thereof
05/23/2012CN102468275A Semiconductor device and method of manufacturing semiconductor device
05/23/2012CN102468274A 阴影效应分析结构、其形成方法和其分析方法 Shadow effect analysis structures, methods and analysis method thereof which is formed
05/23/2012CN102468273A 一种测量电荷的装置及方法 An apparatus and method for measuring the charge
05/23/2012CN102468272A 用于多晶硅栅耗尽测试的mos结构及制造方法 Polysilicon gate depletion test structure and method for manufacturing mos
05/23/2012CN102468271A 一种半导体工艺的测试结构及其制造方法 Test structure and manufacturing method of a semiconductor process
05/23/2012CN102468270A Semiconductor device including inner interconnection structure
05/23/2012CN102468269A Slot-shielded coplanar strip-line compatible with CMOS processes
05/23/2012CN102468268A Memory device and method of fabricating the same
05/23/2012CN102468267A 半导体结构及其制造方法 The semiconductor structure and a method of manufacturing
05/23/2012CN102468266A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
05/23/2012CN102468265A 连接插塞及其制作方法 Connector plug and its production method
05/23/2012CN102468264A Bump structure and semiconductor package having the bump structure
05/23/2012CN102468263A Integrated circuit system with distributed power supply
05/23/2012CN102468262A Semiconductor device
05/23/2012CN102468261A Qfn semiconductor package and fabrication method thereof
05/23/2012CN102468260A Lead frame with compatible high voltage and low voltage, lead frame array and packaging structure thereof
05/23/2012CN102468259A Semiconductor packages and methods for the same
05/23/2012CN102468258A Semiconductor device with connecting points nested in rows
05/23/2012CN102468257A Wafer level semiconductor package and manufacturing methods thereof
05/23/2012CN102468256A Radiator of electric element for heat pump and heat pump system using same
05/23/2012CN102468255A 散热装置 Cooling devices
05/23/2012CN102468254A 散热装置组合 Heat sink combination
05/23/2012CN102468253A 散热装置组合 Heat sink combination
05/23/2012CN102468252A Thin buckle for radiator
05/23/2012CN102468251A 散热器背板及散热模块 Radiator and cooling module backplane
05/23/2012CN102468250A Heat-radiating substrate and method for manufacturing the same
05/23/2012CN102468249A Power package module and method for fabricating the same
05/23/2012CN102468248A Protecting flip-chip package using pre-applied fillet
05/23/2012CN102468247A Seal ring structure with polyimide layer adhesion
05/23/2012CN102468246A Semiconductor device and manufacturing method thereof
05/23/2012CN102468245A Semiconductor device and method of manufacturing the same
05/23/2012CN102468244A Passivation layer structure of semiconductor module and method for forming passivation layer structure
05/23/2012CN102468229A 集成电路结构及其制备方法 Integrated circuit structure and preparation method
05/23/2012CN102468228A 半导体结构及其形成方法 And a method for forming a semiconductor structure
05/23/2012CN102468226A Semiconductor structure and making method thereof
05/23/2012CN102468225A 熔丝结构及其制作方法 Fuse structure and manufacturing method thereof
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