Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
05/2012
05/24/2012US20120126408 Integrated circuit manufacturing method and integrated circuit
05/24/2012US20120126407 Wafer level chip package and a method of fabricating thereof
05/24/2012US20120126406 Using bump bonding to distribute current flow on a semiconductor power device
05/24/2012US20120126405 Solder interconnect pads with current spreading layers
05/24/2012US20120126404 Semiconductor device
05/24/2012US20120126403 Semiconductor device
05/24/2012US20120126402 Semiconductor device and method of forming the same
05/24/2012US20120126401 Stackable semiconductor assembly with bump/base/flange heat spreader and electromagnetic shielding
05/24/2012US20120126400 Semiconductor package and method of manufacturing the same
05/24/2012US20120126399 Thermally enhanced semiconductor assembly with bump/base/flange heat spreader and build-up circuitry
05/24/2012US20120126398 Integrated circuit package and physical layer interface arrangement
05/24/2012US20120126397 Semiconductor substrate and method thereof
05/24/2012US20120126396 Die down device with thermal connector
05/24/2012US20120126395 Semiconductor Device and Method of Forming Uniform Height Insulating Layer Over Interposer Frame as Standoff for Semiconductor Die
05/24/2012US20120126394 Integrated circuit device and method for preparing the same
05/24/2012US20120126393 Resin composition, multilayer body containing the same, semiconductor device, and film
05/24/2012US20120126392 Methods for Making Micro Needles and Applications Thereof
05/24/2012US20120126391 Methods for Embedding Conducting Material and Devices Resulting from Said Methods
05/24/2012US20120126390 Semiconductor device
05/24/2012US20120126388 Stackable semiconductor assembly with bump/flange heat spreader and dual build-up circuitry
05/24/2012US20120126387 Enhanced heat spreader for use in an electronic device and method of manufacturing the same
05/24/2012US20120126386 Electronic devices
05/24/2012US20120126385 Method for semiconductor leadframes in low volume and rapid turnaround
05/24/2012US20120126384 Package structure
05/24/2012US20120126383 Method for semiconductor leadframes in low volume and rapid turnaround
05/24/2012US20120126382 Magnetic shielding for multi-chip module packaging
05/24/2012US20120126381 Adhesive film for semiconductor device, and semiconductor device
05/24/2012US20120126380 Film for the backside of flip-chip type semiconductor, dicing tape-integrated film for the backside of semiconductor, method of manufacturing film for the backside of flip-chip type semiconductor, and semiconductor device
05/24/2012US20120126379 Die bond film, dicing die bond film, method of manufacturing die bond film, and semiconductor device having die bond film
05/24/2012US20120126378 Semiconductor device package with electromagnetic shielding
05/24/2012US20120126373 Semiconductor device including inner interconnection structure
05/24/2012US20120126368 Semiconductor Package
05/24/2012US20120126367 Antifuse structure for in line circuit modification
05/24/2012US20120126366 Antifuse structure for in line circuit modification
05/24/2012US20120126365 Anti-Fuse Element
05/24/2012US20120126364 Mitigation of detrimental breakdown of a high dielectric constant metal-insulator-metal capacitor in a capacitor bank
05/24/2012US20120126363 Structure of metal e-fuse
05/24/2012US20120126360 Semiconductor device and a method of manufacturing the same and designing the same
05/24/2012US20120126358 Tone inversion with partial underlayer etch
05/24/2012US20120126347 Packages and methods for packaging
05/24/2012US20120126246 Package and high frequency terminal structure for the same
05/24/2012US20120126229 Interconnection structures and methods for transfer-printed integrated circuit elements with improved interconnection alignment tolerance
05/24/2012US20120126228 Material Structure in Scribe Line and Method of Separating Chips
05/24/2012US20120125869 Multi-Position Solar Panel Rack
05/24/2012US20120125670 Cu-Al ALLOY POWDER, ALLOY PASTE UTILIZING SAME, AND ELECTRONIC COMPONENT
05/24/2012US20120125410 Method and Apparatus for Forming and Mounting a Photovoltaic Array
05/24/2012US20120125409 Fastening of panel-type elements
05/24/2012US20120125408 Solar panel racking assembly and system
05/24/2012DE112010000026T5 Halbleitermodul Semiconductor module
05/24/2012DE112009004375T5 Halbleitervorrichtung Semiconductor device
05/24/2012DE10351719B4 Prozessorbaustein Processor module
05/24/2012DE10327360B4 Verfahren zum Herstellen eines Keramik-Metall-Substrates A method of manufacturing a ceramic-metal substrate
05/24/2012DE102011086473A1 Halbleiterpackung und -modul, Herstellungsverfahren und elektronisches Bauelement Semiconductor package and modulus, manufacturing processes and electronic component
05/24/2012DE102011086171A1 3D-Halbleiterspeicherbauelement und Halbleiterbauelementherstellungsverfahren 3D semiconductor memory device and semiconductor device manufacturing method
05/24/2012DE102011078811B3 Leistungselektronisches System mit einer Kühleinrichtung Power electronic system with a cooling device
05/24/2012DE102011055185A1 Integrierte Schaltung mit Feldeffekttransistor Integrated circuit with field effect transistor
05/24/2012DE102011055091A1 Materialstruktur in einer Ritzlinie und Verfahren zum Trennen von Chips Structure material in a scribe line, and method for separating chips
05/24/2012DE102010061773A1 Semiconductor-based power switch for controlling electric motor of e.g. electric power steering apparatus of motor vehicle, has electrical heating element arranged in area of bond connection for thermally releasing bond connection
05/24/2012DE102010061770A1 Verfahren zur Herstellung von Halbleiter-Chips, Montageverfahren und Halbleiter-Chip für senkrechte Montage auf Schaltungsträger A process for producing semiconductor chips, and semiconductor chip mounting method for vertical mounting on the circuit carrier
05/24/2012DE102010060695A1 Method of forming marking in semiconductor wafer used in manufacture of solar cell, involves irradiating laser beam in region of wafer surface portions arranged in cutting block, at acute angle to form marking
05/24/2012DE102010052033A1 Verfahren zur Herstellung von metallischen Strukturen A process for the production of metallic structures
05/24/2012DE102010052032A1 Verfahren zur Herstellung von metallischen Strukturen A process for the production of metallic structures
05/24/2012DE102010051961A1 Thyristorbauelement Thyristor device
05/24/2012DE102010051572A1 Halbleiterbauelementevorrichtung für PV-Anlagen Semiconductor devices device for PV systems
05/24/2012DE102010029526B4 Halbleiterbauelement mit einer gestapelten Chipkonfiguration mit einem integrierten Peltier-Element A semiconductor device comprising a stacked chip configuration with an integrated Peltier element
05/24/2012DE102006062034B4 Teststruktur mit erhöhter Robustheit im Hinblick auf Barrieredefekte in Kontaktlochöffnungen beim Abschätzen von Elektromigrationseffekten sowie dazugehöriges Herstellungsverfahren Test structure with increased robustness with respect to barrier defects in via openings in estimating electromigration effects and belonging to manufacturing process
05/24/2012DE102006001874B4 Verfahren und Vorrichtung zur Strom- und Temperaturmessung in einer leistungselektronischen Schaltung Method and apparatus for current and temperature measurement in a power electronic circuit
05/23/2012EP2455991A1 Led chip assembly, led package, and manufacturing method of led package
05/23/2012EP2455966A1 Light emitting device
05/23/2012EP2455512A1 Masking jig, substrate heating apparatus, and film formation method
05/23/2012EP2454550A1 Heat sink for an electronic or electrical component
05/23/2012EP2454307A1 Oxygen barrier compositions and related methods
05/23/2012EP2045344B1 Process for producing copper alloy sheets for electrical/electronic part
05/23/2012EP1905077B1 Semiconductor device
05/23/2012EP1876250B1 Cu-Ni-Si-Co-Cr BASED COPPER ALLOY FOR ELECTRONIC MATERIAL AND METHOD FOR PRODUCTION THEREOF
05/23/2012EP1546028B8 Method for selectively covering a micro machined surface
05/23/2012CN202232018U Radiator with shocking proof and quick releasing function
05/23/2012CN202232016U Heat dissipation module group
05/23/2012CN202232012U 散热器 Heat sink
05/23/2012CN202232011U Heat radiation module for electronic apparatus
05/23/2012CN202232003U Novel electronic device guide rail buckle
05/23/2012CN202231656U Novel MOSFMAT (Metal-Oxide-Semiconductor Field-Effect Transistor) module with test circuit
05/23/2012CN202231655U Novel MOSFMT module
05/23/2012CN202231011U Integrated circuit for switch power supply
05/23/2012CN202231008U Infrared receiving head
05/23/2012CN202231007U Infrared receiving terminal external shielding case
05/23/2012CN202231006U SMA integrated circuit punching moulded product and SMA multi-row lead frame
05/23/2012CN202231005U Lead frame
05/23/2012CN202231004U Cushion block of no-lead half-etching lead wire frame and capable of welding ribbon
05/23/2012CN202231003U DFN (Dual flat no-lead package) lead frame capable of being welded with aluminum foil
05/23/2012CN202231002U Offset densely-arranged integrated circuit lead wire frame
05/23/2012CN202231001U Chip cooling device for control module of variable frequency air conditioner
05/23/2012CN202231000U Electronic device fixed by fastener
05/23/2012CN202230999U Supporting seat of packaging chip
05/23/2012CN202230814U Multi-layer via-hole-free thin-film resistor
05/23/2012CN1945822B Semiconductor device, semiconductor module and semiconductor module producing method
05/23/2012CN1876720B Rtv silicone rubber composition, circuit boards, silver electrodes, and silver chip resistors
05/23/2012CN1862821B Semiconductor device
05/23/2012CN102474997A Local thermal management
05/23/2012CN102474992A 电容内置布线基板及配件内置布线基板 Built wiring substrate capacitance and accessories built-in wiring board
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