Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
05/2012
05/30/2012CN102479768A 半导体器件 Semiconductor devices
05/30/2012CN102479767A Semiconductor device package with electromagnetic shielding
05/30/2012CN102479766A Process of fabricating semiconductor device and through substrate via, and through substrate via structure therefrom
05/30/2012CN102479765A 具有半导体组件的封装结构 The package structure having a semiconductor component
05/30/2012CN102479764A 散热器固定装置 Sink fixtures
05/30/2012CN102479763A Stackable semiconductor assembly with bump/flange heat spreader and dual build-up circuitry
05/30/2012CN102479762A Stackable semiconductor assembly with bump/flange heat spreader and dual build-up circuitry
05/30/2012CN102479761A Integrated circuit device and method of forming the same
05/30/2012CN102479760A Heating spreading element with aln film and method for manufacturing the same
05/30/2012CN102479759A 散热装置 Cooling devices
05/30/2012CN102479758A Structure for reducing etching residue
05/30/2012CN102479757A Cylindrical packages, electronic apparatus including the same, and methods of fabricating the same
05/30/2012CN102479749A 双镶嵌结构及其形成方法 Dual damascene structure and method of forming
05/30/2012CN102479728A Method for manufacturing semiconductor chips, mounting method and semiconductor chip for vertical mounting onto circuit substrates
05/30/2012CN102479727A 半导体装置的制造方法以及半导体装置 The method of manufacturing a semiconductor device and a semiconductor device
05/30/2012CN102479726A 半导体封装件的制法 The semiconductor package manufacturing method
05/30/2012CN102479725A Stackable semiconductor assembly with bump/flange heat spreader and dual build-up circuitry
05/30/2012CN102479685A 集成电感器及制造集成电感器的方法 Integrated inductor and a method of manufacturing an integrated inductor
05/30/2012CN102479684A Thin film resistors and methods of manufacture
05/30/2012CN102479605A Transformer device and method for manufacturing a transformer device
05/30/2012CN102478620A 射频工艺中射频隔离度的表征方法 RF process characterization methods of RF isolation
05/30/2012CN102477263A 各向异性导电膜用组合物、各向异性导电膜和半导体装置 The anisotropic conductive film composition, the anisotropic conductive film and a semiconductor device
05/30/2012CN102476184A 一种铜粉及其制作方法、制作装置和散热件 One kind of copper powder and its production methods, making device and the heat sink
05/30/2012CN102130076B Thermoelectric computer chip radiator
05/30/2012CN102121802B Plate-type pulsating heat pipe with double-side grooves
05/30/2012CN102104048B MOS (Metal Oxide Semiconductor) type ESD (Electro-Static Discharge) protection structure for silicon on insulator technology and manufacturing method thereof
05/30/2012CN102082105B Thermal wind sensor based on anodic bonding technology and preparation method thereof
05/30/2012CN102059303B Device for bending lead of element
05/30/2012CN102054816B Fusing method for fuse wire
05/30/2012CN102037559B Method for encapsulating multiple LED chips with vertical structure on base to fabricate LED lihgt source
05/30/2012CN102034816B Plasma induced damage test device and method for producing test device
05/30/2012CN102034807B Method and device for protecting grid electrode
05/30/2012CN102020783B Selection method of fillers for advanced encapsulating material
05/30/2012CN102017193B Semiconductor light-emitting device with double-sided passivation
05/30/2012CN101970526B Epoxy resin composition and molded object
05/30/2012CN101965244B Method of manufacturing a heat exchanger
05/30/2012CN101911271B Electronic component
05/30/2012CN101908513B Radiator
05/30/2012CN101905388B Method for manufacturing semiconductor device
05/30/2012CN101894826B Circuit connection device
05/30/2012CN101882608B Bump pad structure and method for manufacturing the same
05/30/2012CN101882585B Method for arranging radiator of integrated circuit and integrated circuit component
05/30/2012CN101866905B Substrate structure and manufacturing method thereof
05/30/2012CN101840922B Array substrate and manufacturing method thereof
05/30/2012CN101840908B Wide-input voltage range zero-leakage current input pull-up circuit
05/30/2012CN101834433B Electrostatic discharge prevention circuit based on complementary SCR (Silicon Controlled Rectifier)
05/30/2012CN101834185B Nitride nonvolatile read-only memory
05/30/2012CN101827513B Radiation device with wind scooper
05/30/2012CN101819943B Processing method of fuse wire on copper interconnection layer and semiconductor device thereof
05/30/2012CN101814458B 半导体装置 Semiconductor device
05/30/2012CN101807599B Semiconductor device and method of manufacturing the same
05/30/2012CN101803012B Method of forming low profile wire bonds between integrated circuits dies and printed circuit boards
05/30/2012CN101800229B Display device
05/30/2012CN101796637B Thermally enhanced thin semiconductor package
05/30/2012CN101794727B Distributed cancellation method of integrated circuit substrate noise and circuit
05/30/2012CN101794708B Semiconductor device, manufacturing method thereof, multi-layer substrate with built in semiconductor device
05/30/2012CN101789403B Chip surface contact glass packaging rectifier tube and manufacturing method thereof
05/30/2012CN101785106B Semiconductor device including semiconductor constituent and manufacturing method thereof
05/30/2012CN101783344B Power transistor chip with built-in starting transistor and application circuit thereof
05/30/2012CN101778550B Radiating module and electronic device comprising same
05/30/2012CN101728381B Active component array substrate, liquid-crystal display panel and driving method thereof
05/30/2012CN101714513B Method for producing the semiconductor device
05/30/2012CN101685836B Manufacture method of wafer level upright type diode packaging structure
05/30/2012CN101667580B CMOS integrated circuit resisting total dose radiation
05/30/2012CN101661929B Stacked type chip package structure and stack type chip package structure
05/30/2012CN101657063B Method for manufacturing radiating circuit board and radiating circuit board
05/30/2012CN101656820B Solid-state imaging device and method of manufacturing the same
05/30/2012CN101635290B Metal bump structure and application thereof to packaging structure
05/30/2012CN101616572B Radiating device
05/30/2012CN101610646B Electrical connection structure as well as technology and circuit board structure thereof
05/30/2012CN101598315B Illumination device and radiation structure thereof
05/30/2012CN101589467B Semiconductor device comprising electromigration prevention film and manufacturing method thereof
05/30/2012CN101582414B Power module by directly bonding power terminal
05/30/2012CN101582413B Power module with lower stray inductance
05/30/2012CN101577235B Separating and assembling semiconductor strips
05/30/2012CN101563773B Method for incorporating existing silicon die into 3d integrated stack
05/30/2012CN101546742B Mounting structure of semiconductor device and electronic apparatus using thereof
05/30/2012CN101528594B Novel lamellar zirconium phosphate
05/30/2012CN101521198B Electronic device
05/30/2012CN101521175B Semiconductor device and a manufacturing method therefor
05/30/2012CN101516993B Epoxy resin composition for semiconductor encapsulation and semiconductor device
05/30/2012CN101499445B 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
05/30/2012CN101494208B Semiconductor component package body
05/30/2012CN101472445B Radiating device
05/30/2012CN101471316B Circuit substrate, circuit device and manufacturing process thereof
05/30/2012CN101447541B Semiconductor device
05/30/2012CN101447493B Active matrix substrate, display device, and pixel defect correcting method
05/30/2012CN101436589B Semiconductor module and image pickup apparatus
05/30/2012CN101411050B Power converter and its assembling method
05/30/2012CN101399258B 半导体装置 Semiconductor device
05/30/2012CN101388398B Active element array substrate, LCD panel and LCD
05/30/2012CN101384638B Epoxy resin composition for sealing of semiconductor and semiconductor device
05/30/2012CN101369563B Semi-conductor element and method of producing a metal semi-conductor contact
05/30/2012CN101345268B Semiconductor photovoltaic element with joining structure
05/30/2012CN101335262B Stack package and method for manufacturing the same
05/30/2012CN101312640B Heat radiating device
05/30/2012CN101275736B Heat radiation structure
05/30/2012CN101228640B Systems and methods for producing white-light light emitting diodes
05/30/2012CN101211877B 半导体装置 Semiconductor device
05/30/2012CN101179054B SOQ substrate , and method for manufacturing SOQ substrate
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