Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
05/2012
05/30/2012CN202259280U Chip package structure
05/30/2012CN202259279U Shielding bracket in infrared receiver module
05/30/2012CN202259278U Convenient voltage and current equal-specification identification diode
05/30/2012CN202259277U Integrated circuit
05/30/2012CN202259276U Semiconductor structure and packaging structure of the same
05/30/2012CN202259275U 16-pin high-density integrated circuit packaging structure
05/30/2012CN202259274U Double in-line package (DIP) packaging lead frame
05/30/2012CN202259273U Lead wire packaging framework structure
05/30/2012CN202259272U Triode lead frame with lead holes
05/30/2012CN202259271U Electroplated triode lead frame
05/30/2012CN202259270U Lead frame with inwards sunken chip areas
05/30/2012CN202259269U Lead frame of improved semiconductor element
05/30/2012CN202259268U Carving-first plating-second lead frame structure with base island prefilled with plastic packaging materials
05/30/2012CN202259267U Non-basic-island pre-filled plastic material lead frame structure etched firstly and plated secondly
05/30/2012CN202259266U Novel lead frame structure with base island and prefilled plastic sealing material
05/30/2012CN202259265U Novel island-free lead frame structure with pre-filling plastic packaging material
05/30/2012CN202259264U Square flat lead frame for integrated circuit
05/30/2012CN202259263U DIP (Double in-line Package) enclosure wire rack
05/30/2012CN202259262U Lead frame for mounting integrated circuit
05/30/2012CN202259261U Lead frame with a heat sink
05/30/2012CN202259260U Leadless IC structure
05/30/2012CN202259259U Lead frame plate of micro-electronic triode capable of preventing pipe core from slipping
05/30/2012CN202259258U 8-pin high-density integrated circuit packaging structure
05/30/2012CN202259257U Wire soldering point structure for chip packaging
05/30/2012CN202259256U Rectifier bridge module of electromagnetic oven
05/30/2012CN202259255U Igbt radiator
05/30/2012CN202259254U Novel water cooling heat radiator
05/30/2012CN202259253U Heat pipe type heat radiation device capable of increasing the heat conduction efficiency
05/30/2012CN202259252U Radiator fixing part for rectification module
05/30/2012CN202259251U Insulating heat radiation electronic assembly
05/30/2012CN202259250U Radiating fin structure with radiating convection holes
05/30/2012CN202259249U Triode with heat radiation device
05/30/2012CN202259248U Packaging structure, small-outline packaging structure and electronic chip thereof
05/30/2012CN202259247U Power semiconductor element
05/30/2012CN202259246U RFID (radio frequency identification device) packaging structure
05/30/2012CN202259245U Packaging structure for chip
05/30/2012CN202259244U Package structure with built-in TF (Trans Flash) memory card
05/30/2012CN202259243U Package with frame subjected to film coating after ball bonding
05/30/2012CN202259242U Silicon plastic packaging rectifier diode
05/30/2012CN202259241U PIN (Positive Intrinsic Negative) diode
05/30/2012CN202259240U Schottky diode
05/30/2012CN202259239U High stability electronic triode
05/30/2012CN202259238U Audion with capacitance detector
05/30/2012CN202259237U Rectifier chip terminal
05/30/2012CN202259236U Wafer supporting carrier
05/30/2012CN202259235U Voltage-stabilizing diode structure
05/30/2012CN202259234U Photovoltaic by-pass diode module possessing radiator
05/30/2012CN202259233U Flexible semiconductor element
05/30/2012CN202259232U Framework structure used for integrating wafers
05/30/2012CN202259231U Electronic device with low-thermal-stress organic substrate
05/30/2012CN202259199U Porcelain plate for manufacturing semiconductor devices
05/30/2012CN202258597U Through hole-free thin film resistor with dielectric cap layer
05/30/2012CN202258365U Solid state storage device based on embedded multi-media card grid encapsulation
05/30/2012CN202258364U Multichannel storing device based on semiconductor package
05/30/2012CN202257630U Novel intelligent card
05/30/2012CN202256948U V-shaped glue sealing device of pin of LCD (Liquid Crystal Display)
05/30/2012CN202254989U Fiber sintered type micro heat pipe
05/30/2012CN202240181U Three-layer metal composite soldering tag
05/30/2012CN1996493B Phase-change memory device
05/30/2012CN1864909B Solder alloy and a semiconductor device using the solder alloy
05/30/2012CN1830084B Integrated circuit package and method therefor
05/30/2012CN1754410B Industrial Ethernet switch
05/30/2012CN102484956A Passive cooling enclosure system and method for electronics devices
05/30/2012CN102484950A Multiple resin-layered substrate and method of manufacture of multiple resin-layered substrate
05/30/2012CN102484943A Many-up wiring substrate, wiring substrate, and electronic device
05/30/2012CN102484477A Die location compensation
05/30/2012CN102484138A 布线层、半导体装置、液晶显示装置 A wiring layer, a semiconductor device, a liquid crystal display device
05/30/2012CN102484137A Semiconductor device, liquid crystal display device equipped with semiconductor device, and process for production of semiconductor device
05/30/2012CN102484117A Radiation imaging apparatus
05/30/2012CN102484114A Nonvolatile semiconductor memory device and method for fabricating same
05/30/2012CN102484108A A high-bandwidth ramp-stack chip package
05/30/2012CN102484107A Electronic device having a molding compound including a composite material
05/30/2012CN102484106A Method for producing an integrated circuit and resulting foil chip
05/30/2012CN102484105A 散热器 Heat sink
05/30/2012CN102484104A 电子器件 Electronic devices
05/30/2012CN102484103A Paper sheet radiator
05/30/2012CN102484102A Electronic device and method for manufacturing electronic device
05/30/2012CN102484101A Circuit board and method for producing same
05/30/2012CN102484099A Semiconductor wafer-to-wafer bonding for dissimilar semiconductor dies and/or wafers
05/30/2012CN102484097A Semiconductor-on-insulator with back side support layer
05/30/2012CN102484096A 使用离子束在过孔内的选择性纳米管生长 Ion beam through holes in the selective growth of nanotubes
05/30/2012CN102484081A Methods and structures for a vertical pillar interconnect
05/30/2012CN102484080A Semiconductor device
05/30/2012CN102483969A Connecting Solar Cell Tabs To A Solar Cell Busbar And A Solar Cell So Produced
05/30/2012CN102483075A Piezoelectric fan and air-cooling device using piezoelectric fan
05/30/2012CN102482779A Stress-reduced ni-p/pd stacks for bondable wafer surfaces
05/30/2012CN102481664A Acousto-optic deflector applications in laser processing of dielectric or other materials
05/30/2012CN102480908A Moulded interconnect device with heat conduction property and manufacturing method thereof
05/30/2012CN102480904A 散热模块及应用其的电子装置 Cooling modules and application of their electronic devices
05/30/2012CN102480895A Electronic device and wind scooper thereof
05/30/2012CN102480835A Soldering connecting pin, semiconductor package substrate and method of mounting semiconductor chip using the same
05/30/2012CN102480306A Wireless local area network module of mobile terminal for wireless transmission
05/30/2012CN102479787A 半导体集成电路装置及制造方法与半导体记忆装置的布局 The layout of the semiconductor integrated circuit device and manufacturing method of the semiconductor memory device
05/30/2012CN102479786A 发光模块及交流发光装置 Light-emitting device emitting module and communication
05/30/2012CN102479774A 半导体封装 The semiconductor package
05/30/2012CN102479773A Module integration circuit package structure with electrical shielding function and manufacturing method thereof
05/30/2012CN102479772A Test structure for monitoring source and drain polycrystalline silicon etching
05/30/2012CN102479771A Semiconductor device, fabricating method thereof and semiconductor package including the semiconductor device
05/30/2012CN102479770A Semiconductor structure and process thereof
05/30/2012CN102479769A Semiconductor device with cross-shaped bumps and test pads alignment
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