Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
05/2012
05/31/2012WO2012070168A1 Semiconductor chip and semiconductor device
05/31/2012WO2012070129A1 Stacked cooler
05/31/2012WO2012068763A1 Gird-array ic chip package without carrier and manufacturing method thereof
05/31/2012WO2012068762A1 Ic chip package of sip system integration level and manufacturing method thereof
05/31/2012WO2012068722A1 Heat conducting lamp base and led lamp including the same
05/31/2012WO2012037140A3 Integrated circuits with through-substrate vias
05/31/2012WO2012013214A3 Method for marking a solar cell, and solar cell
05/31/2012WO2012006991A3 Semiconductor element and method for producing the same
05/31/2012WO2011143549A3 Resonance optimized bonding wire with a sigmoid shaped loop
05/31/2012WO2011127907A3 Method and device for forming solder deposits on raised contact metallization structures
05/31/2012US20120136596 Semiconductor device
05/31/2012US20120135559 Solid-state imaging device and method for manufacturing the same
05/31/2012US20120133381 Stackable semiconductor chip with edge features and methods of fabricating and processing same
05/31/2012US20120133379 Mechanisms for resistivity measurement of bump structures
05/31/2012US20120133061 Photosensitive adhesive, and film adhesive, adhesive sheet, adhesive pattern, semiconductor wafer with adhesive layer, and semiconductor device, which are made using same
05/31/2012US20120133060 Radiation-curable ink jet composition, recording matter, and ink jet recording method
05/31/2012US20120133059 Radiation curable ink jet composition, recorded matter, and ink jet recording method
05/31/2012US20120133058 Semiconductor device
05/31/2012US20120133057 Edge connect wafer level stacking
05/31/2012US20120133056 Semiconductor device, electronic apparatus and semiconductor device fabricating method
05/31/2012US20120133055 Semiconductor chip and semiconductor device
05/31/2012US20120133054 Detector array with a through-via interposer
05/31/2012US20120133053 Surface mount semiconductor device
05/31/2012US20120133052 Semiconductor device and method for manufacturing the same
05/31/2012US20120133051 Silicon based microchannel cooling and electrical package
05/31/2012US20120133050 Tunnel junction via
05/31/2012US20120133049 Process of Fabricating Semiconductor Device and Through Substrate via, and Through Substrate via Structure Therefrom
05/31/2012US20120133048 Semiconductor device, fabricating method thereof and semiconductor package including the semiconductor device
05/31/2012US20120133047 Method of Plating Through Wafer Vias in a Wafer for 3D Packaging
05/31/2012US20120133046 Semiconductor structure and process thereof
05/31/2012US20120133045 Semiconductor device and method of manufacturing the same
05/31/2012US20120133044 Metal containing sacrifice material and method of damascene wiring formation
05/31/2012US20120133043 Solder Joint Flip Chip Interconnection
05/31/2012US20120133042 Mounting structure of chip and module using the same
05/31/2012US20120133041 Semiconductor Devices Having Electrodes and Methods of Fabricating the Same
05/31/2012US20120133040 Semiconductor chip and solar system
05/31/2012US20120133039 Semiconductor package with thermal via and method of fabrication
05/31/2012US20120133038 Integrated circuit package system with stacked die
05/31/2012US20120133037 Clip interconnect with encapsulation material locking feature
05/31/2012US20120133036 Integrated circuit packaging system with connection supports and method of manufacture thereof
05/31/2012US20120133035 Tcp-type semiconductor device and method of testing thereof
05/31/2012US20120133034 Lead frame for electronic component and method of manufacturing the same
05/31/2012US20120133033 Integrated circuit packaging system with multi-row leads and method of manufacture thereof
05/31/2012US20120133032 Package having esd and emi preventing functions and fabrication method thereof
05/31/2012US20120133019 Fuse of semiconductor device and method of forming the same
05/31/2012US20120133018 Semiconductor device and method of repairing the same
05/31/2012US20120133010 Semiconductor device and method of manufacturing the semiconductor device
05/31/2012US20120132984 Semiconductor device and method of manufacturing the same as well as semiconductor memory and method of manufacturing the same
05/31/2012US20120132970 Semiconductor devices and methods of manufacturing the same
05/31/2012US20120132967 Through silicon via and method of fabricating same
05/31/2012US20120132966 Semiconductor structures having improved contact resistance
05/31/2012US20120132963 Standard cell for integrated circuit
05/31/2012US20120132953 Thin-Layer Encapsulation for an Optoelectronic Component, Method for the Production Thereof, and Optoelectronic Component
05/31/2012US20120132463 Printed wiring board and method for manufacturing the same
05/31/2012US20120131916 Thin mirror with truss backing and mounting arrangement therefor
05/31/2012US20120131757 Particle removing member of substrate processing equipment
05/31/2012DE202012004068U1 Kühlstruktur Cooling structure
05/31/2012DE202012004067U1 Kühlvorrichtung Cooler
05/31/2012DE102011100984B3 Method for marking flawed semiconductor chips in semiconductor wafer utilized in light-optical microscope, involves pulling needle-shaped bracket from non liquid part of labeling agent such that virtual point comprises marking on chip
05/31/2012DE102011086854A1 Halbleitervorrichtung Semiconductor device
05/31/2012DE102011054908A1 Halbleitervorrichtung, Herstellungsverfahren dafür und Halbleitergehäuse mit dieser Halbleitervorrichtung A semiconductor device manufacturing method thereof, and semiconductor package with this semiconductor device,
05/31/2012DE102011054886A1 Halbleitervorrichtungen und Verfahren zum Steuern der Temperatur davon Semiconductor devices and methods for controlling the temperature thereof
05/31/2012DE102010061987A1 Semiconductor circuit arrangement has contact pin element that is formed between semiconductor module and circuit board
05/31/2012DE102010060908A1 Method for marking semiconductor wafer used in manufacturing process of solar cell, involves printing information including process parameters in edge of wafer
05/31/2012DE102010060855A1 Elektronisches Bauteil, Verfahren zu dessen Herstellung und Leiterplatte mit elektronischem Bauteil An electronic part, method of producing the electronic component and circuit board with
05/31/2012DE102010052730A1 Manufacturing method of optical device e.g. charge coupled device (CCD) camera for driver assistance system of vehicle, involves respectively receiving several image pickup elements and optical module at substrate and carrier element
05/31/2012DE102008045747B4 Verfahren zum Herstellen einer integrierten Schaltung einschliesslich dem Vereinzeln eines Halbleiter-Wafers und vereinzelter Halbleiter-Wafer A method of fabricating an integrated circuit including dicing a semiconductor wafer and singulated semiconductor wafer
05/31/2012CA2818301A1 Method for the wafer-level integration of shape memory alloy wires
05/30/2012EP2458730A1 Radiofrequency amplifier
05/30/2012EP2458636A1 Compensation Network for RF Transistor
05/30/2012EP2458635A1 Molded lead frame connector with one or more passive components
05/30/2012EP2458634A2 Power amplifying device and coupled power amplifying device
05/30/2012EP2458633A2 Power semiconductor
05/30/2012EP2458632A1 Heat sink module for electronic semiconductor devices
05/30/2012EP2458631A2 Multilayer printed wiring board
05/30/2012EP2458630A2 Package and high frequency terminal structure for the same
05/30/2012EP2458314A2 Heat exchanger with inner fluid to actuate the external fluid pump
05/30/2012EP2457932A1 Composition for film formation, insulating film, and semiconductor device
05/30/2012EP2457423A1 Local thermal management
05/30/2012EP2457269A2 Optoelectronic device with heat spreader unit
05/30/2012EP2457253A1 A high-bandwidth ramp-stack chip package
05/30/2012EP2457252A1 Packaging or mounting a component
05/30/2012EP2456904A1 Method for producing a structured coating on a substrate, coated substrate, and semi-finished product having a coated substrate
05/30/2012EP2122631B1 High speed otp sensing scheme
05/30/2012EP1466364B1 Panel for electronic components and method for the production thereof
05/30/2012EP1409156B1 Method of fabricating conductive nanotube articles
05/30/2012EP1186009B1 Method for removal of sic
05/30/2012CN202261129U Novel metal-oxide-semiconductor field effect transistor (MOSFET) module
05/30/2012CN202261069U Inverter cooling system based on semiconductor refrigeration
05/30/2012CN202261060U Water-cooling radiating double-rectification module suitable for electric welder
05/30/2012CN202261048U Compact rectifier module air duct convenient to replace thyristors
05/30/2012CN202260977U Rectification module air duct for dragging reversible motor
05/30/2012CN202259373U Bypass diode module for photovoltaic component
05/30/2012CN202259318U Point contact type diode
05/30/2012CN202259317U Silicon plastic packaging patch diode
05/30/2012CN202259316U Bilateral switch diode
05/30/2012CN202259315U Silicon bidirectional trigger diode
05/30/2012CN202259314U Breakover diode
05/30/2012CN202259312U Electronic diode
05/30/2012CN202259282U Chip provided with carrying device
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