Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
06/2012
06/06/2012CN102487052A Composite material packaging assembly with integration of chip substrate, heat sink and substrate and manufacture method thereof
06/06/2012CN102487051A 半导体装置及其制造方法 Semiconductor device and manufacturing method
06/06/2012CN102487050A Power semiconductor device and method for manufacturing the same
06/06/2012CN102487049A Semiconductor substrate and preparation method thereof
06/06/2012CN102487042A Array substrate, manufacturing method and detection method thereof and liquid crystal panel
06/06/2012CN102487025A Support for long combined lead
06/06/2012CN102487023A Salient point and forming method thereof
06/06/2012CN102487021A Semiconductor device and method of forming pad layout for flipchip semiconductor die
06/06/2012CN102487020A Semiconductor device and method of forming bump-on-lead interconnection
06/06/2012CN102487019A Method for manufacturing chip packaging piece
06/06/2012CN102148215B Interconnection structure for improving reliability of soldering spot of soft soldering of CCGA (Ceramic Column Grid Array) device and implementation method
06/06/2012CN102044427B Forming method of copper interconnecting wire and electroplating device
06/06/2012CN101853830B 半导体装置及其制造方法 Semiconductor device and manufacturing method
06/06/2012CN101841968B Circuit board with step-shaped blind hole
06/06/2012CN101802256B Exhaust system structure of film forming apparatus, film forming apparatus and method of disposing of exhaust gas
06/06/2012CN101801167B Solderless heatsink anchor and system thereof
06/06/2012CN101770963B Method of forming conductive layer and semiconductor device
06/06/2012CN101764105B Circuit board with hollow space portion and method for manufacturing the same, manufacture method of circuit device using the circuit board
06/06/2012CN101651134B Observing an internal link via a second link
06/06/2012CN101617404B 半导体装置 Semiconductor device
06/06/2012CN101573788B Attachment of deep drawn resonator shell
06/06/2012CN101536181B Semiconductor device and method for manufacturing same
06/06/2012CN101533785B Methods of forming a thin TIM coreless high density bump-less package and structures formed thereby
06/06/2012CN101527286B Semiconductor module and method of producing the same
06/06/2012CN101499471B Anti-electrostatic discharge input resistance and its production method
06/06/2012CN101471339B Integrated circuit and correlation technique as well as chip size package integrated circuit
06/06/2012CN101399251B Layout method of memory and structure
06/06/2012CN101335320B Method for manufacturing light emitting device
06/06/2012CN101261995B Nonvolatile memory devices and methods of forming the same
06/06/2012CN101257004B Wiring structure, forming method of the same and printed wiring board
06/06/2012CA2761204A1 Microcircuit device manufacturing process
06/05/2012USRE43444 Semiconductor device having an improved connection arrangement between a semiconductor pellet and base substrate electrodes
06/05/2012USRE43443 Leadframe semiconductor integrated circuit device using the same, and method of and process for fabricating the two
06/05/2012US8195117 Integrated switchless programmable attenuator and low noise amplifier
06/05/2012US8194370 Electrostatic discharge protection circuit and device
06/05/2012US8193702 Method of light dispersion and preferential scattering of certain wavelengths of light-emitting diodes and bulbs constructed therefrom
06/05/2012US8193649 Substrate for a display panel, and a display panel having the same
06/05/2012US8193648 Method for detecting errors of exposed positions of a pre-layer and a current layer by an integrated alignment and overlay mark
06/05/2012US8193647 Semiconductor device package with an alignment mark
06/05/2012US8193646 Semiconductor component having through wire interconnect (TWI) with compressed wire
06/05/2012US8193645 Wafer-level, polymer-based encapsulation for microstructure devices
06/05/2012US8193644 Pop precursor with interposer for top package bond pad pitch compensation
06/05/2012US8193643 Semiconductor device and method for fabricating the same
06/05/2012US8193642 Interlayer insulating film, interconnection structure, and methods of manufacturing the same
06/05/2012US8193641 Recessed workfunction metal in CMOS transistor gates
06/05/2012US8193640 MEMS and a protection structure thereof
06/05/2012US8193639 Dummy metal design for packaging structures
06/05/2012US8193637 Semiconductor package and multi-chip package using the same
06/05/2012US8193636 Chip assembly with interconnection by metal bump
06/05/2012US8193635 Integrated circuit having memory and router disposed thereon and method of making thereof
06/05/2012US8193633 Heat conductive sheet and method for producing same, and powder module
06/05/2012US8193632 Three-dimensional conducting structure and method of fabricating the same
06/05/2012US8193631 Semiconductor device and method of manufacturing the semiconductor device
06/05/2012US8193630 System and method of silicon switched power delivery using a package
06/05/2012US8193628 Printed wiring board, a method of manufacturing printed wiring board, a sensor module, and a sensing device
06/05/2012US8193627 IC chip mounting package provided with IC chip located in device hole formed within a package base member
06/05/2012US8193626 Semiconductor package including multiple chips and separate groups of leads
06/05/2012US8193625 Stacked-chip packaging structure and fabrication method thereof
06/05/2012US8193624 Semiconductor device having improved contact interface reliability and method therefor
06/05/2012US8193623 Support with integrated deposit of gas absorbing material for manufacturing microelectronic, microoptoelectronic or micromechanical devices
06/05/2012US8193622 Thermally enhanced thin semiconductor package
06/05/2012US8193621 Semiconductor device
06/05/2012US8193620 Integrated circuit package with enlarged die paddle
06/05/2012US8193619 Lead frame and semiconductor package having the same
06/05/2012US8193618 Semiconductor die package with clip interconnection
06/05/2012US8193617 Semiconductor device and manufacturing method therefor
06/05/2012US8193615 Semiconductor packaging process using through silicon vias
06/05/2012US8193614 Semiconductor device, moisture-resistant frame, groove and method of producing semiconductor device
06/05/2012US8193613 Semiconductor die having increased usable area
06/05/2012US8193610 Semiconductor device and method of forming B-stage conductive polymer over contact pads of semiconductor die in Fo-WLCSP
06/05/2012US8193556 Semiconductor chip assembly with post/base heat spreader and cavity in post
06/05/2012US8193549 Surface-textured encapsulations for use with light emitting diodes
06/05/2012US8193547 Leadframe-based packages for solid state light emitting devices and methods of forming leadframe-based packages for solid state light emitting devices
06/05/2012US8193546 Light-emitting-diode array with polymer between light emitting devices
06/05/2012US8193524 Nanoelectronic device
06/05/2012US8193521 Resistive memory cell fabrication methods and devices
06/05/2012US8193468 Methods and systems for precisely relatively positioning a waist of a pulsed laser beam and method and system for controlling energy delivered to a target structure
06/05/2012US8193091 Resin encapsulated semiconductor device and method for manufacturing the same
06/05/2012US8193023 Unit pixel of image sensor having three-dimensional structure and method for manufacturing the same
06/05/2012US8193015 Method of forming a light-emitting-diode array with polymer between light emitting devices
06/05/2012DE202012004734U1 Wärmerohr Heat pipe
06/05/2012DE202012004731U1 Wärmerohr Heat pipe
06/05/2012DE202012004730U1 Wärmerohr Heat pipe
06/05/2012CA2600611C Magnetic self-assembly for integrated circuit packages
06/04/2012DE202012003102U1 Kühlstruktur einer Kühlvorrichtung The cooling structure of a cooling device
05/2012
05/31/2012WO2012071487A2 Integrated circuit device with die bonded to polymer substrate
05/31/2012WO2012071100A1 Siox-based nonvolatile memory architecture
05/31/2012WO2012071093A1 Structure of metal e-fuse
05/31/2012WO2012071003A1 Method for the wafer-level integration of shape memory alloy wires
05/31/2012WO2012070915A2 Encapsulation composition and photovoltaic module
05/31/2012WO2012070612A1 Method for producing electronic device, electronic device, method for producing electronic device package, electronic device package, and method for producing semiconductor device
05/31/2012WO2012070540A1 Electronic component
05/31/2012WO2012070529A1 Epoxy resin composition for semiconductor encapsulation and semiconductor device
05/31/2012WO2012070463A1 Ceramic heat sink material for compression contact structure, semiconductor module using same, and method for producing semiconductor module
05/31/2012WO2012070403A1 Disiloxane derivative having silacycloalkane structure, method for producing disiloxane derivative, film produced using disiloxane derivative, method for producing this film, and material and electronic device using this film
05/31/2012WO2012070402A1 Epoxy resin based molding material for sealing and electronic part or device provided with element sealed with this molding material
05/31/2012WO2012070387A1 Epoxy resin and resin composition
05/31/2012WO2012070385A1 Conductive thin film containing graphene, and transparent conductive film
05/31/2012WO2012070289A1 Thermal conductive sheet and power module
05/31/2012WO2012070261A1 Semiconductor device and method for manufacturing semiconductor device
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