| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 06/07/2012 | US20120139130 Semiconductor Device |
| 06/07/2012 | US20120139129 Wire bonding method and semiconductor device |
| 06/07/2012 | US20120139128 semiconductor package and a method for selecting a chip in the semiconductor package |
| 06/07/2012 | US20120139127 Method for forming isolation trenches |
| 06/07/2012 | US20120139126 Bonding structure of semiconductor package, method for fabricating the same, and stack-type semiconductor package |
| 06/07/2012 | US20120139125 Multi-chip package and method of manufacturing thereof |
| 06/07/2012 | US20120139124 Stacked microelectronic assembly with tsvs formed in stages with plural active chips |
| 06/07/2012 | US20120139123 Offset solder vias, methods of manufacturing and design structures |
| 06/07/2012 | US20120139122 Semiconductor device and manufacturing method thereof |
| 06/07/2012 | US20120139121 Integrated circuit packaging system with pad connection and method of manufacture thereof |
| 06/07/2012 | US20120139120 Semiconductor Device and Method of Forming Openings Through Encapsulant to Reduce Warpage and Stress on Semiconductor Package |
| 06/07/2012 | US20120139118 Semiconductor chip, semiconductor package, and method for manufacturing semiconductor chip for reducing open failures |
| 06/07/2012 | US20120139117 Dense Seed Layer and Method of Formation |
| 06/07/2012 | US20120139116 Bumpless build-up layer and laminated core hybrid structures and methods of assembling same |
| 06/07/2012 | US20120139114 Copper interconnect structure having a graphene cap |
| 06/07/2012 | US20120139113 Undercut-repair of barrier layer metallurgy for solder bumps and methods thereof |
| 06/07/2012 | US20120139112 Selective Seed Layer Treatment for Feature Plating |
| 06/07/2012 | US20120139111 Electronic component |
| 06/07/2012 | US20120139110 Tape |
| 06/07/2012 | US20120139109 Printed circuit board for semiconductor package configured to improve solder joint reliability and semiconductor package having the same |
| 06/07/2012 | US20120139108 Semiconductor package |
| 06/07/2012 | US20120139107 Semiconductor chip and semiconductor device using the chip |
| 06/07/2012 | US20120139106 Semiconductor Device and a Method of Manufacturing the Same |
| 06/07/2012 | US20120139105 Semiconductor structure and manufacturing method thereof |
| 06/07/2012 | US20120139104 Integrated circuit packaging system with pad connection and method of manufacture thereof |
| 06/07/2012 | US20120139103 Semiconductor device with stacked power converter |
| 06/07/2012 | US20120139102 Disposing underfill in an integrated circuit structure |
| 06/07/2012 | US20120139101 Semiconductor device |
| 06/07/2012 | US20120139100 Laminated transferable interconnect for microelectronic package |
| 06/07/2012 | US20120139099 System and method for integrated waveguide packaging |
| 06/07/2012 | US20120139098 Power package module |
| 06/07/2012 | US20120139097 Semiconductor package and method of manufacturing the same |
| 06/07/2012 | US20120139096 Semiconductor module and cooling unit |
| 06/07/2012 | US20120139095 Low-profile microelectronic package, method of manufacturing same, and electronic assembly containing same |
| 06/07/2012 | US20120139093 In-situ foam material as integrated heat spreader (ihs) sealant |
| 06/07/2012 | US20120139092 Multi-chip stack structure |
| 06/07/2012 | US20120139091 Semiconductor device having shield layer and chip-side power supply terminal capacitively coupled therein |
| 06/07/2012 | US20120139090 Stacked package structure |
| 06/07/2012 | US20120139089 Module ic package structure and method for making the same |
| 06/07/2012 | US20120139082 Stacked microelectronic assemby with tsvs formed in stages and carrier above chip |
| 06/07/2012 | US20120139077 Method and apparatus for reducing thermopile variations |
| 06/07/2012 | US20120139076 Thermoelectric cooler system, method and device |
| 06/07/2012 | US20120139075 Thermoelectric cooler system, method and device |
| 06/07/2012 | US20120139068 Multi-chip Package |
| 06/07/2012 | US20120139017 Wireless chip |
| 06/07/2012 | US20120139010 Interposer and semiconductor device |
| 06/07/2012 | US20120138968 Semiconductor package and display panel assembly having the same |
| 06/07/2012 | US20120138946 Semiconductor device and method of manufacturing the same |
| 06/07/2012 | US20120138927 Semiconductor device having stacked structure including through-silicon-vias and method of testing the same |
| 06/07/2012 | US20120138925 Semiconductor chip, stack-type semiconductor package, and method for manufacturing the same |
| 06/07/2012 | US20120138924 Method for measuring impurity concentration profile, wafer used for same, and method for manufacturing semiconductor device using same |
| 06/07/2012 | US20120137514 Methods for fabricating an overmolded semiconductor package with wirebonds for electromagnetic shielding |
| 06/07/2012 | US20120137506 Apparatus for forming a wireless communication device |
| 06/06/2012 | EP2461658A1 Method and apparatus for assembling electric components on a flexible substrate as well as assembly of an electric component with a flexible substrate |
| 06/06/2012 | EP2461654A1 Wiring substrate and manufacturing method for wiring substrate |
| 06/06/2012 | EP2461361A2 Package substrate unit and method for manufacturing package substrate unit |
| 06/06/2012 | EP2461357A2 Metal-resin composite, method for producing the same, busbar, module case, and resinous connector part |
| 06/06/2012 | EP2461356A1 Wafer mold material and method for manufacturing semiconductor apparatus |
| 06/06/2012 | EP2460780A1 Sealing glass, sealing material and sealing material paste for semiconductor devices, and semiconductor device and process for production thereof |
| 06/06/2012 | EP2460393A1 A method of manufacturing substrates having asymmetric buildup layers |
| 06/06/2012 | EP2460181A1 Flexible circuit module |
| 06/06/2012 | EP2460180A1 System-in packages |
| 06/06/2012 | EP1951929B1 Composition for chemical vapor deposition film-formation and method for production of low dielectric constant film |
| 06/06/2012 | DE202012004732U1 Ventilatormodul Fan Module |
| 06/06/2012 | DE10321509B4 Verfahren zum Füllen blinder Durchkontaktierungen und zum Bilden einer Elektrode Method for filling blind vias and for forming an electrode |
| 06/06/2012 | DE102011120404A1 Härtbare Flussmittelzusammensetzung und Lötverfahren A curable flux composition and soldering |
| 06/06/2012 | DE102011120044A1 Härtbare Amin-Flussmittelzusammensetzung und Lötverfahren Curable amine flux composition and soldering |
| 06/06/2012 | DE102011086407A1 Leistungshalbleitermodul The power semiconductor module |
| 06/06/2012 | DE102011086092A1 Halbleitervorrichtung und Verfahren zu ihrer Herstellung Semiconductor device and process for their preparation |
| 06/06/2012 | DE102011055884A1 Gedruckte Schaltplatine für ein Halbleitergehäuse zum Verbessern der Lötverbindungszuverlässigkeit und Halbleitergehäuse dieselbe enthaltend Printed circuit board for a semiconductor package for improving the Lötverbindungszuverlässigkeit and semiconductor package containing the same |
| 06/06/2012 | DE102011006789A1 Kühlvorrichtung für elektrische Module eines Hybridfahrzeugs oder Elektrofahrzeugs A cooling apparatus for electrical modules of a hybrid vehicle or electric vehicle |
| 06/06/2012 | DE102010062453A1 Halbleiterbauelement mit erhöhter Stabilität gegenüber thermomechanischen Einflüssen sowie Verfahren zur Kontaktierung eines Halbleiters A semiconductor device having increased stability against thermo-mechanical influences as well as method for contacting a semiconductor |
| 06/06/2012 | DE102010062429A1 Heat sink for cooling electronic component e.g. insulated gate bipolar transistor, is configured such that ratio of cross-sectional area of cooling section and sum of cross-sectional areas of ribs is set larger than specific value |
| 06/06/2012 | DE102010062346A1 Method for manufacturing molded electronic assembly for brake and engine control device of vehicle, involves pre-treating surface of electronic component such that no encapsulation material is attached at treated surface of component |
| 06/06/2012 | DE102010061044A1 Composite component for semiconductor component cooling device, has upper component with springs that are received in grooves of lower component with backlash between pointed ends of springs and surface of grooves |
| 06/06/2012 | DE102010053392A1 Tub-shaped power semiconductor module for circuit device utilized in electrical system of e.g. electric vehicle, has multiple power terminals and control and auxiliary terminal arranged on tub walls |
| 06/06/2012 | DE102010053047A1 Method for manufacturing high frequency electromagnetic wave transmission line that is coupled to e.g. semiconductor, involves utilizing air-filled cavities for attenuation of air or vacuum, where cavities are produced by covering |
| 06/06/2012 | DE102008047865B4 Schaltungsanordnung und Verfahren zum Herstellen einer Schaltungsanordnung Circuit arrangement and method for manufacturing a circuit arrangement |
| 06/06/2012 | DE102008034075B4 Leistungshalbleitermodul und Verfahren zu dessen Herstellung The power semiconductor module and method for its production |
| 06/06/2012 | DE102005027945B4 Verlustarmes elektrisches Bauelement mit einem Verstärker Low-loss electrical component with an amplifier |
| 06/06/2012 | DE102004017284B4 Integrierte Halbleiterschaltung und Verfahren zur Prüfung der integrierten Halbleiterschaltung A semiconductor integrated circuit and method for testing the semiconductor integrated circuit |
| 06/06/2012 | CN202269133U 散热元件的固定结构 Radiating element fixing structure |
| 06/06/2012 | CN202269122U 抗干扰双腔平行封焊金属壳体混合组装结构 Dual-chamber parallel interference seal weld metal shell hybrid assembly structure |
| 06/06/2012 | CN202268345U 圆片级通孔互联结构 Wafer-level through-hole interconnection structure |
| 06/06/2012 | CN202268344U 一种用于三极管的引线框架 A lead frame for transistor |
| 06/06/2012 | CN202268343U 一种半导体元件的引线框架 A semiconductor device lead frame |
| 06/06/2012 | CN202268342U Diode of SOD-123 packaging structure |
| 06/06/2012 | CN202268341U 一种用于固定晶体管的组件 An assembly for fixed transistor |
| 06/06/2012 | CN202268340U 一种ccd探测器的制冷装置 One kind of the refrigeration apparatus ccd detector |
| 06/06/2012 | CN202268339U 一种新型的肖特基半导体器件 A novel Schottky semiconductor device |
| 06/06/2012 | CN202267909U Computer radiating system improved through thermoelectric cooler |
| 06/06/2012 | CN202266822U 一种用于加工u型截面金属带材的带坯断面形状 A cross-sectional shape of the machined billet u-section metal strip for |
| 06/06/2012 | CN102487085A Semiconductor device and manufacture method thereof |
| 06/06/2012 | CN102487059A Stacked package structure |
| 06/06/2012 | CN102487058A Semiconductor chip, semiconductor package, and method for manufacturing semiconductor chip |
| 06/06/2012 | CN102487057A Metal front dielectric layer and preparation method thereof |
| 06/06/2012 | CN102487056A Dummy metal in integrated circuit and method for manufacturing integrated circuit plate |
| 06/06/2012 | CN102487055A Metal-oxide-metal capacitor structure |
| 06/06/2012 | CN102487054A Semiconductor device and method of manufacturing same, and power supply apparatus |
| 06/06/2012 | CN102487053A Semiconductor device and method of manufacturing same |