Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
06/2012
06/13/2012CN101578695B Semiconductor element mounting structure and semiconductor element mounting method
06/13/2012CN101553908B Folded frame carrier for MOSFET BGA
06/13/2012CN101542718B Resin bleeding inhibitor and method of preventing resin bleeding and substrate
06/13/2012CN101534625B Radiator fastener and radiator combination using the fastener
06/13/2012CN101533829B Semiconductor device, manufacturing method of semiconductor device
06/13/2012CN101532646B Illuminating apparatus
06/13/2012CN101499481B Electromagnetic wave detecting element
06/13/2012CN101478868B Heat radiating device
06/13/2012CN101460034B Heat radiation device
06/13/2012CN101459192B Organic EL device and electronic apparatus
06/13/2012CN101425516B Split-gate memory cells
06/13/2012CN101335253B Semiconductor package and semiconductor device using the same
06/13/2012CN101308840B Multi-wafer 3d cam cell and manufacture process
06/13/2012CN101286505B Semi-conductor encapsulation structure having an antenna
06/13/2012CN101208798B Integrated circuit die containing metal- and particle-filled through-silicon vias
06/13/2012CN101205444B Adhesive film composition, associated dicing die bonding film, and die package
06/13/2012CN101192596B Semiconductor device and display device having alignment mark
06/13/2012CN101159264B Semiconductor integrated circuit
06/13/2012CN101106888B Heat radiation module
06/12/2012US8199519 Chip adapter
06/12/2012US8199509 Electronic equipment
06/12/2012US8199508 Heat dissipation device
06/12/2012US8198740 Semiconductor package structure and encapsulating module for molding the same
06/12/2012US8198739 Semi-conductor chip with compressible contact structure and electronic package utilizing same
06/12/2012US8198738 Structure of bond pad for semiconductor die and method therefor
06/12/2012US8198737 Method of forming wire bonds in semiconductor devices
06/12/2012US8198736 Reduced susceptibility to electrostatic discharge during 3D semiconductor device bonding and assembly
06/12/2012US8198734 Silicon-on-insulator structures for through via in silicon carriers
06/12/2012US8198733 Semiconductor device with deviation compensation and method for fabricating the same
06/12/2012US8198732 Semiconductor device
06/12/2012US8198731 Protective layer for bond pads
06/12/2012US8198730 Semiconductor device and method of manufacturing the same
06/12/2012US8198729 Connection between a semiconductor chip and a circuit component with a large contact area
06/12/2012US8198728 Semiconductor device and plural semiconductor elements with suppressed bending
06/12/2012US8198727 Integrated circuit/substrate interconnect system and method of manufacture
06/12/2012US8198725 Heat sink and integrated circuit assembly using the same
06/12/2012US8198723 Low inductance power distribution system for an integrated circuit chip
06/12/2012US8198722 Semiconductor package
06/12/2012US8198721 Semiconductor module
06/12/2012US8198719 Semiconductor chip and semiconductor package including the same
06/12/2012US8198718 Semiconductor device with stacked semiconductor chips
06/12/2012US8198717 Signal shifting to allow independent control of identical stacked memory modules
06/12/2012US8198716 Die backside wire bond technology for single or stacked die package
06/12/2012US8198715 MEMS device and process
06/12/2012US8198714 Method and system for configuring a transformer embedded in a multi-layer integrated circuit (IC) package
06/12/2012US8198713 Semiconductor wafer structure
06/12/2012US8198712 Hermetically sealed semiconductor device module
06/12/2012US8198710 Folded leadframe multiple die package
06/12/2012US8198709 Potted integrated circuit device with aluminum case
06/12/2012US8198708 System and method for improving CMOS compatible non volatile memory retention reliability
06/12/2012US8198702 Electrical fuse device
06/12/2012US8198701 Semiconductor device having thermally formed air gap in wiring layer and method of fabricating same
06/12/2012US8198689 Package structure having micro-electromechanical element and fabrication method thereof
06/12/2012US8198684 Semiconductor device with drain voltage protection for ESD
06/12/2012US8198657 Thin film transistor array panel and method for manufacturing the same
06/12/2012US8198627 Semiconductor device with test pads and pad connection unit
06/12/2012US8198626 Reference wafer for calibration and method for fabricating the same
06/12/2012US8198552 Electronic device and hot melt structure thereof
06/12/2012US8198382 Epoxy resin composition for photosemiconductor element encapsulation and cured product thereof, and photosemiconductor device using the same
06/12/2012US8198190 Semiconductor device and method for patterning vertical contacts and metal lines in a common etch process
06/12/2012US8198188 Self-aligned VIAS for semiconductor devices
06/12/2012US8198186 Semiconductor device and method of confining conductive bump material during reflow with solder mask patch
06/12/2012US8198139 Power device package and method of fabricating the same
06/12/2012US8198138 Methods for providing and using grid array packages
06/12/2012CA2645751C Cooling plate structure of cooling apparatus and transmitter with the cooling apparatus
06/07/2012WO2012075371A1 Stacked microelectronic assembly having interposer connecting active chips
06/07/2012WO2012074783A2 Low-profile microelectronic package, method of manufacturing same, and electronic assembly containing same
06/07/2012WO2012074775A1 Packaged integrated device with electrically conductive lid
06/07/2012WO2012074636A1 Stackable semiconductor chip with edge features and methods of fabricating and processing same
06/07/2012WO2012074571A1 Microelectronic assembly with plural stacked active chips having through - silicon vias formed in stages
06/07/2012WO2012074405A1 Method and apparatus for assembling electric components on a flexible substrate as well as assembly of an electric component with a flexible substrate
06/07/2012WO2012074000A1 Method of manufacturing display device
06/07/2012WO2012073988A1 Curable composition, cured article, and method for using curable composition
06/07/2012WO2012073963A1 Package for electronic component mounting and electronic device using same
06/07/2012WO2012073851A1 Adhesive composition, adhesive sheet, and semiconductor device using the adhesive composition or the adhesive sheet
06/07/2012WO2012073766A1 Cooling apparatus for electronic components and method for manufacturing same
06/07/2012WO2012073666A1 Curable epoxy resin composition
06/07/2012WO2012073572A1 Semiconductor device, and process for manufacture of semiconductor device
06/07/2012WO2012073466A1 Substrate, semiconductor device, and method for manufacturing substrate
06/07/2012WO2012073417A1 Electronic-component mounted body, electronic component, and circuit board
06/07/2012WO2012073400A1 Resistor-embedded substrate and current detection module provided with same
06/07/2012WO2012073306A1 Power module
06/07/2012WO2012073302A1 Semiconductor device
06/07/2012WO2012072857A1 Modulation of magnetic properties of a substrate for electronic components
06/07/2012WO2012072792A1 Photovoltaic module with a controlled vacuum, use of an oxygen getter in a photovoltaic module and method for manufacturing such a module
06/07/2012WO2012072633A1 Heat exchanger for a system for solidifying and/or crystallizing a semiconductor
06/07/2012WO2012072519A1 Optoelectronic component and method for producing same
06/07/2012WO2012072388A1 Heat radiation device and electronic device comprising the heat radiation device
06/07/2012WO2012072212A2 Electronic device, method for producing the latter, and printed circuit board comprising electronic device
06/07/2012WO2012071991A1 Chip cooling structure
06/07/2012WO2012071759A1 High density sim card package module and producing method thereof
06/07/2012WO2012040735A3 Methods of forming fully embedded bumpless build-up layer packages and structures formed thereby
06/07/2012WO2012037492A3 Multi-die mems package
06/07/2012WO2012037216A3 Staged via formation from both sides of chip
06/07/2012WO2012028793A3 Treatment, before the bonding of a mixed copper oxide surface, by a plasma containing nitrogen and hydrogen
06/07/2012WO2012016898A3 Method for producing a plurality of electronic devices having electromagnetic shielding and in particular having heat dissipation and electronic device having electromagnetic shielding and in particular having dissipation
06/07/2012US20120140929 Integrated circuits secure from invasion and methods of manufacturing the same
06/07/2012US20120139133 Sealing glass for semiconductor device, sealing material, sealing material paste, and semiconductor device and its production process
06/07/2012US20120139132 Olefin composition
06/07/2012US20120139131 Wafer mold material and method for manufacturing semiconductor apparatus
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