Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2014
12/24/2014CN204045564U 贴片式软恢复塑封二极管 SMD plastic soft recovery diode
12/24/2014CN204045563U 功率半导体用新型金属-陶瓷绝缘基板 Power semiconductors with new metal - ceramic insulating substrate
12/24/2014CN204044842U 一种嵌入式的半导体指纹传感器 An embedded semiconductor fingerprint sensor
12/24/2014CN204044840U 指纹识别模组 Fingerprint Module
12/24/2014CN104247578A 电路板组件 Circuit board assembly
12/24/2014CN104247062A 热电装置和热电冷却模块的制造方法以及使用该热电冷却模块的设备 Manufacturing thermoelectric devices and thermoelectric cooling modules and using the thermoelectric cooling module equipment
12/24/2014CN104247012A 半导体装置及其制造方法 Semiconductor device and manufacturing method thereof
12/24/2014CN104247011A 制冷装置 Refrigeration equipment
12/24/2014CN104247010A 半导体装置 Semiconductor device
12/24/2014CN104247009A 半导体装置以及半导体装置的制造方法 The method of manufacturing a semiconductor device and a semiconductor device
12/24/2014CN104247008A 流路构件和使用该流路构件的换热器以及半导体装置 The channel member and the channel member using heat exchanger, and a semiconductor device
12/24/2014CN104247007A 使用外部和内部热容性材料的增强型封装热管理 The use of external and internal thermal compatibility of materials enhanced package thermal management
12/24/2014CN104247006A 制造芯片封装基板的方法和制造芯片封装的方法 The method of manufacturing chip package substrate and a method of manufacturing the chip package
12/24/2014CN104246995A 具有对准机构的光学装置 Optical device having an alignment mechanism
12/24/2014CN104245849A 固化性组合物、固化物和固化性组合物的使用方法 Use curable composition, cured product of the curable composition and
12/24/2014CN104245847A 固化性树脂组合物及其固化物 The curable resin composition and a cured product
12/24/2014CN104245797A 包含树脂-线性有机硅氧烷嵌段共聚物和有机聚硅氧烷的组合物 The composition of linear organosiloxane block copolymer and an organic polysiloxane - containing resin
12/24/2014CN104244579A 封装基板及其制造方法 Package substrate and manufacturing method thereof
12/24/2014CN104242280A 静电防护电路 ESD protection circuit
12/24/2014CN104241544A 阵列衬底 Array substrate
12/24/2014CN104241513A 一种大功率led多孔相变热沉结构 One kind of power led the porous structure of the phase change heat sink
12/24/2014CN104241459A 发光器件及发光器件封装件 The light emitting device and a light emitting device package
12/24/2014CN104241399A 一种点接触型二极管 For point-contact diode
12/24/2014CN104241282A 双向氮化镓开关及其形成方法 GaN and method of forming a two-way switch
12/24/2014CN104241271A 电容器布置结构和安装电容器的方法 Capacitor arrangement and method for installing a capacitor
12/24/2014CN104241264A 电力用半导体装置 Power semiconductor device
12/24/2014CN104241263A 高低压隔离内埋功率模块 Buried within the high and low voltage power module isolation
12/24/2014CN104241259A 半导体器件和电子器件 Semiconductor devices and electronic devices
12/24/2014CN104241258A 半导体器件 Semiconductor devices
12/24/2014CN104241256A 电子组件模块和制造该电子组件模块的方法 Electronic component modules and method of manufacturing the electronic component module
12/24/2014CN104241255A 电子组件模块及其制造方法 Module and method of manufacturing electronic components
12/24/2014CN104241254A 半导体器件 Semiconductor devices
12/24/2014CN104241253A 静电放电结构和具有静电放电结构的芯片 Electrostatic discharge structure and the structure of the chip has an electrostatic discharge
12/24/2014CN104241252A 使用管芯双保护环结构的管芯断裂检测和防潮保护 Use double guard ring structure die die fracture detection and moisture protection
12/24/2014CN104241251A 半导体器件的测试结构 Test structure of a semiconductor device
12/24/2014CN104241250A 用于形成接触件的掺杂保护层 For doping the protective layer forming a contact member
12/24/2014CN104241249A 硅通孔互连结构及其制作方法 Silicon via interconnect structure and fabrication method thereof
12/24/2014CN104241248A 一种硅通孔结构 A silicone via structures
12/24/2014CN104241247A 电源地网络及其布线方法 Power to the network and its wiring method
12/24/2014CN104241246A 电熔丝结构及其形成方法、半导体器件及其形成方法 Electrical fuse structure and method of forming a semiconductor device and method of forming
12/24/2014CN104241245A 一种基于低k材料和铜互连的mim电容及其制备方法 Based on low-k material and copper interconnects mim capacitor and its preparation method
12/24/2014CN104241244A 可变电容器件 The variable capacitance element
12/24/2014CN104241243A 半导体器件结构及其制作方法 The semiconductor device structure and fabrication method thereof
12/24/2014CN104241242A 接地屏蔽结构及半导体器件 Grounding the shield structure and semiconductor device
12/24/2014CN104241241A 封装基板和封装基板的制造方法 The manufacturing method of the substrate and the encapsulation substrate
12/24/2014CN104241240A 半导体封装件及其制法 Semiconductor package Jiqizhifa
12/24/2014CN104241239A 半导体基板及其制造方法 A semiconductor substrate and manufacturing method thereof
12/24/2014CN104241238A 基于引线框的半导体管芯封装 Leadframe-based semiconductor die package
12/24/2014CN104241237A 超声波键合用镀覆铜丝结构 Ultrasonic Bonding plated copper wire structure
12/24/2014CN104241236A 一种半导体倒装封装结构 A semiconductor flip-chip package structure
12/24/2014CN104241235A 半导体器件 Semiconductor devices
12/24/2014CN104241234A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
12/24/2014CN104241233A 晶圆级半导体封装及其制造方法 Wafer-level semiconductor package and its manufacturing method
12/24/2014CN104241232A 四方扁平无接脚封装件及其制法 No pin quad flat package Jiqizhifa
12/24/2014CN104241231A 芯片封装基板及其制作方法 Chip package substrate and manufacturing method thereof
12/24/2014CN104241230A 半导体器件、显示装置模块及其制造方法 Semiconductor device, a display device module and a manufacturing method
12/24/2014CN104241229A 具有贯穿电极的半导体封装及其制造方法 Having a semiconductor package and method of manufacturing the through electrodes
12/24/2014CN104241228A 具有穿通接触部的asic构件 Having a through-contact portion asic member
12/24/2014CN104241227A 嵌入式封装体及其制造方法、电子系统、及存储卡 Embedded package and its manufacturing method, an electronic system, and the memory card
12/24/2014CN104241226A 新型的高压晶闸管阀模块 The new high-voltage thyristor valve module
12/24/2014CN104241225A 冷却装置 Cooling device
12/24/2014CN104241224A 空间光学遥感器大功率ccd增效导热结构 Space optical remote sensor ccd efficiency thermal power structure
12/24/2014CN104241223A 在均热器或盖板与热源之间建立热连接的方法 Method of establishing connection between a heat soaking or cover with a heat source
12/24/2014CN104241222A 芯片及具有该芯片的电路板 Chip and a circuit board having the chip
12/24/2014CN104241221A 芯片封装结构 Chip package
12/24/2014CN104241220A 一种超小尺寸无塑封装 An ultra small size without plastic packaging
12/24/2014CN104241219A 元件嵌入式封装结构和其制造方法 Element embedded package structure and a manufacturing method thereof
12/24/2014CN104241218A 一种带有散热结构的倒装芯片塑封结构及制造方法 A flip-chip structure and method for manufacturing plastic with a heat dissipation structure
12/24/2014CN104241217A 一种芯片背面裸露的扇出型封装结构及制造方法 A chip on the back of the exposed fan-out package structure and method of manufacture
12/24/2014CN104241216A 一种封装高度可控的扇出型封装结构及制造方法 A highly controllable fan-out package structure and method of manufacture packaging
12/24/2014CN104241215A 半导体封装结构及半导体工艺 Semiconductor package structure and semiconductor process
12/24/2014CN104241214A 半导体封装件及其制造方法 Semiconductor package and its manufacturing method
12/24/2014CN104241213A 超薄型全平面式感测装置及其制造方法 Ultra-thin full-flat sensing device and manufacturing method
12/24/2014CN104241212A 柔性层叠封装体、包括其的电子系统及包括其的存储卡 Flexible laminate package, including its electronic system including a memory card and
12/24/2014CN104241211A 薄膜晶体管结构、其制造方法以及薄膜晶体管发光元件结构 A thin film transistor structure, its manufacturing method, and a thin film transistor structure of the light emitting element
12/24/2014CN104241210A 一种低成本超薄扇出型封装结构及其制作方法 An ultra-thin fan-out package structure and method of making low-cost
12/24/2014CN104241209A 一种室外用电源专用功率模块 One kind of special power supply module for outdoor use
12/24/2014CN104241208A 半导体装置 Semiconductor device
12/24/2014CN104241207A 半导体及其制造方法 The semiconductor manufacturing method thereof
12/24/2014CN104241206A 基板结构 Substrate structure
12/24/2014CN104241205A 一种衬底可剥离的外延结构及其应用 A substrate can be stripped of epitaxial structure and its application
12/24/2014CN104241198A 使用自对准接触插塞来制造半导体器件的方法和半导体器件 Using a self-aligned contact plug to a method of manufacturing a semiconductor device and semiconductor device
12/24/2014CN104241197A 在具有高薄层电阻的工件上的电化学沉积 Electrochemical deposition on a workpiece having a high sheet resistance of
12/24/2014CN104241196A 层叠式封装件及其制法 Stacked package Jiqizhifa
12/24/2014CN104241194A 半导体互连结构及其制作方法 Semiconductor interconnect structure and fabrication method thereof
12/24/2014CN104241146A 金属垫的形成方法及半导体结构 Forming a metal pad and the semiconductor structure
12/24/2014CN104241090A 光学底板镜 Optical backplane mirror
12/24/2014CN104231958A 半导体制造工艺用粘合材料 The semiconductor manufacturing process using an adhesive material
12/24/2014CN102944959B 阵列基板、其制作方法、其测试方法及显示装置 Array substrate, its production method, the test method and display device
12/24/2014CN102800644B Ddr信号布线封装基板以及ddr信号布线封装方法 Ddr signal wiring package substrate and signal routing encapsulation method ddr
12/24/2014CN102760719B 集成电路装置的反熔丝组件 Antifuse components integrated circuit device
12/24/2014CN102760688B 双镶嵌结构及其形成方法、半导体器件 Dual damascene structure and method of forming a semiconductor device
12/24/2014CN102693969B 一种igbt功率模块 One kind igbt power module
12/24/2014CN102610709B 封装载板及其制作方法 Package carrier and its production method
12/24/2014CN102576675B 布线层、半导体装置、具有半导体装置的液晶显示装置 The liquid crystal wiring layer, a semiconductor device, a semiconductor device having a display device
12/24/2014CN102549743B 半导体模块和冷却单元 The semiconductor module and the cooling unit
12/24/2014CN102543905B 半导体封装件及其制造方法 Semiconductor package and its manufacturing method
12/24/2014CN102414825B 功率用半导体装置 Power semiconductor device
12/24/2014CN102301465B 贯穿衬底的通路 Through the passage of the substrate
12/24/2014CN102257374B 传感器装置和用于制造传感器装置的方法 Sensor apparatus and method for manufacturing a sensor device
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