Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2014
12/30/2014US8921160 3D IC configuration with contactless communication
12/30/2014US8921159 Stacked interposer leadframes
12/30/2014US8921157 Printed substrate manufacturing equipment and manufacturing method
12/30/2014US8921150 Process to achieve contact protrusion for single damascene via
12/30/2014US8921136 Self aligned contact formation
12/30/2014US8921125 Method of making ferroelectric memory device with barrier layer and novolac resin passivation layer
12/30/2014US8920934 Hybrid solder and filled paste in microelectronic packaging
12/30/2014US8920707 Composite heat-dissipation substrate and manufacturing method of the same
12/30/2014US8920027 Assessing thermal mechanical characteristics of complex semiconductor devices by integrated heating systems
12/30/2014US8919631 Wire bonder including a transducer, a bond head, and a mounting apparatus
12/30/2014US8919427 Long-acting heat pipe and corresponding manufacturing method
12/30/2014US8919424 Semiconductor element cooling structure
12/30/2014US8918988 Methods for controlling wafer curvature
12/30/2014US8918971 Method of manufacturing packages
12/25/2014US20140377946 Bonded Structures for Package and Substrate
12/25/2014US20140377914 Single Layer Coreless Substrate
12/25/2014US20140377913 Molded interposer package and method for fabricating the same
12/25/2014US20140377912 Microelectronic flip chip packages with solder wetting pads and associated methods of manufacturing
12/25/2014US20140377910 Leadless semiconductor package and method of manufacture
12/25/2014US20140377908 Methods for the Formation of a Trap Rich Layer
12/25/2014US20140376595 Thermoresistance sensor structure for integrated circuits and method of making
12/25/2014US20140376202 Printed circuit board, semiconductor device connection structure, and method of manufacturing a printed circuit board
12/25/2014US20140376184 Semiconductor device and cooler thereof
12/25/2014US20140376169 Semiconductor memory device and method of manufacturing the same
12/25/2014US20140375341 Die Fracture Detection and Humidity Protection with Double Guard Ring Arrangement
12/25/2014US20140374930 Method for transferring objects onto a substrate using a compact particle film, including a step of producing connectors on the objects
12/25/2014US20140374926 Semiconductor device
12/25/2014US20140374925 Component assembly using a temporary attach material
12/25/2014US20140374922 Alignment in the Packaging of Integrated Circuits
12/25/2014US20140374921 Ball Height Control in Bonding Process
12/25/2014US20140374920 Cd control
12/25/2014US20140374919 Method for Producing Contact Areas on a Semiconductor Substrate
12/25/2014US20140374918 Asic element including a via
12/25/2014US20140374917 Component in the form of a wafer level package and method for manufacturing same
12/25/2014US20140374916 Tsv interconnect structure and manufacturing method thereof
12/25/2014US20140374915 Integration of optical components in integrated circuits
12/25/2014US20140374914 Stress compensation patterning
12/25/2014US20140374912 Micro-Spring Chip Attachment Using Solder-Based Interconnect Structures
12/25/2014US20140374911 Device having reduced pad peeling during tensile stress testing and a method of forming thereof
12/25/2014US20140374910 Semiconductor device and manufacturing method thereof
12/25/2014US20140374909 Method for filling trench with metal layer and semiconductor structure formed by using the same
12/25/2014US20140374908 Semiconductor Device and Manufacturing Method Thereof
12/25/2014US20140374907 Ultra-thin copper seed layer for electroplating into small features
12/25/2014US20140374906 Method for processing a carrier and an electronic component
12/25/2014US20140374905 Formation of conductive circuit, conductive circuit, and conductive ink composition
12/25/2014US20140374904 Semiconductor device, semiconductor device manufacturing method, and semiconductor manufacturing apparatus
12/25/2014US20140374903 Metal to metal bonding for stacked (3d) integrated circuits
12/25/2014US20140374902 Stack type semiconductor package
12/25/2014US20140374901 Semiconductor package and method of fabricating the same
12/25/2014US20140374900 Semiconductor package and method of fabricating the same
12/25/2014US20140374899 Package with Solder Regions Aligned to Recesses
12/25/2014US20140374898 Semiconductor device and semiconductor device fabrication method
12/25/2014US20140374897 Thermal interface material for integrated circuit package and method of making the same
12/25/2014US20140374896 Semiconductor device, method for installing heat dissipation member to semiconductor device, and a method for producing semiconductor device
12/25/2014US20140374895 Semiconductor device
12/25/2014US20140374894 Package on package structrue and method for manufacturing same
12/25/2014US20140374893 Semiconductor package
12/25/2014US20140374892 Lead frame and semiconductor device using same
12/25/2014US20140374891 Semiconductor device with heat spreader and thermal sheet
12/25/2014US20140374890 Semiconductor device and method for manufacturing the same
12/25/2014US20140374889 Semiconductor device
12/25/2014US20140374888 Semiconductor device
12/25/2014US20140374883 Semiconductor package and method of fabricating the same
12/25/2014US20140374877 Integrated Circuits With On-Die Decoupling Capacitors
12/25/2014US20140374876 Semiconductor device having an inductor
12/25/2014US20140374874 Programmable fuse structure and methods of forming
12/25/2014US20140374873 Methods and apparatus for congestion-aware buffering using voltage isolation pathways for integrated circuit designs with multi-power domains
12/25/2014US20140374856 Apparatus and Method for Preventing Stiction of MEMS Devices Encapsulated by Active Circuitry
12/25/2014US20140374809 Pads including curved sides and related electronic devices, structures, and methods
12/25/2014US20140374805 Semiconductor structure and manufacturing method thereof
12/25/2014US20140374775 Electronic component and manufacturing method for electronic component
12/25/2014US20140374757 Semiconductor memory device, and method of manufacturing the same
12/25/2014US20140374750 Thin film transistor and display panel including the same
12/25/2014US20140374470 Soldering method and method of manufacturing semiconductor device
12/25/2014US20140374467 Capillary bonding tool and method of forming wire bonds
12/25/2014US20140374145 Hermetically-sealed electrical circuit apparatus
12/24/2014CN204047008U 一种具有螺旋形散热鳍片的散热装置 A spiral fin heat sink has
12/24/2014CN204047002U 车载逆变器功率器件散热结构 Car inverter power devices thermal structure
12/24/2014CN204047000U 一种散热模组用铆合装置 A heat sink module with a riveting device
12/24/2014CN204046396U 一种煤矿用防爆变频器专用散热装置 A coal mine explosion dedicated inverter heat sink
12/24/2014CN204045600U 一种瞬态抑制二极管 One kind TVS Diodes
12/24/2014CN204045598U 一种塑封二极管 One kind of plastic diode
12/24/2014CN204045596U 聚酰亚胺胶保护芯片台面的塑封功率二极管 Polyimide plastic protective plastic power diode chip countertops
12/24/2014CN204045581U 一种高温电源模块 A high-temperature power modules
12/24/2014CN204045580U 一种电迁移测试结构 An electrical migration test structure
12/24/2014CN204045579U 一种新型的ic芯片载板基板 A novel ic chip carrier substrate
12/24/2014CN204045578U 一种微小型片式大电流三极管 A micro small chip high current transistor
12/24/2014CN204045577U 一种用于集成电路的引线框架 A lead frame for an integrated circuit
12/24/2014CN204045576U 一种引线框架 A lead frame for
12/24/2014CN204045575U 一种用于较大功率电器的引线框架 A high power electrical lead frame for
12/24/2014CN204045574U 一种用于小功率器件的引线框架 A lead frame for low-power devices
12/24/2014CN204045573U 一种适于打丝的引线框架 A lead frame adapted to hit yarns
12/24/2014CN204045572U 一种带有交叉型载片台的引线框架 A lead frame crossed the stage with
12/24/2014CN204045571U 低废品率轴向二极管电极引线 Low rejection rate axial diode electrode lead
12/24/2014CN204045570U 晶片封装体 Chip package
12/24/2014CN204045569U 一种光伏防反二极管 A photovoltaic blocking diode
12/24/2014CN204045568U 一种功率器件分立式的车用逆变器 A power devices discrete car inverter
12/24/2014CN204045567U Igbt驱动板安装板 Igbt drive plate mounting plate
12/24/2014CN204045566U 一种整流桥封装体 One kind of bridge rectifier package
12/24/2014CN204045565U 晶片封装体 Chip package
1 ... 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 ... 2262