Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
06/2012
06/14/2012DE102011056187A1 Magnetfeld-Stromsensoren Magnetic current sensors
06/14/2012DE102011056157A1 Verfahren zur Herstellung eines Halbleiterbauteils mit isolierten Halbleitermesas A process for producing a semiconductor device with isolated Halbleitermesas
06/14/2012DE102010063021A1 Elektronische Baugruppe mit verbesserter Sinterverbindung Electronic assembly with improved sintering connection
06/14/2012DE102010062965A1 Marking method of solar cell, involves forming etching mask on substrate and performing etching process, and forming raised mark structure on substrate by etching mask
06/14/2012DE102010062914A1 Semiconductor i.e. power semiconductor, for use in direct current power semiconductor of electronic commutated electromotor of motor car, has ceramic layer comprises pores that are filled with thermal conductive medium e.g. adhesive
06/14/2012DE102010062802A1 Sensor device for pressure measurement, has signal interface unit which outputs digital signals and receives input signals, and portion of analog components of signal interface unit is formed on sensor semiconductor component
06/14/2012DE102010062761A1 Electronic circuit module for motor car, has overmold material which is bonded on both sides of printed circuit board mounted with electronic component
06/14/2012DE102010062570A1 Wafer system processing method, involves extending electrical plated through-hole from one semiconductor layer into another semiconductor layer through insulation layer, where latter semiconductor layer is partially removed to expose hole
06/14/2012DE102010062556A1 Halbleiterschaltungsanordnung Semiconductor circuitry
06/14/2012DE102010054068A1 Verfahren zur Herstellung eines optoelektronischen Bauelements und Bauelement A process for producing an optoelectronic component and the component
06/13/2012EP2463953A1 Transmission line substrate and semiconductor package
06/13/2012EP2463952A1 Transmission line substrate and semiconductor package
06/13/2012EP2463910A2 Manufacturing method of a solid state imaging device
06/13/2012EP2463906A2 Semiconductor device
06/13/2012EP2463905A1 Packaged RF transistor with special supply voltage leads
06/13/2012EP2463904A2 Multi-chip module (MCM) power quad flat no-lead (PQFN) semiconductor package utilizing a leadframe for electrical interconnections
06/13/2012EP2463903A1 Heat sink
06/13/2012EP2463902A1 Heat sink and method for manufracturing the heat sink
06/13/2012EP2463901A2 Semiconductor device package and method of manufacturing thereof
06/13/2012EP2463900A2 Method for manufacturing a circuit assembly
06/13/2012EP2463899A2 Semiconductor circuit assembly
06/13/2012EP2463896A1 Method for forming through-substrate vias surrounded by isolation trenches
06/13/2012EP2463316A1 Acrylate composition
06/13/2012EP2463046A1 Cu-Al ALLOY POWDER, ALLOY PASTE UTILIZING SAME, AND ELECTRONIC COMPONENT
06/13/2012EP2462616A1 Sensor arrangement and chip comprising additional fixing pins
06/13/2012EP2462615A1 Ohmic connection using widened connection zones in a portable electronic object
06/13/2012EP2462614A2 Packaged semiconductor device for high performance memory and logic
06/13/2012EP2462613A1 Nano-tube thermal interface structure
06/13/2012EP2057869B1 Power core devices and methods of making thereof
06/13/2012CN202276549U Electric connection component
06/13/2012CN202276548U 电连接组件 The electrical connector assembly
06/13/2012CN202275837U 带铜粒子结构的压装式车用二极管 Copper particle structure with pressure-mounted vehicle diode
06/13/2012CN202275833U 光学模块封装单元 The optical module packaging unit
06/13/2012CN202275832U Optical module packaging structure
06/13/2012CN202275831U Photo coupler
06/13/2012CN202275827U 薄外延片上抗辐射eeprom芯片的抗esd器件结构 Wafer thin anti-anti-radiation chip eeprom esd device structure
06/13/2012CN202275826U 一种硅通孔金属互联线电迁移测试结构 A silicone via metal interconnection electromigration test structure
06/13/2012CN202275825U 14引脚高密度集成电路封装结构 14-pin high-density integrated circuit packaging structure
06/13/2012CN202275824U 半导体引线框架 Semiconductor lead frame
06/13/2012CN202275823U 一种散热半导体元件 A heat sink semiconductor element
06/13/2012CN202275822U Semiconductor encapsulation piece and its substrate
06/13/2012CN202275821U 针脚栅格阵列的芯片模块 Chip module pin grid array
06/13/2012CN202275820U 一种高封装效率的半导体元件 A high-efficiency semiconductor device package of
06/13/2012CN202275819U 散热片固定罩 Fixed hood fins
06/13/2012CN202275818U 一种集成半导体致冷件 An integrated semiconductor refrigeration parts
06/13/2012CN202275817U 一种u形半导体致冷件 One kind of u-shaped semiconductor refrigeration parts
06/13/2012CN202275816U 单板散热装置及电子设备 Veneer cooling device and electronic equipment
06/13/2012CN202275815U High-density quad flat non-lead packaging
06/13/2012CN202275814U 覆金属陶瓷基板 Coated cermet substrate
06/13/2012CN202275813U 一种封装牢靠的半导体元件 A solid semiconductor element encapsulation
06/13/2012CN202275807U Tube core to tube core bonding system
06/13/2012CN1783487B Circuit device and its producing method
06/13/2012CN102498564A Method for producing substrate for power module with heat sink, substrate for power module with heat sink, and power module
06/13/2012CN102498563A Heat sink and method for manufracturing the heat sink
06/13/2012CN102498562A Flexible circuit module
06/13/2012CN102497723A Circuit wiring board incorporating heat resistant substrate
06/13/2012CN102496620A Semiconductor chip with integration of voltage controlled oscillator and manufacture method thereof
06/13/2012CN102496614A Packaging structure and packaging method of collimated light device
06/13/2012CN102496612A High-isolation integrated circuit packaged by adopting ceramic casing
06/13/2012CN102496611A Structure used for integrated circuit (IC) metal interconnection reliability test or micro-electro-mechanical system (MEMS) electrode layer
06/13/2012CN102496610A Semiconductor packaging part with extension pin and manufacturing method of semiconductor packaging part
06/13/2012CN102496609A Embedded crystal grain packaging structure and manufacturing method thereof
06/13/2012CN102496608A Semiconductor packaging possessing clamp part and manufacturing method thereof
06/13/2012CN102496607A Method for manufacturing semiconductor device
06/13/2012CN102496606A High-reliability wafer level cylindrical bump packaging structure
06/13/2012CN102496605A Wafer level packaging structure
06/13/2012CN102496604A High-reliability chip-scale packaging structure
06/13/2012CN102496603A Chip level packaging structure
06/13/2012CN102496585A Novel wafer level packaging method
06/13/2012CN102496583A SIM pasting film card packaging manufacturing method with lead bonding and screen printing moudling
06/13/2012CN102496581A Semiconductor packaging structure and manufacturing method for semiconductor packaging substrate of semiconductor packaging structure
06/13/2012CN102495524A Photomask, conducting wire manufacturing method of flat display panel and conducting wire structure of flat display panel
06/13/2012CN102492263A Epoxy under-fill adhesive capable of quickly curing at low temperature and preparation method thereof
06/13/2012CN101930969B Semiconductor package with electromagnetic interference protection cover
06/13/2012CN101924048B Method of manufacturing electronic component
06/13/2012CN101882607B Package structure of chip with conductor layer
06/13/2012CN101872750B Chip structure, stack chip packaging structure and manufacturing method of chip structure
06/13/2012CN101866909B Bidirectional switch module
06/13/2012CN101859743B Device mounting structure, method of mounting device, liquid-jet head, connector, and semiconductor device
06/13/2012CN101821848B Multi-chip module for wirelessly connecting two or more than two bare die to three external lead, and packaged semiconductor assembly
06/13/2012CN101816068B IC mounting substrate and method for manufacturing the same
06/13/2012CN101790781B Method of packaging an integrated circuit die
06/13/2012CN101740688B Packaging body of light source
06/13/2012CN101740556B Hybrid microwave integrated circuit
06/13/2012CN101740547B Semiconductor device and method of manufacturing semiconductor device, target of sputtering device
06/13/2012CN101707207B Silicon controlled device adopting glass passivation protection between gate pole and negative pole and manufacturing method thereof
06/13/2012CN101685783B Light emitting diode chip package structure and making method thereof
06/13/2012CN101673717B 半导体装置 Semiconductor device
06/13/2012CN101667613B Method for manufacturing high radiating luminous element
06/13/2012CN101662920B Heat radiating device
06/13/2012CN101636066B Heat sink
06/13/2012CN101636064B Radiator fastener and heat sink
06/13/2012CN101635285B Ceramic substrate structure with radiating function and manufacturing method thereof
06/13/2012CN101632042B Cleaning composition and process for producing semiconductor device
06/13/2012CN101622681B Semiconductor module for connecting to a transformer winding, and transformer arrangement
06/13/2012CN101616563B Heat sink combination
06/13/2012CN101615601B Vertically upward contact semiconductor and method thereof
06/13/2012CN101600320B Heat radiator
06/13/2012CN101598283B Modular two-stage radiation LED street lamp
06/13/2012CN101592326B Light emitting diode (LED) lamp
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