Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
06/2012
06/20/2012EP2464706A1 Fully-cured thermally or electrically-conductive form-in-place gap filler
06/20/2012EP2187717B1 Circuit board manufacturing method
06/20/2012EP2161292B1 Epoxy resin composition
06/20/2012EP1861880B1 Method of manufacturing solid state imaging device
06/20/2012CN202282347U 一种高频用覆铜板 A high frequency with CCL
06/20/2012CN202282346U Semiconductor chip and lead frame thereof
06/20/2012CN202282345U 引脚框架及其集成电路 Leadframe and IC
06/20/2012CN202282344U 一种散热器 Radiator
06/20/2012CN202282343U 半导体封装件 Semiconductor package
06/20/2012CN202282342U 散热装置 Cooling devices
06/20/2012CN202281810U 电迁移的测试结构 Electrical test structures migration
06/20/2012CN1992294B Semiconductor device and method for manufacturing the same
06/20/2012CN1913146B Thin film conductor and method of fabrication
06/20/2012CN1637960B Direct application voltage variable material, components thereof and devices employing
06/20/2012CN102511078A Semiconductor device having a copper plug
06/20/2012CN102510663A Printed board component and processing method thereof
06/20/2012CN102509726A IP (Intellectual Property) module with encryption structures and manufacturing method of IP module
06/20/2012CN102509725A Test structure and test method for semiconductor substrate for integrating passive components through monitoring
06/20/2012CN102509724A Copper-based bonding wire and preparation method thereof
06/20/2012CN102509723A Panel structure of chip on film
06/20/2012CN102509722A Semiconductor encapsulating element and manufacture method thereof
06/20/2012CN102509707A Process of carrying out passivation protection on rectification chip by use of polyimide
06/20/2012CN102509696A Forming method of alignment mark
06/20/2012CN102508383A Pixel array
06/20/2012CN102508369A Chip-on-film structure for liquid crystal display panel
06/20/2012CN102506598A Gravity-assisted loop heat pipe with ultrasonic vibration atomizing device
06/20/2012CN102504743A Single-component underfill capable of being stored at room temperature and preparation method thereof
06/20/2012CN102142371B Process for manufacturing photovoltaic bypass Schottky diode
06/20/2012CN101996899B Cmos image sensor and manufacturing method thereof
06/20/2012CN101996890B Preparation device and method of carbon nanotube radiators
06/20/2012CN101930962B Capsulation module for electronic components
06/20/2012CN101916746B Submount and method for manufacturing same
06/20/2012CN101911292B Micropad formation for a semiconductor
06/20/2012CN101894830B Stack type package structure and manufacturing method thereof
06/20/2012CN101850942B Micro electromechanical system packaging structure
06/20/2012CN101848621B Radiator
06/20/2012CN101834115B Method of manufacturing solid-state image pickup device and solid-state image pickup device
06/20/2012CN101826538B Solid-state image pickup element, a method of manufacturing the same, and electronic apparatus using the same
06/20/2012CN101809735B Interconnection element with posts formed by plating
06/20/2012CN101768427B Thermal interface material and preparation method thereof
06/20/2012CN101740567B 半导体装置 Semiconductor device
06/20/2012CN101740527B Chip packaging structure and manufacture method thereof
06/20/2012CN101675516B Chips having rear contacts connected by through vias to front contacts
06/20/2012CN101632156B Printable semiconductor structures and related methods of making and assembling
06/20/2012CN101626006B Flexible bonding copper wire and preparation method thereof
06/20/2012CN101599465B Semiconductor structure for protecting chip
06/20/2012CN101599439B Semiconductor die and bond pad arrangement method thereof
06/20/2012CN101593750B Core substrate and printed wiring board
06/20/2012CN101521190B Anti-fuse and method for forming the same, unit cell of nonvolatile memory device with the same
06/20/2012CN101496184B Light source comprising edge emitting elements
06/20/2012CN101483213B Side-emitting LED package with improved heat dissipation
06/20/2012CN101471329B Semiconductor encapsulation part
06/20/2012CN101466244B Radiator
06/20/2012CN101463960B Vehicle lamp and manufacturing method thereof
06/20/2012CN101418206B Encapsulating material composition of LED
06/20/2012CN101416303B Thermal enhanced package
06/20/2012CN101401205B Periphery design for charge balance power devices
06/20/2012CN101394052B Connector
06/20/2012CN101364554B Method of evaluating semiconductor device, and semiconductor wafer, and semiconductor product manufacture method
06/20/2012CN101316485B Electronic component module and method of manufacturing the same
06/20/2012CN101276825B Semiconductor device
06/20/2012CN101220253B Single-component stable luminescent device embedding composition at room temperature
06/20/2012CN101199052B Packaging logic and memory integrated circuits
06/19/2012US8204704 MOS capacitance test structure and associated method for measuring a curve of capacitance as a function of the voltage
06/19/2012US8204471 Wireless communication system
06/19/2012US8203488 Integrated circuit package including miniature antenna
06/19/2012US8203223 Overlay target for polarized light lithography
06/19/2012US8203222 Semiconductor device and method of manufacturing the same
06/19/2012US8203221 Semiconductor device and method for manufacturing the same, and semiconductor sealing resin
06/19/2012US8203220 Integrated circuit package system with multiple device units and method for manufacturing thereof
06/19/2012US8203219 Electrically enhanced wirebond package
06/19/2012US8203218 Semiconductor device package including a paste member
06/19/2012US8203217 Semiconductor package having a stacked wafer level package and method for fabricating the same
06/19/2012US8203216 Layered chip package and method of manufacturing same
06/19/2012US8203215 Layered chip package and method of manufacturing same
06/19/2012US8203214 Integrated circuit package in package system with adhesiveless package attach
06/19/2012US8203213 Methods for packaging microelectronic devices and microelectronic devices formed using such methods
06/19/2012US8203212 Air gaps in a multilayer integrated circuit and method of making same
06/19/2012US8203211 Nonvolatile memory devices having a three dimensional structure
06/19/2012US8203210 Semiconductor device having metal contacts formed in an interlayer dielectric film comprising four silicon-containing layers
06/19/2012US8203209 Bond pad design for reducing the effect of package stress
06/19/2012US8203208 Three-dimensional stacked substrate arrangements
06/19/2012US8203207 Electronic device packages and methods of formation
06/19/2012US8203206 Crosstalk reduction in electrical interconnects using differential signaling
06/19/2012US8203205 Power semiconductor module having a substrate and a pressure device
06/19/2012US8203204 Stacked semiconductor package
06/19/2012US8203203 Stacked redistribution layer (RDL) die assembly package
06/19/2012US8203202 Stacked package and method for forming stacked package
06/19/2012US8203201 Integrated circuit packaging system with leads and method of manufacture thereof
06/19/2012US8203200 Diode leadframe for solar module assembly
06/19/2012US8203199 Tie bar and mold cavity bar arrangements for multiple leadframe stack package
06/19/2012US8203190 MEMS device including a chip carrier
06/19/2012US8203184 Semiconductor integrated circuit
06/19/2012US8203183 Electrostatic discharge diode
06/19/2012US8203167 Semiconductor chip assembly with post/base heat spreader and adhesive between base and terminal
06/19/2012US8203145 Structure for bumped wafer test
06/19/2012US8202933 Silicone resin composition for encapsulating luminescent element and process for producing optical-semiconductor electronic part with the same through potting
06/19/2012US8202799 Methods of manufacturing metal-silicide features
06/19/2012US8202774 Semiconductor memory device including multi-layer gate structure
06/19/2012US8202764 Method of manufacturing semiconductor package
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