Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
06/2012
06/27/2012CN101431065B Metal wiring layer and method of fabricating the same
06/27/2012CN101420841B Heat radiating mechanism
06/27/2012CN101399240B Microelectronic package and method of cooling an interconnect feature in same
06/27/2012CN101388369B Pressure contact three-phase converter module
06/27/2012CN101378053B High-side and low-side nmosfets composite package
06/27/2012CN101373761B Multi-chip module package
06/27/2012CN101361183B Integrated electronic device and cooling device for an integrated electronic device
06/27/2012CN101336569B Ground shields for semiconductors
06/27/2012CN101325207B Thin-film transistor array substrate for X-ray detector and x-ray detector
06/27/2012CN101315934B Embedded optical erasing memory capable of improving illumination efficiency and manufacturing method thereof
06/27/2012CN101263750B Laminated substrate for mounting electronic parts
06/27/2012CN101252115B Semiconductor package and manufacture method thereof as well as electric system and manufacture method thereof
06/27/2012CN101234746B Apparatus and method for housing micromechanical systems
06/27/2012CN101136426B Semiconductor device and method of manufacturing the same
06/26/2012US8209460 Dual memory chip package operable to access heterogeneous memory chips
06/26/2012US8208863 Radio frequency unit analog level detector and feedback control system
06/26/2012US8208250 External thermal solution for a mobile computing device
06/26/2012US8207620 Flip-chip semiconductor package and chip carrier for preventing corner delamination
06/26/2012US8207619 Semiconductor device and method of manufacturing the same
06/26/2012US8207618 Semiconductor device and method of manufacturing the same
06/26/2012US8207616 Adhesive film, dicing die bonding film and semiconductor device using the same
06/26/2012US8207615 Chip package and method for fabricating the same
06/26/2012US8207614 Methods for forming arrays of small, closely spaced features
06/26/2012US8207613 Semiconductor memory device
06/26/2012US8207612 Semiconductor device and manufacturing method thereof
06/26/2012US8207611 Semiconductor device and fabrication method thereof
06/26/2012US8207608 Interconnections for fine pitch semiconductor devices and manufacturing method thereof
06/26/2012US8207607 Semiconductor device with resin mold
06/26/2012US8207606 Semiconductor device
06/26/2012US8207605 Semiconductor device having a sealing resin and method of manufacturing the same
06/26/2012US8207604 Microelectronic package comprising offset conductive posts on compliant layer
06/26/2012US8207603 Stacked chip package structure with leadframe having inner leads with transfer pad
06/26/2012US8207602 High voltage and high power boost converter with co-packaged Schottky diode
06/26/2012US8207601 Electronic component and a method of fabricating an electronic component
06/26/2012US8207600 Integrated circuit package system with encapsulating features
06/26/2012US8207599 Method and apparatus for directing molding compound flow and resulting semiconductor device packages
06/26/2012US8207598 Semiconductor package heat spreader
06/26/2012US8207597 Integrated circuit package system with flashless leads
06/26/2012US8207596 Self-alignment insulation structure
06/26/2012US8207557 Cross-point memory structures
06/26/2012US8207553 Semiconductor chip assembly with base heat spreader and cavity in base
06/26/2012US8207548 Semiconductor light emitting device, light emitting module, lighting apparatus, display element and manufacturing method of semiconductor light emitting device
06/26/2012US8207532 Constant and reducible hole bottom CD in variable post-CMP thickness and after-development-inspection CD
06/26/2012US8207455 Power semiconductor package with bottom surface protrusions
06/26/2012US8207022 Exposed die overmolded flip chip package method
06/26/2012US8207019 Method of making a semiconductor chip assembly with a post/base/post heat spreader and asymmetric posts
06/26/2012US8207017 Stacked dual MOSFET package
06/26/2012US8206836 Tie-bar configuration for leadframe type carrier strips
06/26/2012US8205666 Heat sinks and method of formation
06/26/2012DE202012101235U1 Flüssigkeitsgekühltes Wärmeaustauschmodul Liquid-cooled heat exchange module
06/26/2012CA2481842C Board-level emi shield with enhanced thermal dissipation
06/25/2012DE202011004342U1 Befestigungsvorrichtung zur Befestigung eines Axiallüfters an einem Kühlkörper Fastening device for fixing an axial flow fan to a heat sink
06/22/2012DE202012005457U1 Kühleinheit Cooling unit
06/22/2012CA2762470A1 Method for fabricating a semiconductor device package
06/21/2012WO2012083110A2 Ic device having electromigration resistant feed line structures
06/21/2012WO2012082431A2 Forming die backside coating structures with coreless packages
06/21/2012WO2012082371A1 Lower ic package structure for coupling with an upper ic package to form a package-on-package (pop) assembly and pop assembly including such a lower ic package structure
06/21/2012WO2012082335A1 Microelectronic package and method of manufacturing same
06/21/2012WO2012082181A1 Heat dissipation unit for a wireless network device
06/21/2012WO2012082177A1 Enhanced stacked microelectronic assemblies with central contacts
06/21/2012WO2012082168A1 Pin attachment
06/21/2012WO2012081643A1 Carbon-containing silicon oxide film, sealing film and use of same
06/21/2012WO2012081434A1 Semiconductor device
06/21/2012WO2012081425A1 Ceramic via substrate, metallized ceramic via substrate, and method for manufacturing both
06/21/2012WO2012081328A1 Method for manufacturing electronic component
06/21/2012WO2012081167A1 Semiconductor device and method for manufacturing same
06/21/2012WO2012080808A1 Downhole tool thermal device
06/21/2012WO2012080015A1 Support for an optoelectronic semiconductor chip, and semiconductor chip
06/21/2012WO2012079927A1 Cased electrical component
06/21/2012WO2012079855A2 Electronic assembly comprising an improved sinter connection
06/21/2012WO2012079434A1 Short-pitch lead frame for smd-type led
06/21/2012WO2012079307A1 Method for filling opening
06/21/2012WO2012051003A3 Self-aligning adhesive using solvent and solventless organic resin system in electronic packaging
06/21/2012WO2012049087A3 Semiconductor module and method of manufacturing a semiconductor module
06/21/2012WO2012040373A3 Diamond particle mololayer heat spreaders and associated methods
06/21/2012WO2012012321A3 Stackable molded microelectronic packages with area array unit connectors
06/21/2012WO2011120830A3 Rectifier for alternating-current generators
06/21/2012US20120159118 Lower IC Package Structure for Coupling with an Upper IC Package to Form a Package-On-Package (PoP) Assembly and PoP Assembly Including Such a Lower IC Package Structure
06/21/2012US20120156871 Methods for forming conductive vias in semiconductor device components
06/21/2012US20120156502 Adhesive film, multilayer circuit board, electronic component and semiconductor device
06/21/2012US20120154690 Flexible integrated circuit device layers and processes
06/21/2012US20120153513 Thermosetting encapsulation adhesive sheet
06/21/2012US20120153512 Epoxy resin composition for semiconductor encapsulation and semiconductor device obtained using the same
06/21/2012US20120153511 Hardmask composition and method of forming patterns and semiconductor integrated circuit device including the patterns
06/21/2012US20120153510 Semiconductor device, and method for supplying electric power to same
06/21/2012US20120153509 Semiconductor package and manufacturing method therefor
06/21/2012US20120153508 Thermosetting die-bonding film
06/21/2012US20120153507 Semiconductor device and method for manufacturing the same
06/21/2012US20120153506 Wiring substrate and semiconductor device, and method of manufacturing semiconductor device
06/21/2012US20120153505 Semiconductor Device and Method of Forming Thin Profile WLCSP with Vertical Interconnect over Package Footprint
06/21/2012US20120153504 Microelectronic package and method of manufacturing same
06/21/2012US20120153503 Creation of vias and trenches with different depths
06/21/2012US20120153502 Structures comprising planar electronic devices
06/21/2012US20120153501 Semiconductor device and manufacturing method thereof
06/21/2012US20120153500 Semiconductor devices and methods of manufacturing semiconductor devices
06/21/2012US20120153499 Semiconductor package and package on package having the same
06/21/2012US20120153498 Semiconductor Device and Method of Forming the Same
06/21/2012US20120153497 Integrated circuit having a three dimensional stack package structure
06/21/2012US20120153496 Tsv for 3d packaging of semiconductor device and fabrication method thereof
06/21/2012US20120153495 Reduced pth pad for enabling core routing and substrate layer count reduction
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