Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
06/2012
06/21/2012US20120153493 Embedded component device and manufacturing methods thereof
06/21/2012US20120153492 Method of fabrication of through-substrate vias
06/21/2012US20120153491 Semiconductor device
06/21/2012US20120153490 Interconnection structure for an integrated circuit
06/21/2012US20120153489 Semiconductor package having proximity communication signal input terminals and manufacturing methods thereof
06/21/2012US20120153488 Simultaneous wafer bonding and interconnect joining
06/21/2012US20120153486 Semiconductor device and production method therefor
06/21/2012US20120153485 Semiconductor device and method of forming the same
06/21/2012US20120153484 Methods for directly bonding together semiconductor structures, and bonded semiconductor structures formed using such methods
06/21/2012US20120153483 Barrierless single-phase interconnect
06/21/2012US20120153482 Structure and methods of forming contact structures
06/21/2012US20120153481 Semiconductor device and method for manufacturing the same
06/21/2012US20120153480 Metallization Systems of Semiconductor Devices Comprising a Copper/Silicon Compound as a Barrier Material
06/21/2012US20120153479 Performance Enhancement in Metallization Systems of Microstructure Devices by Incorporating an Intermediate Barrier Layer
06/21/2012US20120153478 Liner layers for metal interconnects
06/21/2012US20120153477 Methods for metal plating and related devices
06/21/2012US20120153476 Etched wafers and methods of forming the same
06/21/2012US20120153475 Method of assembling two integrated circuits and corresponding structure
06/21/2012US20120153473 Lead pin for package substrate and semiconductor package printed circuit board including the same
06/21/2012US20120153472 Semiconductor Device and Method of Providing Z-Interconnect Conductive Pillars with Inner Polymer Core
06/21/2012US20120153471 Semiconductor device and semiconductor package
06/21/2012US20120153470 Bga package structure and method for fabricating the same
06/21/2012US20120153469 Micro electronic mechanical system structure
06/21/2012US20120153468 Elimination of RDL Using Tape Base Flip Chip on Flex for Die Stacking
06/21/2012US20120153467 Semiconductor Device and Method of Forming Thin Profile WLCSP with Vertical Interconnect over Package Footprint
06/21/2012US20120153466 Package structure
06/21/2012US20120153465 Package structure
06/21/2012US20120153464 Localized alloying for improved bond reliability
06/21/2012US20120153463 Multilayer wiring substrate and method of manufacturing the same
06/21/2012US20120153462 Semiconductor device and method of manufacturing semiconductor device
06/21/2012US20120153461 Semiconductor component, semiconductor wafer component, manufacturing method of semiconductor component, and manufacturing method of joining structure
06/21/2012US20120153460 Bump structure and manufacturing method thereof
06/21/2012US20120153459 Method for chip scale package and package structure thereof
06/21/2012US20120153458 Ic device having electromigration resistant feed line structures
06/21/2012US20120153457 Semiconductor package manufacturing method and semiconductor package
06/21/2012US20120153456 Semiconductor device and method for manufacturing the same
06/21/2012US20120153455 Semiconductor device, cooling device, and cooilng device fabrication method
06/21/2012US20120153454 Semiconductor device
06/21/2012US20120153453 Metallic thermal joint for high power density chips
06/21/2012US20120153452 Double-Sided Semiconductor Device and Method of Forming Top-Side and Bottom-Side Interconnect Structures
06/21/2012US20120153451 Semiconductor device
06/21/2012US20120153450 Self-organizing network with chip package having multiple interconnection configurations
06/21/2012US20120153449 Non-leaded package structure and manufacturing method thereof
06/21/2012US20120153447 Microelectronic flip chip packages with solder wetting pads and associated methods of manufacturing
06/21/2012US20120153446 Microelectronic packages with enhanced heat dissipation and methods of manufacturing
06/21/2012US20120153445 Hybrid substrates, semiconductor packages including the same and methods for fabricating semiconductor packages
06/21/2012US20120153444 Semiconductor device
06/21/2012US20120153443 Packaged semiconductor chips with array
06/21/2012US20120153442 Silicon nitride film and process for production thereof, computer-readable storage medium, and plasma cvd device
06/21/2012US20120153435 Enhanced stacked microelectronic assemblies with central contacts and improved ground or power distribution
06/21/2012US20120153433 Tuning the Efficiency in the Transmission of Radio-Frequency Signals Using Micro-Bumps
06/21/2012US20120153430 Integration of shallow trench isolation and through-substrate vias into integrated circuit designs
06/21/2012US20120153419 Semiconductor device, manufacturing method thereof, and electronic apparatus
06/21/2012US20120153409 Thin Semiconductor Device Having Embedded Die Support and Methods of Making the Same
06/21/2012US20120153391 Modular low stress package technology
06/21/2012US20120153390 Transistors with isolation regions
06/21/2012US20120153358 Integrated heat pillar for hot region cooling in an integrated circuit
06/21/2012US20120153357 Contact integration for three-dimensional stacking semiconductor devices
06/21/2012US20120153329 Wafer substrate bonding structure and light emitting device comprising the same
06/21/2012US20120153282 Semiconductor device
06/21/2012US20120153281 Apparatus and methods for determining overlay of structures having rotational or mirror symmetry
06/21/2012US20120153280 Integrated circuit for detecting defects of through chip via
06/21/2012US20120153279 Semiconductor sensor reliability operation
06/21/2012US20120152482 Aluminum bonding member and method for producing same
06/21/2012US20120152454 Low mass foam electrical structure
06/21/2012US20120152302 Diode-Included Connector, Photovoltaic Laminate and Photovoltaic Assembly Using Same
06/21/2012DE112010003323T5 Von oben zu betätigendes Halterungssystem mit Kraftbegrenzung für Kühlelemente From top-actuated suspension system with force limiter for cooling elements
06/21/2012DE112010002307T5 Kühlkörper Heat Sink
06/21/2012DE112010001122T5 Schweißanschluss, Schalteranordnung und Anbringungsverfahren Welded connection, switch assembly and method of attachment
06/21/2012DE112009004795T5 Wärmetauscher und Verfahren zu dessen Herstellung Heat exchanger and method of producing the
06/21/2012DE112009004069T5 Integrierte-Schaltung-Befestigungsstruktur mitLötkugeln und Anschlussstiften MitLötkugeln integrated circuit mounting structure and connection pins
06/21/2012DE102011087353A1 Halbleitervorrichtung Semiconductor device
06/21/2012DE102011087064A1 Halbleitervorrichtung und Verfahren für deren Herstellung Semiconductor device and methods for their preparation
06/21/2012DE102011056547A1 Testen einer Schutzvorrichtung gegen transiente Spannung Testing a device for protection against transient voltage
06/21/2012DE102011050122A1 Component useful as a circuit breaker for an inverter, comprises a MOSFET having a gate terminal and a source terminal, a first diode for measuring a junction temperature of the MOSFET, and a second diode and/or a third diode
06/21/2012DE102011015547B3 Air guide for electrical components arranged on printed circuit board of memory modules of computer server, has roof that is formed with one flap by bending portion of roof along bending edge in direction of proposed placement site
06/21/2012DE102010063780A1 Halbleiterbauelement mit einer Kontaktstruktur mit geringerer parasitärer Kapazität Semiconductor component having a contact structure with lower parasitic capacitance
06/21/2012DE102010063775A1 Halbleiterbauelement mit selbstjustierten Kontaktbalken und Metallleitungen mit vergrößerten Aufnahmegebieten für Kontaktdurchführungen Semiconductor device with self-aligned contact beams and metal lines with enlarged receiving areas for vias
06/21/2012DE102010063299A1 Leistungssteigerung in Metallisierungsystemen mit Mikrostrukturbauelementen durch Einbau einer Barrierenzwischenschicht Performance improvement in Metallisierungsystemen with microstructure devices by installing a barrier interlayer
06/21/2012DE102010063294A1 Metallisierungssysteme von Halbleiterbauelementen, die eine Kupfer/Silizium-Verbindung als ein Barrierenmaterial aufweisen Metallization of semiconductor devices which have a copper / silicon compound as a barrier material
06/21/2012DE102010063220A1 Halbleiterschaltungsanordnung Semiconductor circuitry
06/21/2012DE102010063048A1 Verfahren zur Herstellung einer elektronischen Baugruppe mit Formkörper A process for producing an electronic assembly with molded articles
06/21/2012DE102010062823A1 Klebmasse und Verfahren zur Kapselung einer elektronischen Anordnung Adhesive and method for encapsulating an electronic arrangement
06/21/2012DE102010061647A9 Elektronische Vorrichtung, die bei niedriger Umgebungstemperatur in Betrieb genommen werden kann, und Verfahren zur Inbetriebnahme der elektronischen Vorrichtung An electronic device, which can be taken into operation at low ambient temperatures, and methods of start-up of the electronic device
06/21/2012DE102010055266A1 Electrical component i.e. microelectronic component, for creating operation voltage in LCD backlight unit in e.g. laptop, has chip for connecting arms to terminal, where surface of chip is arranged at retention device in non-contact manner
06/21/2012DE102010054782A1 Gehäustes elektrisches Bauelement A housed electrical component
06/21/2012DE102010054781A1 Module for reducing thermomechanical stress on e.g. surface wave filters, has encapsulated components provided on support substrate, and encapsulation mass surrounding components, where encapsulation mass comprises material recess
06/21/2012DE102009020540B4 Verfahren und Vorrichtung zum Herstellen einer elektronischen Baugruppe und mit dem Verfahren oder in der Vorrichtung hergestellte elektronische Baugruppe Method and apparatus for manufacturing an electronic assembly prepared by the method and in the device or electronic assembly
06/21/2012DE102007063793A1 Halbleiterleistungsmodul The semiconductor power module
06/21/2012DE102006044691B4 Verfahren zum Herstellen einer Anschlussleitstruktur eines Bauelements A method of manufacturing a component of a Anschlussleitstruktur
06/21/2012DE102005008600B9 Chipträger, System aus einem Chipträger und Halbleiterchips und Verfahren zum Herstellen eines Chipträgers und eines Systems Chip carrier system comprising a chip carrier and a semiconductor chip and method of manufacturing a chip carrier and a system
06/21/2012DE10117874B4 Flüssigkristallanzeige Liquid-crystal display
06/20/2012EP2466638A2 High frequency module
06/20/2012EP2466637A2 Semiconductor device, cooling device, and cooling device fabrication method
06/20/2012EP2466636A2 Adaptive thermal gap pad
06/20/2012EP2466635A2 Semiconductor circuit assembly
06/20/2012EP2466634A1 Integration of shallow trench isolation and through-substrate vias into integrated circuit designs
06/20/2012EP2466632A2 Methods for directly bonding together semiconductor structures, and bonded semiconductor structures formed using such methods
06/20/2012EP2466630A1 Method for applying liquid material, application device and programme
06/20/2012EP2465138A1 Semiconductor module and cooling unit
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