Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
06/2012
06/28/2012US20120161093 Via-Configurable High-Performance Logic Block Architecture
06/28/2012US20120160787 Profile member for a solar panel frame
06/28/2012US20120160458 Cooler having ground heated plane for cooling heating electronic component
06/28/2012DE112010000142T5 Kostenoptimiertes Verfahren zum Bilden von hoch dichten passiven Kondensatoren zum Ersetzen diskreter Kondensatoren unter Verwendung eines kostenoptimierten modularen 3D-Wafer-Wafer-Integrationsschemas Cost-effective methods of forming high density passive capacitors to replace discrete capacitors using a cost-optimized modular 3D wafer-wafer integration scheme
06/28/2012DE102011088610A1 Halbleiterbauelement und -packung sowie Verfahren zur Übertragung von Temperaturinformation Semiconductor device and -packung and method for transmitting temperature information
06/28/2012DE102011088322A1 Verbindungssystem zum elektrischen Anschließen elektrischer Geräte und Verfahren zum Verbinden eines elektrisch leitenden ersten Anschlusses und eines elektrisch leitenden zweiten Anschlusses A connection system for electrically connecting electrical devices and methods for connecting an electrically conductive first terminal and a second terminal electrically conducting
06/28/2012DE102011084602A1 Halbleiterbauelement und Herstellungsverfahren desselben Of the same semiconductor device and manufacturing method
06/28/2012DE102011082986A1 Integrierte schaltkreisbaugruppe mit reduzierter parasitärerschleifeninduktivität Integrated-circuit module with reduced parasitärerschleifeninduktivität
06/28/2012DE102011057024A1 Verfahren und System zum Bereitstellen eines Fusing nach der Kapselung von Halbleiterbauelementen A method and system for providing a fusing after the encapsulation of semiconductor devices
06/28/2012DE102011056956A1 Halbleitervorrichtung mit Diode A semiconductor device comprising diode
06/28/2012DE102011056937A1 Die-Gehäuse The housing
06/28/2012DE102011007377A1 LED-Lampen mit poröser Wärmesenke LED lamps with porous heat sink
06/28/2012DE102010064289A1 Größenreduzierung von Kontaktelementen und Kontaktdurchführungen in einem Halbleiterbauelement durch Einbau eines zusätzlichen Abschrägungsmaterials Size reduction of contact elements and vias in a semiconductor device by installing an additional Abschrägungsmaterials
06/28/2012DE102010064247A1 Verfahren zur Herstellung einer Einpressdiode und Einpressdiode A method for producing a press-fit diode and press-fit diode
06/28/2012DE102010056056A1 Verfahren zur Herstellung eines elektrischen Anschlussträgers A method for manufacturing an electrical connection carrier
06/28/2012DE102010055627A1 Elektrisches Modul zur Aufnahme durch Bestückungsautomaten mittels Erzeugung eines Vakuums Electrical module for pickup by means of creating a vacuum pick and place machines
06/28/2012DE102010055623A1 Optoelectronic component, has bonding wire electrically connecting upper pad of semiconductor chip to contact region of support substrate, where bonding wire is secured at upper pad by two ball bumps
06/28/2012DE102010055557A1 Halbleitergehäuse Semiconductor package
06/27/2012EP2469994A1 Electronic device cooling structure
06/27/2012EP2469993A1 Environmental Protection Coating System and Method
06/27/2012EP2469992A1 Method for obtaining a palladium surface finish for copper wire bonding on printed circuit boards and IC-substrates
06/27/2012EP2469617A2 Scalable heat dissipating microelectronic integration platform (SHDMIP) for lighting solutions and method of manufacturing thereof
06/27/2012EP2469592A1 Integrated circuit chip package device
06/27/2012EP2469591A2 Method for fabricating a semiconductor device package
06/27/2012EP2469590A2 Fiber-containing resin substrate, sealed substrate having semiconductor device mounted thereon, sealed wafer having semiconductor device formed thereon, a semiconductor apparatus, and method for manufacturing semiconductor apparatus
06/27/2012EP2469547A1 Method for producing a shielding
06/27/2012EP2126969B1 Method of interconnecting electronic wafers
06/27/2012EP2073261B1 Ceramic substrate component and electronic component using the same
06/27/2012EP1914811B1 Light-emitting device, method for manufacturing same, molded body and sealing member
06/27/2012EP1587892B1 Thermally-formable and cross-linkable precursor of a thermally conductive material
06/27/2012CN202285482U 散热片 Heatsink
06/27/2012CN202285234U Semi-conductor device
06/27/2012CN202285233U Semiconductor device
06/27/2012CN202285232U 一种用于qfn封装元件的pcb散热焊盘结构 Pcb thermal pad structure for packaging components used qfn
06/27/2012CN202285231U 电子元件 Electronic component
06/27/2012CN1949547B Wafer stage chip packing structure of LED and packing method
06/27/2012CN1825586B Led assembly and method of making the same
06/27/2012CN102523677A Multilayer printed wiring board
06/27/2012CN102522394A On-chip chip package and production method thereof
06/27/2012CN102522393A Packaging device and assembly for packaging a plurality of integrated circuits
06/27/2012CN102522392A e/LQFP (low-profile quad flat package) planar packaging part with grounded ring and production method of e/LQFP planar packaging part with grounded ring
06/27/2012CN102522391A e/LQFP (low-profile quad flat package) stacked package with grounded ring and production method of e/LQFP stacked package with grounded ring
06/27/2012CN102522390A Welding-free packaged power module
06/27/2012CN102522389A Small-sized power semiconductor module
06/27/2012CN102522388A Inductor and method for forming same
06/27/2012CN102522387A Static protector of surface mount component
06/27/2012CN102522386A Gate-oxidizing-layer interface-trap density-testing structure and testing method
06/27/2012CN102522385A On-sheet integrated copper inductor
06/27/2012CN102522384A Graphene nanoribbon resistor and production method thereof
06/27/2012CN102522383A IC chip stacked packaging piece with two-ring-arrangement center routing and production method thereof
06/27/2012CN102522382A Chip package
06/27/2012CN102522381A Radiator and manufacturing method thereof
06/27/2012CN102522380A PoP packaging structure
06/27/2012CN102522379A High-current transistor packaging structure and manufacturing method thereof
06/27/2012CN102522378A Distributed image high power tube core
06/27/2012CN102522377A Quad flat no-load (QFN) packaging structure
06/27/2012CN102522376A Microelectronic package and heat dissipation method
06/27/2012CN102522375A Semiconductor device, method for manufacturing semiconductor device, and lead frame
06/27/2012CN102522367A Manufacturing method of integrated circuit with ultra-thick top-layer metal and integrated circuit
06/27/2012CN102522342A Semiconductor structure and method for manufacturing same
06/27/2012CN102522341A Microelectronic packages and associated methods of manufacturing
06/27/2012CN102522339A Method for designing general packaging substrate
06/27/2012CN102516499A Epoxy resin composition for encapsulating semiconductor and semiconductor device
06/27/2012CN102184902B Porous alloy heat pipe radiator with gradient composite structure
06/27/2012CN102096256B Pixel array structure
06/27/2012CN102024785B Semiconductor device
06/27/2012CN101996967B Power bus structure used for multi-power supply chip
06/27/2012CN101996766B Electronic component and manufacturing method thereof
06/27/2012CN101944520B Semiconductor packaging structure and semiconductor packaging process
06/27/2012CN101942197B Heat-conducting silicon rubber composite material and preparing method thereof
06/27/2012CN101937886B Thin chip package structure and method
06/27/2012CN101925998B Board for mounting component, and package for holding component using same
06/27/2012CN101894829B Stacked encapsulating structure
06/27/2012CN101889332B Substrate and method for manufacturing the same
06/27/2012CN101880514B Single-component under-filler with favorable repairing property and preparation method thereof
06/27/2012CN101877346B Static discharge protection system and static discharge protection circuit
06/27/2012CN101866890B Circuit carrier plate and semiconductor packaging structure applying same
06/27/2012CN101866889B Substrate-free chip packaging and manufacturing method thereof
06/27/2012CN101859746B Conductive substrate structure for forming conductive channel by two-sided cutting and manufacturing method thereof
06/27/2012CN101859739B Heat radiation module set
06/27/2012CN101843184B Cooling member
06/27/2012CN101821853B Semiconductor device and manufacturing method thereof
06/27/2012CN101814484B 芯片封装体及其制作方法 Chip package and manufacturing method thereof
06/27/2012CN101814475B Barrier structures and methods for through substrate vias
06/27/2012CN101807595B Three-dimensional semiconductor structure and method of fabricating the same
06/27/2012CN101803011B Cooling apparatus
06/27/2012CN101794754B Semiconductor device
06/27/2012CN101765911B Semiconductor die having a redistribution layer
06/27/2012CN101740537B Semiconductor device and method of modifying an integrated circuit
06/27/2012CN101728340B Semiconductor device and method of manufacturing the same
06/27/2012CN101694841B Integrated circuit of three-dimension memory
06/27/2012CN101667560B Electronic device and method for coping with electrostatic discharge
06/27/2012CN101577264B Printed circuit board and method of manufacturing the same
06/27/2012CN101562172B Semiconductor device
06/27/2012CN101561994B Semiconductor device, display device and electronic device
06/27/2012CN101540329B Thin film transistor substrate and manufacturing process thereof
06/27/2012CN101533827B 半导体集成电路装置 The semiconductor integrated circuit device
06/27/2012CN101511159B Radiating structure and use method thereof
06/27/2012CN101506949B Apparatus and method for processing substrate, method of manufacturing semiconductor device, and recording medium
06/27/2012CN101489370B Heat radiating structure for electronic module and electronic device having the same
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