Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
07/2012
07/04/2012CN101796635B Method and device for cooling a heat generating component
07/04/2012CN101794762B Light source module and lighting device
07/04/2012CN101785110B RF power device and forming method thereof
07/04/2012CN101785107B Method for marking wafers
07/04/2012CN101783326B High-frequency semiconductor apparatus
07/04/2012CN101777549B Packaging module structure of compound semiconductor elements and production method thereof
07/04/2012CN101764117B Line structure of packaging carrier plate and multi-chip packaging body
07/04/2012CN101752358B Compact semiconductor package with integrated bypass capacitor and method
07/04/2012CN101740608B Organic light emitting diode display and display array
07/04/2012CN101740529B Heat radiation material, electronic device and method of manufacturing electronic device
07/04/2012CN101730442B Heat radiation assembly fastener and heat radiation device
07/04/2012CN101728364B 芯片封装体及制作方法 Chip package and method of making
07/04/2012CN101685809B Semiconductor packaging component and conducting wire rack thereof
07/04/2012CN101673733B Integrated circuit chip and seal ring structure of same
07/04/2012CN101662916B Heat dissipation device
07/04/2012CN101657490B Epoxy silicone and method for production thereof, and curable resin composition using the same and use thereof
07/04/2012CN101656244B Multilayer interconnection packaging structure of silica-based embedded microwave multi chip module and manufacturing method
07/04/2012CN101621055B Multi-die integrated circuit device and method
07/04/2012CN101621012B Method of fabricating stacked semiconductor package with localized cavities for wire bonding
07/04/2012CN101616570B Protective cover
07/04/2012CN101616566B Heat sink
07/04/2012CN101614385B LED lamp
07/04/2012CN101595560B Pre-molded clip structure
07/04/2012CN101587894B Electrostatic discharge (esd) protection applying high voltage lightly doped drain (ldd) cmos technologies
07/04/2012CN101573017B Radiating device
07/04/2012CN101567340B Semiconductor chip protection film
07/04/2012CN101563425B Curable silicone composition and electronic component
07/04/2012CN101557677B Printed circuit board
07/04/2012CN101552243B Crystal unit
07/04/2012CN101540306B Semiconductor wafer encapsulation body and encapsulation method thereof
07/04/2012CN101533826B Semiconductor device and production method thereof
07/04/2012CN101529585B Electronic device package structure and package manufacturing method
07/04/2012CN101529567B Method for forming wiring film, transistor, and electronic device
07/04/2012CN101527290B Semiconductor module
07/04/2012CN101522751B Liquid resin composition for electronic part sealing and electronic part apparatus utilizing the same
07/04/2012CN101521204B Transistor having vertical channel and method for fabricating the same
07/04/2012CN101504943B 半导体集成电路 The semiconductor integrated circuit
07/04/2012CN101498434B LED lamp
07/04/2012CN101490825B An interconnect structure with dielectric air gaps
07/04/2012CN101488497B Stacked semiconductor apparatus with configurable vertical I/O
07/04/2012CN101471341B 半导体芯片 Semiconductor chip
07/04/2012CN101471307B 半导体封装体及其制造方法 The semiconductor package manufacturing method thereof
07/04/2012CN101471299B Manufacturing method of image sensor
07/04/2012CN101465356B Semiconductor device
07/04/2012CN101459166B Licht aussendende diode
07/04/2012CN101453857B Heat Radiation device
07/04/2012CN101452941B Thin film transistor substrate, LCD containing same and manufacturing method thereof
07/04/2012CN101442893B System and method for facilitating cooling of a liquid-cooled electronics rack
07/04/2012CN101436602B Array substrate and display panel having the same
07/04/2012CN101436572B Package for integrated circuit lead
07/04/2012CN101432459B Film forming method, and film forming device
07/04/2012CN101409304B Organic electro-luminescent display device
07/04/2012CN101388396B Semiconductor storage device, its manufacturing method and operating method, and portable electronic apparatus
07/04/2012CN101373749B Wafer-class encapsulation structure and preparation method thereof
07/04/2012CN101352802B Method for manufacturing heat radiator having plate-shaped fins
07/04/2012CN101350344B Semiconductor device package and fabricating method thereof
07/04/2012CN101336063B Heat radiating device, two-phase type thermal transmission element and preparation thereof
07/04/2012CN101335263B Semiconductor module and manufacturing method thereof
07/04/2012CN101321813B Prepreg, process for producing prepreg, substrate, and semiconductor device
07/04/2012CN101296596B Heat radiating device
07/04/2012CN101288167B Chip-scale package
07/04/2012CN101286463B Semiconductor device and manufacturing method thereof
07/04/2012CN101277601B Laminated body
07/04/2012CN101261965B Encapsulation structure with micro hole and its making method
07/04/2012CN101252119B Characteristic measuring structure of MOS device
07/04/2012CN101236984B Integrated circuit with magnetic memory
07/04/2012CN101232027B Light emitting device and its formation method
07/04/2012CN101217133B Heat transfer apparatus and method therefor
07/04/2012CN101199242B Method for manufacturing a circuit board structure, and a circuit board structure
07/04/2012CN101192581B Semiconductor device and semiconductor package containing the same
07/04/2012CN101174823B Oscillator circuit and semiconductor device including the same
07/04/2012CN101174062B Display substrate and display panel with the same
07/04/2012CN101142866B Heat-absorbing member, cooling device, and electronic apparatus
07/04/2012CN101114634B A test structure and method for detecting charge effects during semiconductor processing
07/04/2012CN101083220B Substrate, substrate inspecting method and methods of manufacturing an element and a substrate
07/03/2012US8214776 Semiconductor device, method for manufacturing the same, method for generating mask data, mask and computer readable recording medium
07/03/2012US8213209 Method of manufacturing semiconductor device and semiconductor device
07/03/2012US8212370 Resin paste for die bonding, containing a polyurethaneimide resin and thermosetting resin method for manufacturing semiconductor device, and semiconductor device, using the resin paste
07/03/2012US8212369 Semiconductor wafer coated with a filled, spin-coatable material
07/03/2012US8212368 Semiconductor package and manufacturing method thereof and encapsulating method thereof
07/03/2012US8212366 Semiconductor device
07/03/2012US8212364 Method for manufacturing semiconductor apparatus, and semiconductor apparatus and electric appliance
07/03/2012US8212363 Multilayer printed wiring board
07/03/2012US8212362 Semiconductor device
07/03/2012US8212361 Semiconductor die package including multiple dies and a common node structure
07/03/2012US8212360 Semiconductor die having a redistribution layer
07/03/2012US8212359 Semiconductor integrated circuit device, mounting structure of semiconductor integrated circuit device, and method for manufacturing semiconductor integrated circuit device
07/03/2012US8212357 Combination via and pad structure for improved solder bump electromigration characteristics
07/03/2012US8212356 Semiconductor device having multi-layered wiring layer and fabrication process thereof
07/03/2012US8212355 Semiconductor package and manufacturing method of the semiconductor package
07/03/2012US8212354 Active plastic bridge chips
07/03/2012US8212353 Structure and assembly procedure for low stress thin die flip chip packages designed for low-K Si and thin core substrate
07/03/2012US8212352 Integrated circuit package system with heat sink spacer structures
07/03/2012US8212351 Structure for encapsulating microelectronic devices
07/03/2012US8212350 Space and cost efficient incorporation of specialized input-output pins on integrated circuit substrates
07/03/2012US8212349 Semiconductor package having chip using copper process
07/03/2012US8212348 Techniques for packaging multiple device components
07/03/2012US8212347 Stacked chip package structure with leadframe having bus bar
07/03/2012US8212346 Method and apparatus for reducing semiconductor package tensile stress
07/03/2012US8212345 Holding jig, semiconductor wafer grinding method, semiconductor wafer protecting structure and semiconductor wafer grinding method and semiconductor chip fabrication method using the structure
1 ... 352 353 354 355 356 357 358 359 360 361 362 363 364 365 366 367 368 369 370 371 372 ... 2262