Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
07/2012
07/04/2012CN102543908A Flip chip encapsulating piece and manufacturing method thereof
07/04/2012CN102543907A Package and manufacture method for thermal enhanced quad flat no-lead flip chip
07/04/2012CN102543906A Integrated antenna package
07/04/2012CN102543905A Semiconductor package and fabrication method thereof
07/04/2012CN102543904A Modular integrated circuit packaging structure and manufacturing method thereof
07/04/2012CN102543903A Encapsulation improved structure of triode
07/04/2012CN102543902A Semiconductor device and method of manufacturing semiconductor device
07/04/2012CN102543901A Sealing member, sealing method, and method for producing optical semiconductor device
07/04/2012CN102543900A Fiber-containing resin substrate, semiconductor device mounting substrate, semiconductor device forming chip, semiconductor apparatus, and method for manufacturing semiconductor apparatus
07/04/2012CN102543899A Flexible encapsulating substrate and manufacturing method thereof
07/04/2012CN102543898A Cylindrical bump packaging structure
07/04/2012CN102543897A Semiconductor chip and semiconductor package having the same
07/04/2012CN102543896A 显示面板 Display panel
07/04/2012CN102543895A Bump structure and manufacturing method thereof
07/04/2012CN102543894A Bonding pad structure and integrated circuit comprising a plurality of bonding pad structures
07/04/2012CN102543893A Preparation method of semiconductor device
07/04/2012CN102543870A Method for producing a semiconductor component with insulated semiconductor mesas
07/04/2012CN102543852A Metal interconnection structure and manufacturing method thereof
07/04/2012CN102543848A Semiconductor devices having through-contacts and related fabrication methods
07/04/2012CN102543847A Vertical transistor STRAM array
07/04/2012CN102543845A Semiconductor device and manufacturing method thereof
07/04/2012CN102543844A Method for manufacturing semiconductor device structure and semiconductor device structure
07/04/2012CN102543841A Semiconductor device and method for forming plugs
07/04/2012CN102543840A Self-aligned contact etch method
07/04/2012CN102543837A Structure and manufacturing method of top metal interconnection layer
07/04/2012CN102543829A Integration of shallow trench isolation and through-substrate vias into integrated circuit designs
07/04/2012CN102543782A Switching and encapsulating structure and forming method thereof
07/04/2012CN102543779A Semiconductor device and method of forming an inductor within interconnect layer vertically separated from semiconductor die
07/04/2012CN102543778A Methods for directly bonding together semiconductor structures, and bonded semiconductor structures formed using such methods
07/04/2012CN102543777A Integrated circuit packaging system with pad connection and method of manufacture thereof
07/04/2012CN102543776A Method for forming redistribution of welding pad
07/04/2012CN102543775A Method of manufacturing semiconductor device, and manufacturing apparatus
07/04/2012CN102543772A Semiconductor device and method of bonding different size semiconductor die at the wafer level
07/04/2012CN102543771A 半导体器件 Semiconductor devices
07/04/2012CN102543770A Encapsulation method of special half-bridge drive integrated circuit of compact fluorescent lamp
07/04/2012CN102543768A Device and method for forming protective films on chip package
07/04/2012CN102543765A Method for designing bonding pad of surface mounted component, bonding pad structure and printing circuit board
07/04/2012CN102543762A Device and method for preparing dot matrix arrangement type heat dissipation structure
07/04/2012CN102543733A Alignment marking method in DMOS (Double-diffusion Metal Oxide Semiconductor) process flow
07/04/2012CN102543720A Silicon two-way transient voltage suppression diode and manufacture method thereof
07/04/2012CN102543717A Metal layer structure of semiconductor device as well as manufacturing method of metal layer structure and semiconductor device using metal layer structure
07/04/2012CN102543684A Graphic structure design integrated with measurement of line width and alignment precision
07/04/2012CN102543673A Wafer structure and manufacturing method of alignment mark of same
07/04/2012CN102543667A Forming method of graph of aligned layer on silicon chip
07/04/2012CN102543661A Wafer manufacturing method
07/04/2012CN102543201A Semiconductor storage device
07/04/2012CN102540725A 正性光敏树脂组合物 A positive photosensitive resin composition
07/04/2012CN102540593A Fan-out circuit and electronic device having the same
07/04/2012CN102539956A Hacking detecting device, integrated circuit and method of detecting a hacking attempt
07/04/2012CN102533170A Adhesive composition for semiconductor and adhesive film with the same
07/04/2012CN102533136A Adhesive composition, and connection structure for circuit member
07/04/2012CN102532810A Epoxy resin composition for encapsulating semiconductor device and semiconductor device using the same
07/04/2012CN102532807A Epoxy resin composition for semiconductor encapsulation and semiconductor device obtained using the same
07/04/2012CN102528314A Tin, antimony, silver and nickel alloy foil-shaped solder and preparation method thereof
07/04/2012CN102157481B Stress strain welding column for integrated circuit packaging
07/04/2012CN102110674B Semiconductor package
07/04/2012CN102074510B Contact-mat array
07/04/2012CN102064148B Magnetic thermal cycling system
07/04/2012CN102064141B Semiconductor device package for shielding electromagnetic interference
07/04/2012CN102034809B ESD (Electrostatic Discharge) protective circuit
07/04/2012CN102034773B Configurational tree-shaped heat pipe radiator
07/04/2012CN102013417B Novel PCB carrier tape for package of micro radio-frequency module
07/04/2012CN101989584B Method for increasing the thermal coupling heat radiation and reliability of a cooling module
07/04/2012CN101989581B Packaging structure and packaging method
07/04/2012CN101989580B Image sensor package structure with large air cavity
07/04/2012CN101976664B Semiconductor packaging structure and manufacture process thereof
07/04/2012CN101950731B Common line structure, display panel and manufacturing method thereof
07/04/2012CN101950727B System and method for reducing inductance on integrated circuit
07/04/2012CN101944514B Semiconductor packaging structure and package manufacturing technology
07/04/2012CN101930977B Power metal oxide semiconductor field effect transistor (MOSFET) device with tungsten spacing layer in contact hole and preparation method thereof
07/04/2012CN101930952B Compliant multilayered thermally-conductive interface assemblies and memory modules including the same
07/04/2012CN101930928B Manufacturing method of thin base plate for packaging semiconductor
07/04/2012CN101924088B Integrated circuit structure
07/04/2012CN101924083B Packaged semiconductor and production method thereof
07/04/2012CN101924062B Memory device and method for manufacturing an integrated circuit device
07/04/2012CN101919057B Semiconductor device and method of manufacturing semiconductor device
07/04/2012CN101916731B Ceramic insulating film heat-conducting substrate and manufacturing method thereof
07/04/2012CN101911265B Electronic member wherein barrier-seed layer is formed on base
07/04/2012CN101911264B Electronic member wherein barrier-seed layer is formed on base
07/04/2012CN101907807B Display device having oxide thin film transistor and fabrication method thereof
07/04/2012CN101894822B Lead frame band construction for semiconductor packaging
07/04/2012CN101894821B Conductor structure for packaging and routing semiconductor and combination structure thereof
07/04/2012CN101887889B LED integrated circuit module and LED display module
07/04/2012CN101887870B Semiconductor chip package and quad flat non-pin package
07/04/2012CN101882605B Chip packaging structure
07/04/2012CN101872817B Light-emitting diode packaging structure and manufacturing method thereof
07/04/2012CN101870445B Circuit lead structure and micro-electromechanical system
07/04/2012CN101865366B Reflective light-emitting module with high heat dissipation and high luminous efficacy
07/04/2012CN101859742B Device mounting structure, method of mounting device, liquid-jet head, and printer
07/04/2012CN101847616B Barrier for through-silicon via
07/04/2012CN101841975B Method for manufacturing high-thermal conductivity circuit board by hot-pressing method and high-thermal conductivity circuit board
07/04/2012CN101841973B High-thermal conductivity circuit board preparation method based on metal base and circuit board
07/04/2012CN101819970B Welded IGBT and solderless diode-based series structure module
07/04/2012CN101819956B 半导体器件 Semiconductor devices
07/04/2012CN101809738B Memory device interface methods, apparatus, and systems
07/04/2012CN101807558B Element sealing and bonding structure and process thereof
07/04/2012CN101803019B Integrated circuit stack and its thermal management
07/04/2012CN101803009B Composite, thermal interface material containing the composite, and methods for their preparation and use
07/04/2012CN101800215B Wireless communication module package structure
07/04/2012CN101800213B Electrostatic discharge protection device, manufacturing method and drain used thereinto
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