Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
07/2012
07/04/2012CN202307858U 晶体管的散热结构 Thermal structure of the transistor
07/04/2012CN202307857U 一种ccd图像传感器的散热片 One kind ccd image sensor fins
07/04/2012CN202307856U 一种集成电路器件散热结构及集成电路器件 An integrated circuit device heat dissipation structure and integrated circuit devices
07/04/2012CN202307855U 散热装置 Cooling devices
07/04/2012CN202307854U 一种半导体器件 A semiconductor device
07/04/2012CN202307853U 复合式陶瓷金属散热片 Composite ceramic metal fins
07/04/2012CN202307852U 可实现小封装体积的rfid封装结构 Can achieve a small package rfid package structure
07/04/2012CN202307851U 集成电路及其封装模具 IC and packaging mold
07/04/2012CN202307850U 一种芯片的保护装置与电子产品 A chip protection device and electronic products
07/04/2012CN202304514U 热管式冷却装置及使用了该装置的车辆控制装置 Vehicles heat pipe cooling device and the device uses a control device
07/04/2012CN202304511U Panel heat radiator
07/04/2012CN202297814U 集成电路引线框架的电镀导电装置 Plating conductive means integrated circuit lead frame
07/04/2012CN1969383B Lead frame structure with aperture or groove for flip chip in a leaded molded package
07/04/2012CN1967851B Via structures in solar cells with bypass diode
07/04/2012CN1905164B 半导体装置及其制造方法 Semiconductor device and manufacturing method
07/04/2012CN1822358B Capacitor material for use in circuitized substrates, circuitized substrate utilizing same, method of making said circuitized substrate, and information handling system utilizing said circuitized subs
07/04/2012CN102550140A Module and process for production thereof
07/04/2012CN102549743A 半导体模块和冷却单元 The semiconductor module and the cooling unit
07/04/2012CN102549742A Structure for cooling electronic component, and electronic apparatus
07/04/2012CN102549741A Semiconductor device and method for manufacturing same
07/04/2012CN102549740A Semiconductor device, semiconductor package, and method for manufacturing semiconductor device
07/04/2012CN102549739A Ic package with non-uniform dielectric layer thickness
07/04/2012CN102549738A Semiconductor device and method for manufacturing the same
07/04/2012CN102549038A Urethane resin composition, cured object, and photosemiconductor device using cured object
07/04/2012CN102548361A Heat dissipation device using latent heat functional fluid and heat dissipation method thereof
07/04/2012CN102548360A Heat sink
07/04/2012CN102548345A Heat dissipating module
07/04/2012CN102548317A Circuit arrangement method for flat computer
07/04/2012CN102548254A Nuclear-free preparation method of chip carrier
07/04/2012CN102548210A Embedded capacitor substrate module
07/04/2012CN102548191A Circuit board and manufacturing method thereof
07/04/2012CN102544666A Broadband non-coplanar feedthrough
07/04/2012CN102544253A Method for manufacturing light emitting device, light emitting device, light emitting element substrate, and quality management method
07/04/2012CN102544112A Transient voltage suppression diode
07/04/2012CN102544034A Solid-state imaging device, semiconductor device, manufacturing methods thereof, and electronic apparatus
07/04/2012CN102544007A Integrated circuit including field effect transistor
07/04/2012CN102543973A 芯片封装结构 Chip package structure
07/04/2012CN102543971A Chip package and method for forming the same
07/04/2012CN102543970A Semiconductor packaging component and manufacturing method thereof
07/04/2012CN102543969A Wafer level molding structure and manufacturing method thereof
07/04/2012CN102543968A Three dimensional stacked chip package structure
07/04/2012CN102543967A Package and method for manufacturing same
07/04/2012CN102543966A Power package module
07/04/2012CN102543965A Radio-frequency packaging with reduced RF loss
07/04/2012CN102543964A Capacitor and forming method thereof, and semiconductor memory device and manufacture method thereof
07/04/2012CN102543963A Electronic static discharge (ESD) detection clamping circuit based on multi-stage current mirrors
07/04/2012CN102543962A Method for manufacturing metallic shielding plate
07/04/2012CN102543961A Package for preventing electrostatic damage and electromagnetic wave interference and preparation method for package
07/04/2012CN102543960A Integrated circuit for testing
07/04/2012CN102543959A Semiconductor apparatus and test method thereof
07/04/2012CN102543958A De-embedding on-wafer devices
07/04/2012CN102543957A Test structure and test method of silicon on insulator (SOI) body contact metal oxide semiconductor (MOS) transistor
07/04/2012CN102543956A Multilayer overlay mark
07/04/2012CN102543955A Wafer-level negative bias temperature instability (NBTI) test structure
07/04/2012CN102543954A Overlay target
07/04/2012CN102543953A Composition for filling through silicon via (TSV), TSV filling method and substrate including TSV plug formed of the composition
07/04/2012CN102543952A Method and system for providing fusing after packaging of semiconductor devices
07/04/2012CN102543951A Stacked and tunable power fuse
07/04/2012CN102543950A Electrical fuse structure
07/04/2012CN102543949A Capacitor
07/04/2012CN102543948A Semiconductor structure and manufacturing method thereof
07/04/2012CN102543947A Semiconductor integrated circuit including metal mesh structure
07/04/2012CN102543946A Semiconductor device package and method of manufacturing thereof
07/04/2012CN102543945A RF shielding for a singulated laminate semiconductor device package
07/04/2012CN102543944A Semiconductor device and method for fabricating the same
07/04/2012CN102543943A Transformer with bypass capacitor and manufacturing method thereof
07/04/2012CN102543942A Integrated circuit dielectric layer structure containing stop layer
07/04/2012CN102543941A Semiconductor device, semiconductor memory device, and operating method thereof
07/04/2012CN102543940A Wafer-level packaging optimized structure
07/04/2012CN102543939A Laminated inverted chip packaging structure for superfine-pitch welding pads and manufacturing method thereof
07/04/2012CN102543938A Semiconductor package and method for selecting chip in semiconductor package
07/04/2012CN102543937A Flip chip on-chip package and manufacturing method thereof
07/04/2012CN102543936A Dual-interface smart card carrier tape without cavity
07/04/2012CN102543935A Printed circuit board for semiconductor package and semiconductor package having same
07/04/2012CN102543934A Semiconductor device and semiconductor package
07/04/2012CN102543933A Double-layer metal frame built-in inductance integrated circuit
07/04/2012CN102543932A Packaging structure of semiconductor device
07/04/2012CN102543931A Center-wiring double-circle-arrangement single-IC (integrated circuit) chip packaging piece and preparation method thereof
07/04/2012CN102543930A Electroforming wafer bump
07/04/2012CN102543929A QFP (Quad Flat Package) grounding welding plate
07/04/2012CN102543928A QFN (quad-flat no-lead) packaging structure
07/04/2012CN102543927A Packaging substrate having through-holed interposer embedded therein and fabrication method thereof
07/04/2012CN102543926A Semiconductor element, manufacturing method thereof and semiconductor packaging structure
07/04/2012CN102543925A Chip-scale three-dimensional flexible encapsulation structure based on sawtooth-shaped copper wire
07/04/2012CN102543924A Chip-scale three-dimensional flexible encapsulation structure based on S-shaped copper wire
07/04/2012CN102543923A Semiconductor device and method of manufacture thereof
07/04/2012CN102543922A Chip package and method for forming the same
07/04/2012CN102543921A Welding pad structure and manufacturing method thereof
07/04/2012CN102543920A Chip size packaging method and packaging structure
07/04/2012CN102543919A Clip interconnect with encapsulation material locking feature
07/04/2012CN102543918A 半导体芯片 Semiconductor chip
07/04/2012CN102543917A Cooling device of integrated circuit
07/04/2012CN102543916A Liquid-cooled radiating device
07/04/2012CN102543915A 冷却装置 Cooling device
07/04/2012CN102543914A Heat radiator
07/04/2012CN102543913A Wiring substrate, electronic device, and method of manufacturing wiring substrate
07/04/2012CN102543912A Radiator and manufacturing method thereof
07/04/2012CN102543911A 半导体装置 Semiconductor device
07/04/2012CN102543910A Chip packaging component and manufacturing method thereof
07/04/2012CN102543909A Sealing structure with irregular shape and manufacturing method therefor
1 ... 350 351 352 353 354 355 356 357 358 359 360 361 362 363 364 365 366 367 368 369 370 ... 2262