Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2014
12/31/2014CN102097393B 半导体装置 Semiconductor device
12/31/2014CN102074497B 半导体芯片和晶片堆叠封装件的制造方法 Semiconductor chips and chip stack manufacturing method of the package
12/31/2014CN102054839B 一种mos场效应晶体管结构及其制备方法 One kind of mos field effect transistor structure and its preparation method
12/31/2014CN102024779B 半导体器件中的图案结构及其形成方法 Pattern structure in a semiconductor device and method of forming
12/31/2014CN101996980B 功率半导体模块和用于装配功率半导体模块的方法 The power semiconductor module and a method for assembling a power semiconductor module
12/31/2014CN101989558B 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
12/31/2014CN101471416B Led封装中有纹理的密封剂表面 Led package sealant textured surface
12/30/2014US8924903 Semiconductor device having plural memory chip
12/30/2014US8923765 Establishing a wireless communications bus and applications thereof
12/30/2014US8923748 High frequency module and receiver
12/30/2014US8923070 FinFET based one-time programmable device
12/30/2014US8923042 Magnetic random access memory
12/30/2014US8923008 Circuit board and method for manufacturing circuit board
12/30/2014US8923005 Electrical component having an electrical connection arrangement and method for the manufacture thereof
12/30/2014US8923004 Microelectronic packages with small footprints and associated methods of manufacturing
12/30/2014US8922999 Heat dissipating assembly and elastic fastening member thereof
12/30/2014US8922991 Ruggedized computer assembly having internal fan
12/30/2014US8922791 Camera system with color display and processor for Reed-Solomon decoding
12/30/2014US8922774 Method of manufacturing device, and substrate
12/30/2014US8922756 Position measurement system, lithographic apparatus and device manufacturing method
12/30/2014US8922670 Portable hand-held device having stereoscopic image camera
12/30/2014US8922542 Chip-on-film package and display device having the same
12/30/2014US8922328 Electrical fuse structure
12/30/2014US8922099 Surface-mount piezoelectric device
12/30/2014US8922053 Semiconductor chip and semiconductor device including the same
12/30/2014US8922030 Moisture-tight semiconductor module and method for producing a moisture-tight semiconductor module
12/30/2014US8922029 Apparatus having a wiring board and memory devices
12/30/2014US8922028 Semiconductor package
12/30/2014US8922027 Electronic device having electrodes bonded with each other
12/30/2014US8922026 Chip package and fabrication method thereof
12/30/2014US8922025 Semiconductor device
12/30/2014US8922024 Semiconductor packages including molding layers
12/30/2014US8922023 Semiconductor device comprising metallization layers of reduced interlayer capacitance by reducing the amount of etch stop materials
12/30/2014US8922022 Electromigration resistant via-to-line interconnect
12/30/2014US8922021 Die up fully molded fan-out wafer level packaging
12/30/2014US8922020 Integrated circuit pattern and method
12/30/2014US8922019 Semiconductor device having a copper plug
12/30/2014US8922018 Semiconductor device and semiconductor device manufacturing method
12/30/2014US8922017 Semiconductor device
12/30/2014US8922016 Method for producing a composite material, associated composite material and associated semiconductor circuit arrangements
12/30/2014US8922015 Semiconductor device
12/30/2014US8922014 Wafer level semiconductor package
12/30/2014US8922013 Through via package
12/30/2014US8922012 Integrated circuit chip and flip chip package having the integrated circuit chip
12/30/2014US8922011 Mounting structure of electronic component with joining portions and method of manufacturing the same
12/30/2014US8922010 Semiconductor device
12/30/2014US8922009 Bump structures in semiconductor packages and methods of fabricating the same
12/30/2014US8922008 Bump structure, having concave lateral sides, semiconductor package having the bump structure, and method of forming the bump structure
12/30/2014US8922007 Semiconductor package
12/30/2014US8922006 Elongated bumps in integrated circuit devices
12/30/2014US8922005 Methods and apparatus for package on package devices with reversed stud bump through via interconnections
12/30/2014US8922004 Copper bump structures having sidewall protection layers
12/30/2014US8922003 Low OHMIC contacts
12/30/2014US8922002 Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices
12/30/2014US8922001 Semiconductor device
12/30/2014US8922000 Chip carriers, semiconductor devices including the same, semiconductor packages including the same, and methods of fabricating the same
12/30/2014US8921999 Semiconductor device, semiconductor device manufacturing method, semiconductor device mounting structure and power semiconductor device
12/30/2014US8921998 Semiconductor module
12/30/2014US8921997 Electrical component and method of manufacturing the same
12/30/2014US8921996 Power module substrate, power module, and method for manufacturing power module substrate
12/30/2014US8921995 Integrated circuit package including a three-dimensional fan-out/fan-in signal routing
12/30/2014US8921994 Thermally enhanced package with lid heat spreader
12/30/2014US8921993 Semiconductor package having EMI shielding function and heat dissipation function
12/30/2014US8921992 Stacked wafer with coolant channels
12/30/2014US8921991 Discrete three-dimensional memory
12/30/2014US8921989 Power electronics modules with solder layers having reduced thermal stress
12/30/2014US8921988 Galvanically-isolated device and method for fabricating the same
12/30/2014US8921987 Semiconductor device and measurement device having an oscillator
12/30/2014US8921986 Insulated bump bonding
12/30/2014US8921985 Semiconductor device and method for manufacturing the same
12/30/2014US8921984 Through silicon via in semiconductor device
12/30/2014US8921983 Semiconductor package and method of forming similar structure for top and bottom bonding pads
12/30/2014US8921982 Semiconductor device
12/30/2014US8921976 Using backside passive elements for multilevel 3D wafers alignment applications
12/30/2014US8921975 System and method for forming aluminum fuse for compatibility with copper BEOL interconnect scheme
12/30/2014US8921969 Chip-scale Schottky device
12/30/2014US8921967 Integrated circuit combination of a target integrated circuit and a plurality of photovoltaic cells connected thereto using the top conductive layer
12/30/2014US8921941 ESD protection device and method for fabricating the same
12/30/2014US8921708 Electronic-component mounted body, electronic component, and circuit board
12/30/2014US8921496 Curable composition
12/30/2014US8921495 High refractive index compositions containing resin-linear organosiloxane block copolymers
12/30/2014US8921494 Thermally stable compositions containing resin-linear organosiloxane block copolymers
12/30/2014US8921493 Process for preparing resin-linear organosiloxane block copolymers
12/30/2014US8921461 Epoxy resin composition and semiconductor device
12/30/2014US8921446 Photocurable material for sealing, sealing method, sealing material, and housing using said sealing material
12/30/2014US8921227 Semiconductor device assembly and semiconductor device and method of manufacturing the same
12/30/2014US8921225 Method for off-grid routing structures utilizing self aligned double patterning (SADP) technology
12/30/2014US8921224 Semiconductor device having through electrode and method for manufacturing the same
12/30/2014US8921223 Semiconductor device with damascene bit line and method for fabricating the same
12/30/2014US8921222 Pillar structure having a non-planar surface for semiconductor devices
12/30/2014US8921221 IMS (injection molded solder) with two resist layers forming solder bumps on substrates
12/30/2014US8921186 Semiconductor device and method of forming high voltage SOI lateral double diffused MOSFET with shallow trench insulator
12/30/2014US8921168 Thin integrated circuit chip-on-board assembly and method of making
12/30/2014US8921167 Modified via bottom for BEOL via efuse
12/30/2014US8921166 Structure and method for placement, sizing and shaping of dummy structures
12/30/2014US8921165 Elimination of silicon residues from MEMS cavity floor
12/30/2014US8921164 Semiconductor integrated device assembly process
12/30/2014US8921163 Semiconductor packages and methods of fabricating the same
12/30/2014US8921162 Method for manufacturing electronic component, and electronic apparatus
12/30/2014US8921161 Semiconductor device and method of forming EWLB package containing stacked semiconductor die electrically connected through conductive vias formed in encapsulant around die
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