Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
07/2012
07/05/2012US20120168956 Controlling density of particles within underfill surrounding solder bump contacts
07/05/2012US20120168955 Integrated Circuit Pattern and Method
07/05/2012US20120168954 Substrate bonding method and semiconductor device
07/05/2012US20120168953 Structure with self aligned resist layer on an interconnect surface and method of making same
07/05/2012US20120168952 Semiconductor device having a copper plug
07/05/2012US20120168951 Printed circuit board and semiconductor package comprising the same
07/05/2012US20120168950 Die structure, manufacturing method and substrate thereof
07/05/2012US20120168949 Semiconductor device with a line and method of fabrication thereof
07/05/2012US20120168948 Copper pillar full metal via electrical circuit structure
07/05/2012US20120168947 Methods and Designs for Localized Wafer Thinning
07/05/2012US20120168946 Semiconductor device and production method therefor
07/05/2012US20120168945 Chip package structure and chip packaging process
07/05/2012US20120168944 Through hole via filling using electroless plating
07/05/2012US20120168943 Plasma treatment on semiconductor wafers
07/05/2012US20120168942 Through hole via filling using electroless plating
07/05/2012US20120168941 Stackable electronic package and method of making same
07/05/2012US20120168940 Apparatus and method of applying a film to a semiconductor wafer and method of processing a semiconductor wafer
07/05/2012US20120168939 Chip package and method for forming the same
07/05/2012US20120168938 Plasma treatment on semiconductor wafers
07/05/2012US20120168937 Flip chip package and method of manufacturing the same
07/05/2012US20120168936 Multi-chip stack package structure and fabrication method thereof
07/05/2012US20120168935 Integrated circuit device and method for preparing the same
07/05/2012US20120168934 Flip chip device having simplified routing
07/05/2012US20120168933 Wafer level molding structure
07/05/2012US20120168932 Semiconductor assembly that includes a power semiconductor die located on a cell defined by first and second patterned polymer layers
07/05/2012US20120168931 Carbon nanotube structures for enhancement of thermal dissipation from semiconductor modules
07/05/2012US20120168930 Semiconductor device
07/05/2012US20120168929 Low cost thermally enhanced hybrid bga and method of manufacturing the same
07/05/2012US20120168928 Chip assembly with frequency extending device
07/05/2012US20120168927 Semiconductor device
07/05/2012US20120168926 High Power Semiconductor Package with Conductive Clip and Flip Chip Driver IC with Integrated Control Transistor
07/05/2012US20120168925 High Power Semiconductor Package with Conductive Clips and Flip Chip Driver IC
07/05/2012US20120168924 High Power Semiconductor Package with Multiple Conductive Clips
07/05/2012US20120168923 High Power Semiconductor Package with Conductive Clip on Multiple Transistors
07/05/2012US20120168922 High Power Semiconductor Package with Conductive Clip
07/05/2012US20120168921 Leadless semiconductor package with routable leads, and method of manufacture
07/05/2012US20120168920 Leadless semiconductor package and method of manufacture
07/05/2012US20120168919 Semiconductor package and method of fabricating the same
07/05/2012US20120168918 Semiconductor packages
07/05/2012US20120168917 Stack type semiconductor package and method of fabricating the same
07/05/2012US20120168916 Semiconductor Device and Method of Forming Open Cavity in TSV Interposer to Contain Semiconductor Die in WLCSMP
07/05/2012US20120168906 ESD Protection Device with Tunable Design Windows
07/05/2012US20120168901 Semiconductor electronic device with an integrated device with an integrated galvanic isolator element and related assembly process
07/05/2012US20120168900 Latch-up free vertical tvs diode array structure using trench isolation
07/05/2012US20120168897 Methods of forming semiconductor trench and forming dual trenches, and structure for isolating devices
07/05/2012US20120168835 Anti-reflection structures for cmos image sensors
07/05/2012US20120168814 Adhesive composition
07/05/2012US20120168800 Lead frame for optical semiconductor device, method of producing the same, and optical semiconductor device
07/05/2012US20120168752 Testkey structure, chip packaging structure, and method for fabricating the same
07/05/2012US20120168751 Integrated Circuit Test Units with Integrated Physical and Electrical Test Regions
07/05/2012DE112010003191T5 Leistungsmodul Power module
07/05/2012DE112006001844B4 Verfahren zum Herstellen einer Elektronikkomponente und Elektronikkomponente A method of manufacturing an electronic component and electronic component
07/05/2012DE102011089684A1 Semiconductor device of display driver circuit for display apparatus, has N-type guard-ring region which is positioned between well regions to be separated by predetermined distance from well regions
07/05/2012DE102011083927A1 Leistungsmodul und Verfahren zur Herstellung desselben Power module and method of manufacturing the same
07/05/2012DE102011057116A1 Transparentes Harz für ein Einkapselungsmaterial und Einkapselungsmaterial und elektronisches Bauelement, das dieses aufweist A transparent resin for an encapsulant and encapsulating material and electronic component that has this
07/05/2012DE102011055013A1 Halbleitergehäuse und Verfahren zum Herstellen derselben Semiconductor package and method for manufacturing the same
07/05/2012DE102011002458A1 Elektronische Baugruppe mit verbessertem Thermo-Management Electronic assembly with improved thermal management
07/05/2012DE102011000926A1 Integrierte Schaltkreis-Anordnung und Verfahren zum Anfertigen derselben Integrated circuit arrangement and method for making same
07/05/2012DE102005034386B4 Tiefe Justiermarken auf Rand-Chips zum anschließenden Ausrichten von opaken Schichten Depth marks on edge chips for subsequent alignment of opaque layers
07/05/2012DE10131225B4 Kontaktelement von zur Oberflächenmontage geeigneten Bauteilen sowie Verfahren zum Anbringen von Lot an diese Kontaktelemente Contact element suitable for surface mounting components as well as method of applying solder to these contact elements
07/04/2012EP2472577A2 Substrate for electronic device and electronic device
07/04/2012EP2472574A2 Method for manufacturing a press-fit diode and press-fit diode
07/04/2012EP2472352A2 Cooling apparatus and electronic apparatus
07/04/2012EP2471351A1 A microwave unit and method therefore
07/04/2012EP2471180A2 Die location compensation
07/04/2012EP2471097A1 Controlling integrated circuits including remote activation or deactivation
07/04/2012EP2471096A1 A routing layer for mitigating stress in a semiconductor die
07/04/2012EP2471095A2 Architecture for gas cooled parallel microchannel array cooler
07/04/2012EP2471094A1 Semiconductor wafer-to-wafer bonding for dissimilar semiconductor dies and/or wafers
07/04/2012EP2471090A2 Scratch-resistant coatings for protecting front-side circuitry during backside processing
07/04/2012EP2038920B1 Method for packaging components
07/04/2012EP1818979B1 Electronic component and fabrication method thereof
07/04/2012CN202310388U 一种可控硅散热结构及电器产品 One kind SCR dissipation structure and electrical products
07/04/2012CN202310270U 用于确保散热垫被粘附好的基板 Cooling pad is used to ensure a good substrate adhesion
07/04/2012CN202309705U 通用微功率无线通信模块 GM micro-power wireless communication module
07/04/2012CN202307904U Improved structure of diode
07/04/2012CN202307901U 一种带引线框架的三极管 A transistor with a lead frame
07/04/2012CN202307881U 一种电子设备 An electronic device
07/04/2012CN202307880U 一种新型驱动芯片 A new driver chip
07/04/2012CN202307879U 一种SiP模块的结构 Structure for SiP modules
07/04/2012CN202307878U 片型电路保护器件 Chip-type circuit protection devices
07/04/2012CN202307877U 布线结构 Wiring structure
07/04/2012CN202307876U 一种mim电容 One kind of mim capacitor
07/04/2012CN202307875U 一种新型引线框结构 A new leadframe structure
07/04/2012CN202307874U 改进的hsip引线框架 Improved hsip leadframe
07/04/2012CN202307873U 薄框架三极管 Thin frame triode
07/04/2012CN202307872U 方形扁平无引脚封装结构 Quad flat no-lead package structure
07/04/2012CN202307871U 封装的圆柱形功率半导体器件和压力接触装置 Cylindrical power semiconductor device package and a pressure contact means
07/04/2012CN202307870U 一种散热器 Radiator
07/04/2012CN202307869U 一种中频电源的igbt模块散热器结构 Igbt module heat sink structure for a frequency power supply
07/04/2012CN202307868U 一种电子器件散热装置 An electronic device cooling apparatus
07/04/2012CN202307867U 一种用于大功率igbt并联的风冷散热模组 A high-power air-cooled cooling modules in parallel igbt
07/04/2012CN202307866U 一种热导管折弯的散热装置 A heat pipe heat sink bending
07/04/2012CN202307865U 电子发热源的散热改良装置 Improved cooling apparatus for electronic heat source
07/04/2012CN202307864U 均温板结构 Average temperature board structure
07/04/2012CN202307863U 一种用于mos管类直立型电子元件的散热器 A mos tube type heat sink upright electronic components for the
07/04/2012CN202307862U 电子元件及其散热系统 Electronic components and cooling system
07/04/2012CN202307861U 散热单元的固定结构 Fixed structure of the heat dissipating unit
07/04/2012CN202307860U 三极管散热板 Transistor radiating plate
07/04/2012CN202307859U 一种晶体管的散热器 Radiator A transistor's
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