Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
07/2012
07/11/2012CN101465211B Lead frame and electronic component with the same and manufacturing method thereof
07/11/2012CN101452905B Self-alignment contact hole interlayer film, manufacturing method, and contact hole etching method
07/11/2012CN101425502B Fuse breakdown method adapted to semiconductor device
07/11/2012CN101414507B Magnetic and dielectric composite electronic device
07/11/2012CN101388391B Semiconductor device
07/11/2012CN101388366B High performance semiconductor module with connected substrate carrier and corresponding production method
07/11/2012CN101373767B Semiconductor device
07/11/2012CN101276638B Semiconductor memory device using ferroelectric device and method for refresh thereof
07/11/2012CN101267003B Thin film transistor, display device using thereof and method of manufacturing the thin film transistor and the display device
07/11/2012CN101241921B Optical device and method for manufacturing optical device, and camera module and endoscope module
07/11/2012CN101241910B Semiconductor device, substrate, equipment board, method for producing semiconductor device, and semiconductor chip
07/11/2012CN101221933B Electronic device with a base plate
07/11/2012CN101102656B Closed loop automatic compensation heat dispersion method and device
07/11/2012CN101030561B Semiconductor device and method of fabricating the same
07/10/2012US8219351 Methods and systems to align wafer signatures
07/10/2012US8219140 Battery-operated wireless-communication apparatus and method
07/10/2012US8218331 Electronic component module
07/10/2012US8218320 Heat sinks with C-shaped manifolds and millichannel cooling
07/10/2012US8217522 Printed circuit board with coextensive electrical connectors and contact pad areas
07/10/2012US8217521 Hardwired switch of die stack and operating method of hardwired switch
07/10/2012US8217520 System-in-package packaging for minimizing bond wire contamination and yield loss
07/10/2012US8217519 Electrical connection for multichip modules
07/10/2012US8217518 Enhancing metal/low-K interconnect reliability using a protection layer
07/10/2012US8217517 Semiconductor device provided with wire that electrically connects printed wiring board and semiconductor chip each other
07/10/2012US8217516 Semiconductor device and method of manufacturing the same
07/10/2012US8217515 Semiconductor mounting substrate and method for manufacturing the same
07/10/2012US8217514 Integrated circuit packaging system with warpage control system and method of manufacture thereof
07/10/2012US8217513 Remote plasma processing of interface surfaces
07/10/2012US8217512 Thermal interface device
07/10/2012US8217511 Redistributed chip packaging with thermal contact to device backside
07/10/2012US8217510 Semiconductor module system having stacked components with encapsulated through wire interconnects (TWI)
07/10/2012US8217509 Semiconductor device
07/10/2012US8217508 Method of packaging integrated circuit devices using preformed carrier
07/10/2012US8217506 Semiconductor packaging structure having conductive gel to package semiconductor device
07/10/2012US8217505 Packaged IC device comprising an embedded flex circuit on leadframe, and methods of making same
07/10/2012US8217504 Article and panel comprising semiconductor chips, casting mold and methods of producing the same
07/10/2012US8217503 Package structure for DC-DC converter
07/10/2012US8217502 Integrated circuit packaging system with multipart conductive pillars and method of manufacture thereof
07/10/2012US8217501 Integrated circuit package system including honeycomb molding
07/10/2012US8217500 Semiconductor device package
07/10/2012US8217499 Structure to reduce etching residue
07/10/2012US8217484 Image sensor and method of fabricating the same
07/10/2012US8217462 Transient voltage suppressors
07/10/2012US8217461 ESD protection circuit
07/10/2012US8217460 Semiconductor device with electrostatic protection device
07/10/2012US8217458 Non-aligned antenna effect protection circuit with single event transient hardness
07/10/2012US8217457 Electrostatic discharge (ESD) protection device for use with multiple I/O standards
07/10/2012US8217449 Semiconductor device and method for forming the same
07/10/2012US8217434 Semiconductor package having through-electrodes which are electrically connected with internal circuit patterns formed in a semiconductor chip and method for manufacturing the same
07/10/2012US8217433 One-transistor pixel array
07/10/2012US8217409 Surface-textured encapsulations for use with light emitting diodes
07/10/2012US8217394 Probe pad on a corner stress relief region in a semiconductor chip
07/10/2012US8217393 Test device, SRAM test device, semiconductor integrated circuit device and methods of fabricating the same
07/10/2012US8217304 Methods and systems for thermal-based laser processing a multi-material device
07/10/2012US8217281 Package, method of manufacturing a package and frame
07/10/2012US8217274 Wiring member, method of manufacturing the wiring member and electronic element
07/10/2012US8216940 Method for manufacturing a semiconductor device
07/10/2012US8216934 Semiconductor device suitable for a stacked structure
07/10/2012US8216884 Production methods of electronic devices
07/10/2012US8216672 Structured resin systems with high thermal conductivity fillers
07/10/2012US8215830 Apparatus and method for measuring local surface temperature of semiconductor device
07/10/2012CA2616621C Dual function composite system and method of making same
07/10/2012CA2404804C Process for improving the adhesion propreties of a non-oxide ceramic substrate to be glued in place
07/06/2012DE202012004064U1 Befestigungsstruktur für Kühlmodul Mounting structure for cooling module
07/05/2012WO2012091873A1 Heat dissipation device and method
07/05/2012WO2012091780A1 Semiconductor device with stacked power converter
07/05/2012WO2012091733A1 Ultra ruggedized ball grid array electronic components
07/05/2012WO2012091697A1 Package with a cmos die positioned underneath a mems die
07/05/2012WO2012091140A1 Interposer and semiconductor module using same
07/05/2012WO2012091044A1 Semiconductor device/electronic component mounting structure
07/05/2012WO2012091000A1 Curable epoxy resin composition
07/05/2012WO2012090980A1 Curable resin composition, cured product, surface-processed cured product, and laminate
07/05/2012WO2012090965A1 Photosensitive phenol resin composition for alkaline development, cured relief pattern, method for producing semiconductor, and biphenyl-diyl-trihydroxybenzene resin
07/05/2012WO2012090740A1 Circuit board for semiconductor module
07/05/2012WO2012090576A1 Light-emitting apparatus and method of manufacturing thereof
07/05/2012WO2012090402A1 Multilayer wiring board and method for manufacturing multilayer wiring board
07/05/2012WO2012090292A1 Semiconductor device production method
07/05/2012WO2012090157A1 Cooling device for electronic components and control apparatus comprising the cooling device
07/05/2012WO2012089980A1 Insulated via hole
07/05/2012WO2012089408A1 Encapsulation of an mems component and method for producing said component
07/05/2012WO2012089314A2 A method for fabricating a semiconductor device
07/05/2012WO2012088676A1 66kv light-controlled water-cooled thyristor valve bank
07/05/2012WO2012040682A3 Die-stacking using through-silicon vias on bumpless build-up layer substrates including embedded-dice, and processes of forming same
07/05/2012WO2012012323A3 Stackable molded microelectronic packages
07/05/2012US20120171844 Dicing die bonding film, semiconductor wafer, and semiconductor device
07/05/2012US20120170216 Synthetic jet packaging
07/05/2012US20120168970 Spacer formation film, method of manufacturing semiconductor wafer bonding product, semiconductor wafer bonding product and semiconductor device
07/05/2012US20120168969 Epoxy resin composition for encapsulating semiconductor device and semiconductor device encapsulated with an encapsulant prepared from the composition
07/05/2012US20120168968 Epoxy resin composition for encapsulating a semiconductor device, method of encapsulating a semiconductor device, and semiconductor device
07/05/2012US20120168967 Three dimensional stacked chip package structure
07/05/2012US20120168966 Stacked-chip device
07/05/2012US20120168965 Semiconductor device and a method of manufacturing the same
07/05/2012US20120168964 Probe Card and Method of Testing a Semiconductor Device
07/05/2012US20120168963 Semiconductor Device and Method of Forming Three-Dimensional Vertically Oriented Integrated Capacitors
07/05/2012US20120168962 Thin wafer protection device
07/05/2012US20120168961 Semiconductor device
07/05/2012US20120168960 Multi chip package
07/05/2012US20120168959 Package substrate having a through hole and method of fabricating the same
07/05/2012US20120168958 Method and system for forming dummy structures in accordance with the golden ratio
07/05/2012US20120168957 Method to reduce depth delta between dense and wide features in dual damascene structures
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