| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 07/11/2012 | CN102569268A Semiconductor device and method for manufacturing same |
| 07/11/2012 | CN102569267A Integrated circuit, signal transmission method, and method for manufacturing such integrated circuit |
| 07/11/2012 | CN102569266A Polysilicon controlled rectifier and fabricating method thereof |
| 07/11/2012 | CN102569265A Mask plate static electricity resisting ring |
| 07/11/2012 | CN102569264A Integrated circuits and fabrication methods thereof |
| 07/11/2012 | CN102569263A Adhesive film for semiconductor device, and semiconductor device |
| 07/11/2012 | CN102569262A Test structure and test method of nano-wire enclosure device heat radiation properties |
| 07/11/2012 | CN102569261A Structure and method for testing heat radiating characteristic of nanoscale device |
| 07/11/2012 | CN102569260A Integrated circuit for detecting defects of through chip via |
| 07/11/2012 | CN102569259A Test circuit and test method for testing chip before package |
| 07/11/2012 | CN102569258A Sample structure and measuring method for CDSEM (critical dimension scanning electronic microscope) |
| 07/11/2012 | CN102569257A Line width test structure |
| 07/11/2012 | CN102569256A Resin sealed semiconductor device and manufacturing method therefor |
| 07/11/2012 | CN102569255A Integrated circuit having a three dimensional stack package structure |
| 07/11/2012 | CN102569254A Semiconductor structure and production method thereof |
| 07/11/2012 | CN102569253A Semiconductor apparatus |
| 07/11/2012 | CN102569252A Mixed integrated inductor suitable for direct-current voltage changer and wireless communication transceiver |
| 07/11/2012 | CN102569251A Intermetallic compound filled vertical through-hole interconnecting structure for three-dimensional package and preparation method thereof |
| 07/11/2012 | CN102569250A High-density capacitor and electrode leading-out method thereof |
| 07/11/2012 | CN102569249A A three dimensional inductor |
| 07/11/2012 | CN102569248A Semiconductor device with buried gate and method for fabricating the same |
| 07/11/2012 | CN102569247A Integrated module, integrated system board and electronic equipment |
| 07/11/2012 | CN102569246A Element carrier and light receiving module |
| 07/11/2012 | CN102569245A A printed circuit board (pcb) assembly |
| 07/11/2012 | CN102569244A Semiconductor package with reinforced plate and manufacturing method of semiconductor package |
| 07/11/2012 | CN102569243A Integrated circuit lead frame |
| 07/11/2012 | CN102569242A Semiconductor packaging part of integrated screened film and manufacture method thereof |
| 07/11/2012 | CN102569241A Multi-chip module (MCM) power quad flat no-lead (PQFN) semiconductor package utilizing a leadframe for electrical interconnections |
| 07/11/2012 | CN102569240A Double-row pad layout structure |
| 07/11/2012 | CN102569239A Bonding structure of semiconductor package, method for fabricating the same, and stack-type semiconductor package |
| 07/11/2012 | CN102569238A Semiconductor device and method for manufacturing same |
| 07/11/2012 | CN102569237A Semiconductor chip package and assembly method thereof |
| 07/11/2012 | CN102569236A Substrate for package and method for manufacturing the same |
| 07/11/2012 | CN102569235A 半导体装置及其组装方法 Semiconductor device and method of assembly |
| 07/11/2012 | CN102569234A Ball grid array encapsulating structure and encapsulation method |
| 07/11/2012 | CN102569233A Packaging structure |
| 07/11/2012 | CN102569232A Wafer-level chip size package stress buffering structure |
| 07/11/2012 | CN102569231A Chip-grade three-dimensional flexible packaging structure based on curled copper wiring |
| 07/11/2012 | CN102569230A Semiconductor device and electronic device |
| 07/11/2012 | CN102569229A 半导体装置 Semiconductor device |
| 07/11/2012 | CN102569228A Integrated circuit device and method for preparing the same |
| 07/11/2012 | CN102569227A Integrated circuit radiating system and manufacturing method thereof |
| 07/11/2012 | CN102569226A Conveniently fixed high-heat-radiation coating material and manufacturing method thereof |
| 07/11/2012 | CN102569225A Heat conduction device and manufacturing method thereof |
| 07/11/2012 | CN102569224A Circuit carrier with high heat dissipation performance and related circuit modules |
| 07/11/2012 | CN102569223A Power device insulation heat radiation structure, circuit board and power supply device |
| 07/11/2012 | CN102569222A Cooling device and power conversion device including the same |
| 07/11/2012 | CN102569221A Electronic control unit |
| 07/11/2012 | CN102569220A Folding high-heat-radiation body |
| 07/11/2012 | CN102569219A Radiator |
| 07/11/2012 | CN102569218A Radiator |
| 07/11/2012 | CN102569217A 半导体封装件 The semiconductor package |
| 07/11/2012 | CN102569216A Power device package structure |
| 07/11/2012 | CN102569215A Device and method for manufacturing a device |
| 07/11/2012 | CN102569214A Three-dimensional system-in-package package-on-package structure |
| 07/11/2012 | CN102569213A DBC board insulation structure |
| 07/11/2012 | CN102569212A Wiring board |
| 07/11/2012 | CN102569211A Method for controlling thickness of welding layer of transistor and welding layer structure |
| 07/11/2012 | CN102569210A Semiconductor device packaging method and semiconductor device package |
| 07/11/2012 | CN102569209A Anti-cracking structure |
| 07/11/2012 | CN102569208A Semiconductor packages and methods of fabricating the same |
| 07/11/2012 | CN102569194A Protecting T-contacts of chip scale packages from moisture |
| 07/11/2012 | CN102569187A Low-temperature polysilicon display device and manufacturing method thereof |
| 07/11/2012 | CN102569174A Integrated circuit system with ultra-low K dielectric and method of manufacture thereof |
| 07/11/2012 | CN102569171A Wiring structure for improving crown-like defect and fabrication method thereof |
| 07/11/2012 | CN102569102A Hermetic package method and structure of transistor base and transistor pin |
| 07/11/2012 | CN102569101A Non-leaded package structure and manufacturing method thereof |
| 07/11/2012 | CN102569100A Method for producing heat dissipation mass of semiconductor device |
| 07/11/2012 | CN102569098A Semiconductor packaging piece and semiconductor packaging method |
| 07/11/2012 | CN102569097A Semiconductor device and method of forming openings through insulating layer over encapsulant for enhanced adhesion of interconnect structure |
| 07/11/2012 | CN102569096A Integrated circuit packaging system with Pad connection and method of manufacture thereof |
| 07/11/2012 | CN102569095A Method for preparing LTCC (low-temperature co-fired ceramic) substrate with channels |
| 07/11/2012 | CN102569032A Method for manufacturing inductance element by overlapping multiple layers of metalized thin films |
| 07/11/2012 | CN102569012A Method for preventing wafer active area from being scratched |
| 07/11/2012 | CN102566339A Global alignment mark and global alignment method |
| 07/11/2012 | CN102566275A Positive photosensitive resin composition, photosensitive resin film prepared by using the same, and semiconductor device including the photosensitive resin film |
| 07/11/2012 | CN102566274A Positive photosensitive resin composition, photosensitive resin film prepared by using the same, and semiconductor device including the photosensitive resin film |
| 07/11/2012 | CN102559115A Chip-level bottom filling adhesive and preparation method thereof |
| 07/11/2012 | CN102559085A Film for the backside of flip-chip type semiconductor, dicing tape-integrated film for the backside of semiconductor, method of manufacturing film for the backside of flip-chip type semiconductor, and semiconductor device |
| 07/11/2012 | CN102559072A Adhesive composition, film-like adhesive, and connection structure for circuit member |
| 07/11/2012 | CN102559071A Adhesive composition, film-like adhesive, and connection structure for circuit member |
| 07/11/2012 | CN102558958A Radiation curable ink jet composition, recorded matter, and ink jet recording method |
| 07/11/2012 | CN102558769A Epoxy resin composition for encapsulating semiconductor device and semiconductor device encapsulated with an encapsulant prepared from the composition |
| 07/11/2012 | CN102136468B Thyristor valve section and crimping method thereof |
| 07/11/2012 | CN102129977B High-resistance resistor and method for realizing same |
| 07/11/2012 | CN102104010B Module structural member capable of improving isolation voltage VISO and reducing crusting thermal resistance Rthjc |
| 07/11/2012 | CN102024787B Polysilicon wire, semiconductor device and memory circuit |
| 07/11/2012 | CN101952960B Method for low-temperature pressure sintering |
| 07/11/2012 | CN101924095B Interconnection structure of semiconductor integrated circuit and method for making the same |
| 07/11/2012 | CN101911294B Semiconductor device |
| 07/11/2012 | CN101887915B Power mosfet package |
| 07/11/2012 | CN101826517B Light emitting device |
| 07/11/2012 | CN101742872B Radiation module and electronic device using same |
| 07/11/2012 | CN101692329B Impedance value detection method for display and display carrying structure |
| 07/11/2012 | CN101568226B Multi-layer flexible printed circuit board and method of manufacturing the same |
| 07/11/2012 | CN101553917B Method of manufacturing stacked chip packages |
| 07/11/2012 | CN101551962B Full-color LED display device |
| 07/11/2012 | CN101546741B Contact element, power semiconductor module and circuit apparatus comprising the module |
| 07/11/2012 | CN101523605B Bare microelectronic chip provided with a recess forming a housing for a wire element constituting a flexible mechanical support, fabrication process and microstructure |
| 07/11/2012 | CN101471327B Copper wire, method for fabricating the same, and thin film transistor substrate with the same |