| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 07/11/2012 | EP2475006A1 Semiconductor light emitting device, method of manufacturing the same, and lighting apparatus and display apparatus using the same |
| 07/11/2012 | EP2475005A2 Vertical mount transient voltage suppressor array |
| 07/11/2012 | EP2475004A2 Semiconductor package with reduced on-resistance and top metal spreading resistance with application to power transistor packaging |
| 07/11/2012 | EP2474383A1 Lead-free solder alloy, joining member and manufacturing method thereof, and electronic component |
| 07/11/2012 | EP2474033A1 Radiation imaging apparatus |
| 07/11/2012 | EP2474030A1 Using interrupted through-silicon-vias in integrated circuits adapted for stacking |
| 07/11/2012 | EP1801871B1 Semiconductor device |
| 07/11/2012 | EP1667508B1 Ceramic circuit board, method for making the same, and power module |
| 07/11/2012 | EP1451869B1 Semiconductor device and method of enveloping an integrated circuit |
| 07/11/2012 | DE202007019433U1 Licht emittierende Vorrichtung mit vertikaler Struktur, und Baugruppe hiervon Light emitting device having a vertical structure, and assembly thereof |
| 07/11/2012 | CN202335182U 一种固体继电器 A solid-state relay |
| 07/11/2012 | CN202334419U 电动汽车用低压大功率无刷直流电机控制器 Low-power electric vehicles with brushless DC motor controller |
| 07/11/2012 | CN202334393U 一种应用于电动机软起动器的晶闸管组单元串并联结构件 Applied to soft starter motor thyristor group unit of series and parallel structures |
| 07/11/2012 | CN202332864U 一种整流半导体器件 One kind of rectifying semiconductor devices |
| 07/11/2012 | CN202332852U 一种手机摄像模组cob封装结构 One kind of mobile phone camera module package cob |
| 07/11/2012 | CN202332847U 电动汽车用电机控制器的mosfet功率驱动部分的结构 Electric vehicle motor controller driver mosfet power moieties |
| 07/11/2012 | CN202332843U 矮本体整流桥堆 Low body bridge rectifier |
| 07/11/2012 | CN202332842U 灌封单相扁形整流桥堆 Potting flat single phase bridge rectifier |
| 07/11/2012 | CN202332841U 三相整流桥堆 Three-phase bridge rectifier |
| 07/11/2012 | CN202332840U Single-phase rectification bridge stack |
| 07/11/2012 | CN202332839U 一种硅通孔结构 A silicone via structures |
| 07/11/2012 | CN202332838U 硅通孔结构 Silicon via structures |
| 07/11/2012 | CN202332837U 倒装阵列led芯片 Flip-chip arrays led |
| 07/11/2012 | CN202332836U 一种多重定位的集成电路引线框架版 A multi-positioning of IC lead frame version |
| 07/11/2012 | CN202332835U 引线框架 Leadframe |
| 07/11/2012 | CN202332834U Packaging lead frame for power integrated circuit and packaged unit |
| 07/11/2012 | CN202332833U 三角跳线 Triangle Jumper |
| 07/11/2012 | CN202332832U 一种电子制冷片的散热装置 An electronic chip cooling refrigeration equipment |
| 07/11/2012 | CN202332831U 一种大功率mosfet的独立散热装置 Independent cooling apparatus of power mosfet |
| 07/11/2012 | CN202332830U 一种散热片与芯片固定结构 A heat sink and chip fixed structure |
| 07/11/2012 | CN202332829U Fixing device of IGBT (Insulated Gate Bipolar Transistor) |
| 07/11/2012 | CN202332828U 散热板 Cooling plate |
| 07/11/2012 | CN202332827U 一种驱动器散热装置 A driver heatsink |
| 07/11/2012 | CN202332826U 一种双重热交换散热装置 A dual heat exchange cooling devices |
| 07/11/2012 | CN202332825U 一种散热装置 A heat sink device |
| 07/11/2012 | CN202332824U 可控硅水电一体散热器 Hydro One SCR radiator |
| 07/11/2012 | CN202332823U 一种改进的太阳能光伏接线盒 An improved solar PV junction box |
| 07/11/2012 | CN202332822U 一种sot23晶体管 One kind of transistor sot23 |
| 07/11/2012 | CN202332821U 整流桥堆的封装体 Package of bridge rectifier |
| 07/11/2012 | CN202332820U 一种rfid封装结构 One kind rfid package |
| 07/11/2012 | CN202332819U Diode copper conductor |
| 07/11/2012 | CN202332818U 耐高压钝化保护二极管芯片 High voltage protection diode chip passivation |
| 07/11/2012 | CN202332817U 可降低外延时自掺杂的外延片衬底、外延片及半导体器件 Can reduce the self-doped epitaxial wafer substrates, epitaxial wafers and semiconductor devices |
| 07/11/2012 | CN202332797U 半导体装置 Semiconductor device |
| 07/11/2012 | CN202329316U 一种隐式环路环形热管散热器 An implicit loop heat pipe radiator ring |
| 07/11/2012 | CN202329315U 低压环路式热虹吸散热装置 Low thermal siphon loop cooling system |
| 07/11/2012 | CN1988764B Method of making an electronic device cooling system |
| 07/11/2012 | CN1988141B Lead terminal leadout type electronic component, manufacturing method therefor and electronic equipment |
| 07/11/2012 | CN1971913B 半导体装置 Semiconductor device |
| 07/11/2012 | CN102577654A Heat conveying structure for electronic device |
| 07/11/2012 | CN102577643A Module with built-in electronic component |
| 07/11/2012 | CN102576789A Wafer level packaging of electronic devices |
| 07/11/2012 | CN102576756A Solar cell module and method of manufacturing the same |
| 07/11/2012 | CN102576740A Surge protection device |
| 07/11/2012 | CN102576723A Semiconductor device and process for production thereof |
| 07/11/2012 | CN102576712A Resin composition, semiconductor wafer-bonded body, and semiconductor device |
| 07/11/2012 | CN102576705A Circuit arrangement and manufacturing method thereof |
| 07/11/2012 | CN102576704A Semiconductor device |
| 07/11/2012 | CN102576703A Variable capacitance integrated electronic circuit module |
| 07/11/2012 | CN102576702A Module package with embedded substrate and leadframe |
| 07/11/2012 | CN102576701A IC package and method for manufacturing the same |
| 07/11/2012 | CN102576700A Using interrupted through-silicon-vias in integrated circuits adapted for stacking |
| 07/11/2012 | CN102576699A Semiconductor device including a stress buffer material formed above a low-k metallization system |
| 07/11/2012 | CN102576698A Leadframe packages having enhanced ground-bond reliability |
| 07/11/2012 | CN102576697A Substrate for power module, substrate with heat sink for power module, power module, method for producing substrate for power module, and method for producing substrate with heat sink for power module |
| 07/11/2012 | CN102576696A Semiconductor device |
| 07/11/2012 | CN102576695A Assemblies and methods for directly connecting integrated circuits to electrically conductive sheets |
| 07/11/2012 | CN102576694A Semiconductor device and method for manufacturing semiconductor device |
| 07/11/2012 | CN102576693A Substrate for mounting semiconductor chip and method for producing same |
| 07/11/2012 | CN102576685A Bond and probe pad distribution and package architecture |
| 07/11/2012 | CN102576683A Semiconductor chip with stair arrangement bump structures |
| 07/11/2012 | CN102576682A Semiconductor device manufacturing method |
| 07/11/2012 | CN102576675A Wiring layer, semiconductor device, and liquid crystal display device using semiconductor device |
| 07/11/2012 | CN102576657A Three dimensional inductor and transformer |
| 07/11/2012 | CN102576507A Active matrix substrate, method for manufacturing same, and image display device |
| 07/11/2012 | CN102575137A Adhesive resin composition for silicon wafers |
| 07/11/2012 | CN102575085A Epoxy resin composition for semiconductor encapsulation, semiconductor device, and release agent |
| 07/11/2012 | CN102574987A Solvent-free and one-pack type cyanic ester/epoxy composite resin composition |
| 07/11/2012 | CN102574983A Curable resin composition and cured products thereof |
| 07/11/2012 | CN102574361A Laminate and manufacturing method for same |
| 07/11/2012 | CN102573415A Heat spreader for emissive display device |
| 07/11/2012 | CN102573410A Fixing structure for heat source element and heat conducting member, and method of fixing heat source element and heat conducting member |
| 07/11/2012 | CN102573408A Cooling apparatus and electronic apparatus |
| 07/11/2012 | CN102573398A Radiating device and air guiding cover thereof |
| 07/11/2012 | CN102573387A Wind guide cover and electronic device using same |
| 07/11/2012 | CN102573386A Cooling module and manufacturing method thereof |
| 07/11/2012 | CN102573289A Laminated printed circuit board module with conductive contact piece on side and manufacturing method thereof |
| 07/11/2012 | CN102570928A Motor soft starter |
| 07/11/2012 | CN102569413A Thin film transistor and manufacturing method thereof |
| 07/11/2012 | CN102569401A 半导体装置及半导体包装 Semiconductor device and semiconductor packaging |
| 07/11/2012 | CN102569306A Electromechanical transducer and method of manufacturing the same |
| 07/11/2012 | CN102569289A Structure and method for eliminating process antenna effect |
| 07/11/2012 | CN102569286A 3D power module package |
| 07/11/2012 | CN102569276A Insulated gate bipolar transistor (IGBT) module |
| 07/11/2012 | CN102569275A Stacking type semiconductor packaging structure and manufacturing method thereof |
| 07/11/2012 | CN102569274A Semiconductor package structure and manufacturing method thereof |
| 07/11/2012 | CN102569272A Multilayer spacer type IC (Integrated Circuit) chip stacked package of substrate and production method of package |
| 07/11/2012 | CN102569271A High-reliability high-power insulated gate bipolar transistor (IGBT) module |
| 07/11/2012 | CN102569270A Stacked Chip Packaging Structure, Synchronous Rectifying Module And Converter Module |
| 07/11/2012 | CN102569269A Semiconductor chip, stacked chip semiconductor package including the same, and fabricating method thereof |