Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
07/2012
07/17/2012US8222716 Multiple leadframe package
07/17/2012US8222713 Storage element and storage apparatus
07/17/2012US8222698 Bond pad with integrated transient over-voltage protection
07/17/2012US8222676 Transistor
07/17/2012US8222146 Semiconductor device with a line and method of fabrication thereof
07/17/2012US8222134 Self-aligned barrier layers for interconnects
07/17/2012US8222101 Method of fabricating a MOS transistor having a gate insulation layer with a lateral portion and a vertical portion
07/17/2012US8220718 Method for post-manufacturing data transfer to and from a sealed device
07/17/2012US8220147 Metal-containing resin particle, resin particle, electronic circuit substrate, and method of producing electronic circuit
07/17/2012US8220145 Isolated conformal shielding
07/17/2012CA2594715C Surface mount package fault detection apparatus
07/12/2012WO2012094582A1 Alternative surface finishes for flip-chip ball grid arrays
07/12/2012WO2012094273A2 Controlled impedance flex circuit
07/12/2012WO2012094111A1 Overhead-mounted heatsink
07/12/2012WO2012094085A1 Synthetic jet packaging
07/12/2012WO2012093910A2 Curable composition
07/12/2012WO2012093909A2 Curable composition
07/12/2012WO2012093908A2 Curable composition
07/12/2012WO2012093907A2 Curable composition
07/12/2012WO2012093820A2 Silicone resin composition for encapsulating an optical element
07/12/2012WO2012093690A1 Manufacturing method for electronic component module, and electronic component module
07/12/2012WO2012093591A1 Curable epoxy resin composition
07/12/2012WO2012093590A1 Curable epoxy resin composition
07/12/2012WO2012093589A1 Curable epoxy resin composition
07/12/2012WO2012093521A1 Semiconductor device and manufacturing method thereof
07/12/2012WO2012093510A1 Resin composition
07/12/2012WO2012093509A1 Semiconductor device and method of manufacturing thereof
07/12/2012WO2012092994A1 Electronic assembly with improved thermal management
07/12/2012WO2012092707A1 Continuous wire bonding
07/12/2012WO2012062300A3 Thick-wire bond arrangement and method for producing same
07/12/2012WO2012061381A3 Crack arrest vias for ic devices
07/12/2012WO2012058074A3 Thermal isolation in 3d chip stacks using gap structures and contactless communications
07/12/2012WO2012048137A3 Flexible circuits and methods for making the same
07/12/2012WO2011138684A4 Pick and bond method and apparatus for transferring adhesive element to substrate
07/12/2012US20120178239 Programmable semiconductor device
07/12/2012US20120176708 Esd protection devices and methods for forming esd protection devices
07/12/2012US20120176192 Self-Identifying Stacked Die Semiconductor Components
07/12/2012US20120176164 Circuit Arrangement Having a Load Transistor and a Voltage Limiting Circuit and Method for Driving a Load Transistor
07/12/2012US20120176149 Substrate and method for mounting semiconductor package
07/12/2012US20120175790 Composition for patternable adhesive film, patternable adhesive film, and method of manufacturing semiconductor package using the same
07/12/2012US20120175789 Alignment marks to enable 3d integration
07/12/2012US20120175788 Semiconductor device, semiconductor package, and method for manufacturing semiconductor device
07/12/2012US20120175787 Semiconductor package
07/12/2012US20120175786 Method of post-mold grinding a semiconductor package
07/12/2012US20120175785 Semiconductor device
07/12/2012US20120175784 Semiconductor Device and Method of Forming Vertical Interconnect Structure in Substrate for IPD and Baseband Circuit Separated by High-Resistivity Molding Compound
07/12/2012US20120175783 Semiconductor package having an internal cooling system
07/12/2012US20120175782 Semiconductor package and method of manufacturing the same
07/12/2012US20120175781 Semiconductor device and method for manufacturing semiconductor device
07/12/2012US20120175780 Semiconductor component and method of making the same
07/12/2012US20120175779 Semiconductor Device and Method of Forming Integrated Passive Device
07/12/2012US20120175778 Semiconductor device, wafer structure and fabrication method thereof
07/12/2012US20120175777 Device having conductive substrate via with catch-pad etch-stop
07/12/2012US20120175776 Electroless cu plating for enhanced self-forming barrier layers
07/12/2012US20120175775 Integrated circuit line with electromigration barriers
07/12/2012US20120175774 Warpage control features on the bottomside of tsv die lateral to protruding bottomside tips
07/12/2012US20120175773 Thermal Enhanced Package Using Embedded Substrate
07/12/2012US20120175772 Alternative surface finishes for flip-chip ball grid arrays
07/12/2012US20120175771 Semiconductor Device and Method of Forming No-Flow Underfill Material Around Vertical Interconnect Structure
07/12/2012US20120175770 Semiconductor Device and Method of Forming Conductive Pillars in Recessed Region of Peripheral Area around the Device for Electrical Interconnection to Other Devices
07/12/2012US20120175769 Semiconductor Device and Method of Dissipating Heat From Thin Package-on-Package Mounted to Substrate
07/12/2012US20120175768 Semiconductor device and method for manufacturing the same
07/12/2012US20120175767 Semiconductor package with through silicon vias and method for making the same
07/12/2012US20120175766 System and method of achieving mechanical and thermal stability in a multi-chip package
07/12/2012US20120175765 Semiconductor device
07/12/2012US20120175764 Method for the production of an electronic component and electronic component produced according to this method
07/12/2012US20120175763 Integrated circuit packaging including auxiliary circuitry
07/12/2012US20120175762 Semiconductor device and manufacturing method thereof
07/12/2012US20120175761 Semiconductor device
07/12/2012US20120175760 Leadframe, semiconductor device, and method of manufacturing the same
07/12/2012US20120175759 Wiring device for semiconductor device, composite wiring device for semiconductor device, and resin-sealed semiconductor device
07/12/2012US20120175758 Lead frame and semiconductor package including the same
07/12/2012US20120175757 Method of manufacturing semiconductor apparatus, the semiconductor apparatus, and ignitor using the semiconductor apparatus
07/12/2012US20120175756 Semiconductor packages having lead frames
07/12/2012US20120175755 Semiconductor device including a heat spreader
07/12/2012US20120175754 Wiring board
07/12/2012US20120175752 Devices with faraday cages and internal flexibility sipes
07/12/2012US20120175751 Deposition of group iv metal-containing films at high temperature
07/12/2012US20120175750 Geometry of contact sites at brittle inorganic layers in electronic devices
07/12/2012US20120175744 Copper electroplating composition
07/12/2012US20120175728 Seal ring structure for integrated circuit chips
07/12/2012US20120175727 Semiconductor device and fabrication method thereof
07/12/2012US20120175612 Test structure for determination of tsv depth
07/12/2012US20120175086 Heat transfer device and method of making same
07/12/2012US20120174972 Transparent conductive film and a device with the same
07/12/2012DE112009004338T5 Lösbare Bauelementbefestigung an einer Gehäuseunterseite Detachable component attachment to a housing bottom
07/12/2012DE102012200329A1 Halbleiteranordnung mit einem Heatspreader A semiconductor device comprising a heat spreader
07/12/2012DE102012200276A1 System und verfahren zum verhindern bipolarer parasitärer aktivierung in einer halbleiterschaltung System and method to prevent parasitic bipolar activation in a semiconductor circuit
07/12/2012DE102012200056A1 Halbleitervorrichtung und Verfahren zur Herstellung hiervon A semiconductor device and method thereof for the manufacture
07/12/2012DE102012100189A1 Halbleiterentladungsbauelemente und Herstellungsverfahren dafür Semiconductor discharge devices and manufacturing method thereof
07/12/2012DE102011056317A1 Halbleiter-ESD-Schaltung und Verfahren Semiconductor ESD circuit and method
07/12/2012DE102011055039A1 Halbleitervorrichtung und Herstellungsverfahren dafür A semiconductor device and manufacturing method thereof
07/12/2012DE102011010248B3 Method for manufacturing power semiconductor device e.g. insulated gate bipolar transistor, involves forming trenches partially filled with insulating material starting from side to side in regions of semiconductor structure
07/12/2012DE102011008261A1 Schiene für die elektrische Kontaktierung eines elektrisch leitfähigen Substrates Rail for the electrical contacting of an electrically conductive substrate
07/12/2012DE102011002538A1 Printed circuit board for mounting integrated circuit in ball grid array package used in electronic device, has solder bump that is embedded into plastic socket formed on contacting surface, in state exposing surface region of solder bump
07/12/2012DE102009002191B4 Leistungshalbleitermodul, Leistungshalbleitermodulanordnung und Verfahren zur Herstellung einer Leistungshalbleitermodulanordnung The power semiconductor module, the power semiconductor module assembly and method of manufacturing a power semiconductor module assembly
07/12/2012DE102005056263B4 Elektronische Anordnung mit äußeren Impedanzabgleichskomponentenverbindungen mit nichtkompensierten Anschlussleitungen und ihr Herstellungsverfahren Electronic device with external impedance matching components connections with uncompensated connection lines and its manufacturing method
07/12/2012DE102004031889B4 Halbleiterbauteil mit einem Gehäuse und einem teilweise in eine Kunststoffgehäusemasse eingebetteten Halbleiterchip und Verfahren zur Herstellung desselben Of the same semiconductor device having a housing and a partially embedded in a plastic housing compound semiconductor chip and method for producing
07/11/2012EP2475053A1 Wiring connection method and functional device
07/11/2012EP2475007A1 Rf-power device
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