Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
07/2012
07/18/2012CN102585228A Organic silicon electronic-pouring sealant with high refractive index and high transparency, as well as preparation and application thereof
07/18/2012CN102148222B Semiconductor structure and semiconductor packaging structure having proximity communication signal input ends
07/18/2012CN102095888B Heat-type wind-speed and wind-direction sensor with heat insulation structure and preparation method thereof
07/18/2012CN102065671B Method for combining evaporating ends of parallel heat pipes to fixed seat at same level
07/18/2012CN102034810B Array base plate and manufacturing method thereof
07/18/2012CN101989610B Integrated circuit, back side illuminated image sensor and front side illuminated image sensor
07/18/2012CN101989592B Packaging substrate as well as manufacturing method
07/18/2012CN101971353B Optoelectronic component and method for producing an optoelectronic component
07/18/2012CN101971327B Multilayer dielectric substrate, and semiconductor package
07/18/2012CN101960586B Process of grounding heat spreader/stiffener to a flip chip package using solder and film adhesive
07/18/2012CN101930929B Manufacturing method of packaging base plate provided with side surface lines
07/18/2012CN101924096B Through-silicon via structure and a process for forming the same
07/18/2012CN101911290B Semiconductor device and display apparatus
07/18/2012CN101897018B Semiconductor device and method for manufacturing the same
07/18/2012CN101894764B Semiconductor structure and manufacture method thereof
07/18/2012CN101894761B Substrate for open window type ball grid array package structure and manufacturing method thereof
07/18/2012CN101887194B Electrode equipment and detection method
07/18/2012CN101849276B Device and device manufacturing method
07/18/2012CN101839421B Sealed outdoor lighting lamp with LED light source module
07/18/2012CN101836289B Semiconductor device
07/18/2012CN101828435B Bump structure with multiple layers and method of manufacture
07/18/2012CN101819972B Gate to drain (gd) clamp and ESD protection circuit for power device breakdown protection
07/18/2012CN101814473B Mounting board and display device
07/18/2012CN101800211B 半导体装置 Semiconductor device
07/18/2012CN101800205B Semiconductor package and method of packaging the same
07/18/2012CN101790787B Electronic parts package, base for electronic parts package, and junction structure of electronic parts package and circuit substrate
07/18/2012CN101789032B Design method and structure thereof of physical layout of CUP weld pad zone
07/18/2012CN101778554B Radiating system
07/18/2012CN101771017B Base plate structure and semiconductor encapsulation structure comprising the same
07/18/2012CN101761796B 发光二极管灯具 LED lamp
07/18/2012CN101754578B Occluding circuit structure and forming method thereof
07/18/2012CN101681890B Inhibiting ic device damage from dicing and beol processing
07/18/2012CN101661910B Gallium nitride semiconductor substrate and blue luminescent device
07/18/2012CN101632168B Interposer and interposer manufacturing method
07/18/2012CN101610658B Heat dissipation device
07/18/2012CN101609836B Image sensor module and camera module
07/18/2012CN101609811B Method for manufacturing integrated circuit
07/18/2012CN101603672B Heat dissipation type light emitting diode (LED) street lamp
07/18/2012CN101581405B LED illuminator
07/18/2012CN101552265B Radiation image device
07/18/2012CN101546736B Semiconductor wafer, semiconductor device, and method of manufacturing semiconductor device
07/18/2012CN101542747B Heat dissipation system for photovoltaic array interconnection sytem
07/18/2012CN101510536B Semiconductor device and a method of manufacturing the semiconductor device
07/18/2012CN101499474B Semiconductor device
07/18/2012CN101484995B Chip module for complete power train
07/18/2012CN101399273B Image display system and fabrication method thereof
07/18/2012CN101399250B Semiconductor chip and semiconductor device having a plurality of semiconductor chips
07/18/2012CN101370870B Epoxy resin molding material for sealing and electronic component device
07/18/2012CN101365650B Bulk assembly of oriented carbon nanotube
07/18/2012CN101361186B Structure and method for making high density mosfet circuits with different height contact lines
07/18/2012CN101350345B 半导体器件 Semiconductor devices
07/18/2012CN101350316B Circuit device manufacturing method
07/18/2012CN101319090B Aryl(thio)ether aryl polysiloxane composition and methods for making and using same
07/18/2012CN101308855B Electrode assembly, electronic paper and liquid crystal display
07/18/2012CN101299425B Etched leadframe structure
07/18/2012CN101261977B Electronic device packages and methods of formation
07/18/2012CN101255321B Highly conductive composition for wafer coating
07/18/2012CN101189180B Thin package for a micro component
07/18/2012CN101154638B Semiconductor module, portable equipment and method for manufacturing semiconductor module
07/18/2012CN101106116B Semiconductor device and method of producing the same
07/18/2012CN101068015B Devices and methods for constructing electrically programmable integrated fuses for low power applications
07/17/2012US8225240 Semiconductor device
07/17/2012US8224413 Analyte monitoring device and methods of use
07/17/2012US8223488 Locking assembly for electronic tablet and other devices
07/17/2012US8222945 Semiconductor integrated circuit device
07/17/2012US8222801 Lamp and lamp holder module thereof
07/17/2012US8222752 Organopolysiloxane composition and semiconductor apparatus
07/17/2012US8222751 Electroconductive bonding material and electronic apparatus
07/17/2012US8222749 Wiring substrate and semiconductor device
07/17/2012US8222748 Packaged electronic devices having die attach regions with selective thin dielectric layer
07/17/2012US8222747 Multilayer wiring substrate mounted with electronic component and method for manufacturing the same
07/17/2012US8222746 Noble metal barrier layers
07/17/2012US8222745 Integrated heat sink
07/17/2012US8222744 Semiconductor device and manufacturing method of the semiconductor device
07/17/2012US8222743 Flash memory storage apparatus
07/17/2012US8222742 Semiconductor device
07/17/2012US8222741 Semiconductor module with current connection element
07/17/2012US8222740 Zinc oxide based composites and methods for their fabrication
07/17/2012US8222739 System to improve coreless package connections
07/17/2012US8222737 BGA semiconductor device having a dummy bump
07/17/2012US8222736 Semiconductor device with Al pad
07/17/2012US8222735 Semiconductor device and communication system using the semiconductor device
07/17/2012US8222734 Hybrid integrated circuit device and electronic device
07/17/2012US8222733 Semiconductor device package
07/17/2012US8222732 Heat spreader having single layer of diamond particles and associated methods
07/17/2012US8222731 Cut-out heat slug for integrated circuit device packaging
07/17/2012US8222730 Magnetic particle-based composite materials for semiconductor packages
07/17/2012US8222729 Electric power converter
07/17/2012US8222728 Active solid heatsink device and fabricating method thereof
07/17/2012US8222727 Conductive structures for microfeature devices and methods for fabricating microfeature devices
07/17/2012US8222726 Semiconductor device package having a jumper chip and method of fabricating the same
07/17/2012US8222725 Metal can impedance control structure
07/17/2012US8222724 Semiconductor element module and method for manufacturing the same
07/17/2012US8222723 Electric module having a conductive pattern layer
07/17/2012US8222722 Integrated circuit package and device
07/17/2012US8222721 Integrated circuit suitable for use in radio receivers
07/17/2012US8222720 Semiconductor device and manufacturing method thereof
07/17/2012US8222719 Quad flat no lead (QFN) integrated circuit (IC) package having a modified paddle and method for designing the package
07/17/2012US8222718 Semiconductor die package and method for making the same
07/17/2012US8222717 Embedded semiconductor die package and method of making the same using metal frame carrier
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