| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 07/18/2012 | EP2476773A1 Aluminium alloy material and method for preparing aluminium alloy back board |
| 07/18/2012 | EP2476301A1 System for thermally controlling an apparatus |
| 07/18/2012 | EP2476135A1 Semiconductor chip with stair arrangement bump structures |
| 07/18/2012 | EP2349915B1 Electrical contact configuration of micro-electromechanical component and fabrication method |
| 07/18/2012 | CN202340178U Novel cooling system for photovoltaic grid-connected inverter |
| 07/18/2012 | CN202339915U Single integrated circuit (IC) chip packaging part for copper wire bonding of dense-pitch small pads |
| 07/18/2012 | CN202339914U Close-pitch small-pad copper wire bonded dual-IC (integrated circuit) chip stack package |
| 07/18/2012 | CN202339913U Carrier-free grid array IC (integrated circuit) chip package |
| 07/18/2012 | CN202339912U Four-flat-edge pin-free package piece with two convex points |
| 07/18/2012 | CN202339911U Flat-four edge pin-free double-integrated circuit (IC) chip packaging piece with double salient points |
| 07/18/2012 | CN202339910U Quad flat non-leaded three-IC (Integrated Circuit)-chip packaging piece with double salient points |
| 07/18/2012 | CN202339909U 小型液冷散热器 Small liquid-cooled radiator |
| 07/18/2012 | CN1897247B Method for manufacturing semiconductor element |
| 07/18/2012 | CN1871671B Embedded toroidal inductors |
| 07/18/2012 | CN1812238B Low-voltage logical operation using higher voltage power supply electrical level |
| 07/18/2012 | CN102598883A Circuit board, and semiconductor device having component mounted on circuit board |
| 07/18/2012 | CN102598879A Device mounting structure and device mounting method |
| 07/18/2012 | CN102598439A Thermoelectric cooling apparatus of photonic integrated circuits |
| 07/18/2012 | CN102598262A 半导体装置和噪声抑制方法 Semiconductor device and method for noise suppression |
| 07/18/2012 | CN102598261A High impedance electrical connection via |
| 07/18/2012 | CN102598260A Electronic component device and package substrate |
| 07/18/2012 | CN102598259A Redistribution layer enhancement to improve reliability of wafer level packaging |
| 07/18/2012 | CN102598258A Multiple surface finishes for microelectronic package substrates |
| 07/18/2012 | CN102598257A Microelectronic package and method of manufacturing same |
| 07/18/2012 | CN102598256A Package configurations for low EMI circuits |
| 07/18/2012 | CN102598255A Stacked semiconductor device |
| 07/18/2012 | CN102598254A ESD/antenna diodes for through-silicon vias |
| 07/18/2012 | CN102598253A Heatsink, heatsink assembly, semiconductor module, and semiconductor device with cooling device |
| 07/18/2012 | CN102598252A Package structure, method for manufacturing same, and method for repairing package structure |
| 07/18/2012 | CN102598251A Microelectronic package and method of manufacturing same |
| 07/18/2012 | CN102598250A Element mounting substrate, method for manufacturing element mounting substrate, semiconductor module, and portable apparatus |
| 07/18/2012 | CN102598224A Etching liquid for etching silicon substrate rear surface in through silicon via process and method for manufacturing semiconductor chip having through silicon via using the etching liquid |
| 07/18/2012 | CN102597618A Improved light emitting diode (led) assembly and method of manufacturing the same |
| 07/18/2012 | CN102596487A Lead-free solder alloy, joining member and manufacturing method thereof, and electronic component |
| 07/18/2012 | CN102595847A Radiating device |
| 07/18/2012 | CN102593314A Heat dissipation substrate |
| 07/18/2012 | CN102593190A Diode |
| 07/18/2012 | CN102593117A Design method of chip pads |
| 07/18/2012 | CN102593112A High frequency voltage doubling rectifier module |
| 07/18/2012 | CN102593111A IGBT (insulated gate bipolar transistor) module and manufacturing method of IGBT module |
| 07/18/2012 | CN102593110A Laminated inverted chip packaging structure of ultra-fine spacing welding plates and bottom filling material preparation method |
| 07/18/2012 | CN102593108A 功率半导体封装结构及其制造方法 Power semiconductor package structure and method for manufacturing |
| 07/18/2012 | CN102593107A MOM (Metal-Oxidation layer-Metal) capacitor and manufacturing method thereof |
| 07/18/2012 | CN102593106A Protective device for preventing packaged sample from being damaged by static electricity |
| 07/18/2012 | CN102593105A Triggered enhanced polycrystalline diode and manufacturing method thereof |
| 07/18/2012 | CN102593104A Semiconductor package and fabrication method thereof |
| 07/18/2012 | CN102593103A Process control monitoring method of nanocrystalline deposition density, module thereof and manufacturing method thereof |
| 07/18/2012 | CN102593102A Semiconductor chip, stack-type semiconductor package, and method for manufacturing the same |
| 07/18/2012 | CN102593101A Monitoring structure for resistance values of lead-out holes of P type buried layer |
| 07/18/2012 | CN102593100A Substrate for electronic device and electronic device |
| 07/18/2012 | CN102593099A Series type integrated photovoltaic module and manufacturing method thereof |
| 07/18/2012 | CN102593098A Metal interconnection structure of integrated circuit and preparation method for metal interconnection structure |
| 07/18/2012 | CN102593097A Integrated circuit metal interconnecting structure and manufacture method thereof |
| 07/18/2012 | CN102593096A Forming metal-insulator-metal capacitors over a top metal layer |
| 07/18/2012 | CN102593095A Flexible display panel |
| 07/18/2012 | CN102593094A Chip package and method for forming the same |
| 07/18/2012 | CN102593093A Structure of lead frame in two-chip TO-220 packaging |
| 07/18/2012 | CN102593092A Lead frame |
| 07/18/2012 | CN102593091A Semiconductor module |
| 07/18/2012 | CN102593090A Lead frame package with die arranged on pedestal for lead isolation |
| 07/18/2012 | CN102593089A Connecting system for electrically connecting electronic devices |
| 07/18/2012 | CN102593088A Semiconductor chip, semiconductor structure using same and manufacturing method for semiconductor chip |
| 07/18/2012 | CN102593087A Mixed bonding structure for three-dimension integration and bonding method for mixed bonding structure |
| 07/18/2012 | CN102593086A Semiconductor device and method for manufacturing semiconductor device |
| 07/18/2012 | CN102593085A Chip packaging structure and chip packaging manufacturing process |
| 07/18/2012 | CN102593084A Radiating module and electronic device with same |
| 07/18/2012 | CN102593083A Radiating unit with hydrophilic compound thin film and method for depositing hydrophilic compound thin film |
| 07/18/2012 | CN102593082A Printed substrate unit and semiconductor package |
| 07/18/2012 | CN102593081A Semiconductor device including a heat spreader |
| 07/18/2012 | CN102593080A Heat radiation plate, semiconductor device and manufacturing method of heat radiation plate |
| 07/18/2012 | CN102593079A Chip packaging structure and chip packaging method |
| 07/18/2012 | CN102593078A Semiconductor device and manufacturing method thereof |
| 07/18/2012 | CN102593077A Liquid crystal polymer (LCP) encapsulating structure and manufacturing method thereof |
| 07/18/2012 | CN102593076A 半导体装置 Semiconductor device |
| 07/18/2012 | CN102593075A Insulation substrate, insulation circuit substrate, production methods of insulation substrate and insulation circuit substrate, and semiconductor device |
| 07/18/2012 | CN102593074A Substrate for power module, power module, and production method of substrate for power module |
| 07/18/2012 | CN102593073A Manufacturing method for substrate for power module, substrate for power module and power module |
| 07/18/2012 | CN102593072A Lid design for reliability enhancement in flip package |
| 07/18/2012 | CN102593071A Packaging structure of power tube of welding machine |
| 07/18/2012 | CN102593070A Semiconductor chip and method for fabricating the same |
| 07/18/2012 | CN102593069A Joint sheet structure and integrated circuit chip |
| 07/18/2012 | CN102593068A Oblique-conic-shaped bump structure |
| 07/18/2012 | CN102593067A Interconnection structure for LGA (Land grid array) packaging with controllable welding spot height and manufacturing method of interconnection structure |
| 07/18/2012 | CN102593046A Method for fabricating a semiconductor device package |
| 07/18/2012 | CN102593023A Bulge encapsulating structure and bulge encapsulating method |
| 07/18/2012 | CN102593021A Heat conduction for chip stacks and 3-D circuits |
| 07/18/2012 | CN102593020A Method of manufacturing semiconductor apparatus, the semiconductor apparatus, and ignitor using the semiconductor apparatus |
| 07/18/2012 | CN102593018A Packaging method for wafer-level semiconductor chip and semiconductor chip packaging body |
| 07/18/2012 | CN102593017A Process for producing antioxidative metal layers on side surfaces of connecting parts on support plates |
| 07/18/2012 | CN102593014A Multilayer encapsulating process and encapsulating structure of light-emitting diode (LED) driver |
| 07/18/2012 | CN102593009A Method for producing substrate for power module, substrate for power module and power module |
| 07/18/2012 | CN102592830A Lead frame and electronic element having lead frame and manufacturing method of it |
| 07/18/2012 | CN102592700A Composite silver wire |
| 07/18/2012 | CN102590579A DI/dT current sensing |
| 07/18/2012 | CN102588346A Air-guiding device and radiating module provided with air-guiding device |
| 07/18/2012 | CN102585760A Resin composition and semiconductor devices made by using the same |
| 07/18/2012 | CN102585709A Adhesive composition, film-like adhesive and connection structure for circuit member |
| 07/18/2012 | CN102585512A Resin for transparent encapsulation material, and associated encapsulation material and electronic device |
| 07/18/2012 | CN102585445A Plastic packaging material for preparing green and environment-friendly diode and injection moulding method |
| 07/18/2012 | CN102585438A Epoxy resin composition for encapsulation and electronic component device |