Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
07/2012
07/24/2012US8227860 System for vertical DMOS with slots
07/24/2012US8227839 Integrated circuit having TSVS including hillock suppression
07/24/2012US8227837 Semiconductor device and display device
07/24/2012US8227814 Semiconductor device and manufacturing method thereof, and camera module including the same
07/24/2012US8227806 Active matrix display in which LDD regions in the driver circuit and the storage capacitor in the pixel section have the same dopant concentration
07/24/2012US8227337 Semiconductor device having metal wirings of laminated structure
07/24/2012US8227336 Structure with self aligned resist layer on an interconnect surface and method of making same
07/24/2012US8227335 Forming a copper diffusion barrier
07/24/2012US8227331 Method for depositing a solder material on a substrate
07/24/2012US8227301 Semiconductor device structures with floating body charge storage and methods for forming such semiconductor device structures
07/24/2012US8226558 Analyte monitoring device and methods of use
07/24/2012US8226557 Analyte monitoring device and methods of use
07/24/2012US8226555 Analyte monitoring device and methods of use
07/24/2012US8225499 Method for manufacturing a circuit board structure, and a circuit board structure
07/23/2012DE202012002974U1 Fluid-Wärmetauschsysteme Fluid heat exchange systems
07/19/2012WO2012096774A1 Method of transferring and electrically joining a high density multilevel thin film to a circuitized and flexible organic substrate and associated devices
07/19/2012WO2012096765A1 Method of making an electronic device having a liquid crystal polymer solder mask laminated to an interconnect layer stack and related devices
07/19/2012WO2012096763A1 Method of making an electronic device having a liquid crystal polymer solder mask and related devices
07/19/2012WO2012096277A1 Resin sealed module
07/19/2012WO2012096112A1 Semiconductor device
07/19/2012WO2012095950A1 Cooler
07/19/2012WO2012095907A1 Semiconductor device and product employing flip-chip mounting
07/19/2012WO2012095903A1 Light emitting device, light emitting module, and method for manufacturing light emitting device
07/19/2012WO2012095757A1 Reversibly adhesive thermal interface material
07/19/2012WO2012074783A3 Low-profile microelectronic package, method of manufacturing same, and electronic assembly containing same
07/19/2012WO2012051133A3 Vertical semiconductor device with thinned substrate
07/19/2012WO2012040711A3 Self referencing pin
07/19/2012US20120184097 Reduced Number of Masks for IC Device with Stacked Contact Levels
07/19/2012US20120184071 Surface coating method, semiconductor device, and circuit board package
07/19/2012US20120182651 Shared Electrostatic Discharge Protection For Integrated Circuits, Integrated Circuit Assemblies And Methods For Protecting Input/Output Circuits
07/19/2012US20120182033 Die testing using top surface test pads
07/19/2012US20120181996 Multi chip module, method for operating the same and dc/dc converter
07/19/2012US20120181874 Semiconductor Device and Method of Manufacture Thereof
07/19/2012US20120181710 Semiconductor Chip and Method for Fabricating the Same
07/19/2012US20120181709 Photosensitive adhesive composition, photosensitive adhesive sheet, and semiconductor device using the same
07/19/2012US20120181708 Substrate for mounting semiconductor, semiconductor device and method for manufacturing semiconductor device
07/19/2012US20120181707 Distributed Metal Routing
07/19/2012US20120181706 Power semiconductor package structure and manufacturing method thereof
07/19/2012US20120181705 Pitch division patterning techniques
07/19/2012US20120181704 Semiconductor module with micro-buffers
07/19/2012US20120181703 Patternable adhesive composition, semiconductor package using the same, and method of manufacturing semiconductor package
07/19/2012US20120181702 Photosensitive adhesive composition having alkali soluble epoxy resin, and patternable adhesive film using the same
07/19/2012US20120181701 Multilayer Connection Structure and Making Method
07/19/2012US20120181700 Integrated circuit and design structure having reduced through silicon via-induced stress
07/19/2012US20120181699 Semiconductor Structure and Manufacturing Method of the Same
07/19/2012US20120181698 Forming through-silicon-vias for multi-wafer integrated circuits
07/19/2012US20120181697 Method to control metal semiconductor micro-structure
07/19/2012US20120181696 Package carrier and manufacturing method thereof
07/19/2012US20120181695 Semiconductor device and method for manufacturing the same
07/19/2012US20120181694 Semiconductor device and manufacturing method thereof
07/19/2012US20120181693 Semiconductor device and method of forming the same
07/19/2012US20120181692 Hybrid contact structure with low aspect ratio contacts in a semiconductor device
07/19/2012US20120181691 Package structure, packaging substrate and chip
07/19/2012US20120181690 Semiconductor Device Having Vertically Offset Bond on Trace Interconnects on Recessed and Raised Bond Fingers
07/19/2012US20120181689 Semiconductor Device and Method of Forming Bond Wires and Stud Bumps in Recessed Region of Peripheral Area around the Device for Electrical Interconnection to Other Devices
07/19/2012US20120181688 Packaging substrate with conductive structure
07/19/2012US20120181687 Materials, structures and methods for microelectronic packaging
07/19/2012US20120181686 Method of preparing semiconductor package and semiconductor die for semiconductor package
07/19/2012US20120181685 Semiconductor device
07/19/2012US20120181684 Semiconductor Structure and Method for Manufacturing the Same
07/19/2012US20120181682 Semiconductor device
07/19/2012US20120181681 Stacked Half-Bridge Package with a Current Carrying Layer
07/19/2012US20120181680 Ic package and method for manufacturing the same
07/19/2012US20120181679 Semiconductor module
07/19/2012US20120181678 Leadless chip carrier having improved mountability
07/19/2012US20120181677 Semiconductor device package with two component lead frame
07/19/2012US20120181676 Power semiconductor device packaging
07/19/2012US20120181675 Semiconductor die package and method for making the same
07/19/2012US20120181674 Stacked Half-Bridge Package with a Common Conductive Leadframe
07/19/2012US20120181673 Semiconductor Device and Method of Stacking Die on Leadframe Electrically Connected by Conductive Pillars
07/19/2012US20120181672 Chip package and method for forming the same
07/19/2012US20120181671 Method for evaluating impurity distribution under gate electrode without damaging silicon substrate
07/19/2012US20120181670 Semiconductor device having seal wiring
07/19/2012US20120181669 Frame cell for shot layout flexibility
07/19/2012US20120181648 Apparatus and methods for constructing semiconductor chip packages with silicon space transformer carriers
07/19/2012US20120181636 Printing of Contact Metal and Interconnect Metal Via Seed Printing and Plating
07/19/2012US20120181535 Photoelectric conversion module and method of manufacturing the same
07/19/2012US20120181078 Multilayer printed wiring board
07/19/2012US20120180949 Microelectromechanical Device Packages with Integral Heaters
07/19/2012DE112007000829B4 Anordnung aus Wechselrichter und Kühler und ihre Verwendung Arrangement of inverter and coolers and their use
07/19/2012DE10351012B4 Sensor mit aus Harz geformtem Gehäuse und Verfahren zur Herstellung desselben The same sensor housing with molded resin and methods for preparing
07/19/2012DE102012100231A1 Halbleiterchip und Verfahren zu seiner Herstellung Semiconductor chip and process for its preparation
07/19/2012DE102012100137A1 Halbleitermodul Semiconductor module
07/19/2012DE102011088442A1 Semiconductor device for power converter, has protective element made of polar resin material that is arranged in region surrounding semiconductor chip at main surface of heat spreader
07/19/2012DE102011008952A1 Mehrchipmodul, Verfahren zum Betreiben desselben und DC/DC-Wandler A multi-chip module and method thereof for operating DC / DC converter
07/19/2012DE102011002857A1 Halbleiterbauelement mit einem BiLDMOS- oder SOI-BiLDMOS- Transistor, sowie Kaskodenschaltung Semiconductor component with a BiLDMOS- or SOI transistor BiLDMOS-, and cascode
07/19/2012DE102011000455A1 Anordnen und Verfahren zum Kühlen eines Trägers Arranging and method for cooling a wearer
07/19/2012DE102007025248B4 Elektronisches Bauelement, das mindestens zwei Halbleiterleistungsbauteile aufweist und Verfahren zu dessen Herstellung An electronic component having at least two semiconductor power components and process for its preparation
07/18/2012EP2477466A2 Method of manufacturing a package for embedding one ore more electronic components
07/18/2012EP2477224A2 Die attach composition for silicon chip placement on a flat substrate having improved thixotropic properties
07/18/2012EP2477223A2 Method of manufacturing semiconductor apparatus, the semiconductor apparatus, and ignitor using the semiconductor apparatus
07/18/2012EP2477222A2 Stacked half-bridge package with a current carrying layer
07/18/2012EP2477221A2 Stacked half-bridge package with a common conductive leadframe
07/18/2012EP2477220A2 Stacked half-bridge package with a common conductive clip
07/18/2012EP2477219A2 Semiconductor device and method for manufacturing semiconductor device
07/18/2012EP2477218A2 Double-sided substrate, semiconductor device and method for the same
07/18/2012EP2477217A1 Method for producing substrate for power module with heat sink, substrate for power module with heat sink, and power module
07/18/2012EP2477215A2 Resin composition, embedding material, insulating layer and semiconductor device
07/18/2012EP2477213A1 Semiconductor device and process for production of semiconductor device
07/18/2012EP2477171A1 Active matrix substrate and display device
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