Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
07/2012
07/25/2012CN102610495A Manufacturing method of semiconductor resistor, semiconductor resistor and electronic device
07/25/2012CN102610494A Method for marking wafer, wafer with mark
07/25/2012CN102608777A COF (chip on film) packaging unit and COF packaging winding tape
07/25/2012CN102605359A Structure of electrolessly palladium and gold plated films and process for making the same, assembled structure of palladium and gold plated films bonded with copper or copper-palladium wire and assembling process therefore
07/25/2012CN102604592A Resin composition and semiconductor devices made by using the same
07/25/2012CN102604591A Resin composition and semiconductor devices made by using the same
07/25/2012CN102604559A Connecting material and semiconductor device
07/25/2012CN102604475A Radiation-curable ink for ink jet recording, record made using the same, and ink jet recording method using the same
07/25/2012CN102604326A Semiconductor-encapsulating liquid epoxy resin composition and semiconductor device
07/25/2012CN102184901B Preparation method of porous core with gradient composite structure
07/25/2012CN102122670B Groove-interconnected wafer level MOSFET encapsulation structure and implementation method
07/25/2012CN102097287B Method for monitoring chip groove depth and wafer
07/25/2012CN102088035B Trench MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor) side wall structure and manufacturing method thereof
07/25/2012CN102074516B Semiconductor device packages and methods for manufacturing the same
07/25/2012CN102054838B Bidirectional thyristor and electrostatic protection circuit
07/25/2012CN102054814B Non-core layer package substrate and manufacturing method thereof
07/25/2012CN102034793B Relay board and semiconductor device having the relay board
07/25/2012CN102034769B Circuit board and semiconductor module
07/25/2012CN102031546B Electroplating method for lead frame
07/25/2012CN102024883B Preparation method of light-emitting diode radiating substrate
07/25/2012CN102024782B Three-dimensional vertical interconnecting structure and manufacturing method thereof
07/25/2012CN102024774B Contact pad
07/25/2012CN102024767B Wafer edge film structure and formation method thereof
07/25/2012CN102002209B Bottom filling glue for packaging inverted chip type semiconductor
07/25/2012CN101986775B Large-power radiating module
07/25/2012CN101976663B Substrate-free chip size package structure of face down chip
07/25/2012CN101976662B Output-end fan-out type flip-chip packaging structure without baseplate
07/25/2012CN101969063B Pixel array substrate, conducting structure and display panel
07/25/2012CN101965097B Printed circuit board and its manufacture method
07/25/2012CN101964337B Semiconductor encapsulation structure and manufacturing method thereof
07/25/2012CN101937916B Semiconductor device
07/25/2012CN101937884B Semiconductor packaging member
07/25/2012CN101924090B 半导体封装元件及其制造方法 The semiconductor package device and a method of manufacturing
07/25/2012CN101908527B Reverse interleaved stack structure of integrated circuit module
07/25/2012CN101908511B Gallium nitride schottky rectifier with metal substrate and production method thereof
07/25/2012CN101903974B Method for manufacturing thin film multilayer device, method for manufacturing display device
07/25/2012CN101894823B Composite material structure, circuit board structure comprising same and forming method thereof
07/25/2012CN101894819B Substrate structure
07/25/2012CN101887887B 3d integration structure and method using bonded metal planes
07/25/2012CN101887859B Method for forming through holes on base material and base material with through holes
07/25/2012CN101882611B 集成电路芯片 IC chip
07/25/2012CN101878523B Method and device for cutting substrate
07/25/2012CN101877336B Integrated circuit structure and method for forming the same
07/25/2012CN101877335B Gradient type anisotropic conductive film and manufacturing method thereof
07/25/2012CN101866898B Metal wiring structures for uniform current density in C4 balls
07/25/2012CN101847638B Active component array substrate and liquid crystal display panel
07/25/2012CN101836290B Three-dimensional die stacks with inter-device and intra-device optical interconnect
07/25/2012CN101834170B Chip structure capable of suppressing outside high-frequency noise
07/25/2012CN101814478B An Image sensing device and a making method with the same
07/25/2012CN101808478B Plug hole BGA screen and plug hole method of printed circuit board
07/25/2012CN101794715B Marking method for semiconductor device and semiconductor device provided with markings
07/25/2012CN101730440B Heat radiating system
07/25/2012CN101728376B Method of fabricating organic electroluminescent device
07/25/2012CN101662919B Radiating device
07/25/2012CN101592327B Power type LED lamp, encapsulation process and reflow soldering process equipment thereof
07/25/2012CN101587875B Chip structure, three-dimensional stacked chip packaging structure and manufacturing method thereof
07/25/2012CN101553911B Electronic device and lead frame
07/25/2012CN101515580B SiCN medium diffusion barrier film for copper interconnection and preparation process thereof
07/25/2012CN101500397B Fastening structure for radiator
07/25/2012CN101471340B Semiconductor integrated circuit
07/25/2012CN101466230B Radiating device
07/25/2012CN101425484B Nitride semiconductor free-standing substrate and device using the same
07/25/2012CN101194360B Interposer and semiconductor device
07/25/2012CN101031518B Glass for semiconductor sealing, sheath tube for semiconductor sealing and semiconductor electronic part
07/25/2012CN101009311B Organic light emitting display and method of fabricating the same
07/24/2012USRE43536 Stackable layer containing ball grid array package
07/24/2012US8228682 Electronic assembly with trenches for underfill material
07/24/2012US8228671 Electronic apparatus including a cooling unit and a wall member
07/24/2012US8228158 Semiconductor device
07/24/2012US8228080 Device and method for current estimation
07/24/2012US8227927 Chip package and fabrication method thereof
07/24/2012US8227926 Routing layer for mitigating stress in a semiconductor die
07/24/2012US8227925 Integrated circuit packaging system with interposer
07/24/2012US8227924 Substrate stand-offs for semiconductor devices
07/24/2012US8227923 Interconnect structure to reduce stress induced voiding effect
07/24/2012US8227922 Semiconductor device having a multilayer interconnection structure that includes an etching stopper film
07/24/2012US8227921 Semiconductor package with increased I/O density and method of making same
07/24/2012US8227920 Semiconductor device and method for fabricating the same
07/24/2012US8227918 Robust FBEOL and UBM structure of C4 interconnects
07/24/2012US8227917 Bond pad design for fine pitch wire bonding
07/24/2012US8227916 Package structure and method for reducing dielectric layer delamination
07/24/2012US8227915 Bump structure, chip package structure including the same and method of manufacturing the same
07/24/2012US8227914 Mounting structure of electronic component
07/24/2012US8227913 Power semiconductor module comprising elastic housing for accommodating movement of individual substrate regions on a heat sink
07/24/2012US8227912 Semiconductor device with Cu metal-base and manufacturing method thereof
07/24/2012US8227911 Method and structure of wafer level encapsulation of integrated circuits with cavity
07/24/2012US8227910 Apparatus for thermally enhanced semiconductor package
07/24/2012US8227909 Semiconductor package and method of manufacturing the same
07/24/2012US8227908 Electronic device having contact elements with a specified cross section and manufacturing thereof
07/24/2012US8227907 Flexible interconnect pattern on semiconductor package
07/24/2012US8227906 Transistor array, manufacturing method thereof and image processor
07/24/2012US8227905 Stackable semiconductor package
07/24/2012US8227904 Multi-chip package and method of providing die-to-die interconnects in same
07/24/2012US8227903 Integrated circuit packaging system with encapsulant containment and method of manufacture thereof
07/24/2012US8227902 Structures for preventing cross-talk between through-silicon vias and integrated circuits
07/24/2012US8227900 Semiconductor device
07/24/2012US8227899 Alignment for backside illumination sensor
07/24/2012US8227892 Multi-track integrated circuit inductor
07/24/2012US8227888 Semiconductor component with countersignal circuit for preventing crosstalk between electronic assemblies
07/24/2012US8227877 Semiconductor bio-sensors and methods of manufacturing the same
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